An adhesive composition, including at least polymer containing silane groups, between 15 and 35 wt.-% of at least one polymeric plasiticzer, between 0.5 and 2.5 wt.-% of at least one monomeric or oligomeric aminofunctional alkoxysilane S1 with a nitrogen content of between 4.5 and 14.5 wt.-%, and between 0.5 and 2.5 wt.-% of at least one oligomeric aminofunctional alkoxysilane S2 with a nitrogen content of between 15 and 20 wt.-%. The adhesive composition is particularly suitable to seal or bond thermoplastic substrates, such as polyolefins or bituminous materials, and shows fast adhesion build-up and low volatile organic carbon (VOC).

The invention includes a method of bonding a perfluoroelastomer material to first surface that includes: (a) contacting a first surface with a bonding agent comprising a curable perfluoropolymer and a curing agent; (b) curing the bonding agent to form a perfluoroelastomer material that is bonded to the first surface. In the practice of such method, the bonding agent may be a solution prepared by dissolving the curable perfluoroelastomer and the curing agent in a solvent. In an embodiment of the invention, the perfluoroelastomer material formed in step (b) is a coating layer or, alternatively, the first surface is a surface of a perfluoroelastomer member and the perfluoroelastomer material formed is a perfluoroelastomer weld.

The invention includes a method of bonding a perfluoroelastomer material to first surface that includes: (a) contacting a first surface with a bonding agent comprising a curable perfluoropolymer and a curing agent; (b) curing the bonding agent to form a perfluoroelastomer material that is bonded to the first surface. In the practice of such method, the bonding agent may be a solution prepared by dissolving the curable perfluoroelastomer and the curing agent in a solvent. In an embodiment of the invention, the perfluoroelastomer material formed in step (b) is a coating layer or, alternatively, the first surface is a surface of a perfluoroelastomer member and the perfluoroelastomer material formed is a perfluoroelastomer weld.

A coated polymer film, such as a coated polyester film, is disclosed. In one embodiment, the coated film may be used as a substrate for digital printing. In one embodiment, the coating contains an anionic anti-static agent comprising a sulphonated copolyester resin. In an alternative embodiment, the coating contains an anti-static agent comprising an organometallic, such as an organo zirconate, in combination with metal oxide particles. The metal oxide particles may comprise nanoparticles. In one embodiment, the coating can further contain a print enhancing agent and an adhesion promoter.

A coated polymer film, such as a coated polyester film, is disclosed. In one embodiment, the coated film may be used as a substrate for digital printing. In one embodiment, the coating contains an anionic anti-static agent comprising a sulphonated copolyester resin. In an alternative embodiment, the coating contains an anti-static agent comprising an organometallic, such as an organo zirconate, in combination with metal oxide particles. The metal oxide particles may comprise nanoparticles. In one embodiment, the coating can further contain a print enhancing agent and an adhesion promoter.

Disclosed is a polymer-metal junction including a polymer composition in contact with a metal substrate, where the polymer composition comprises a polymer component including a PEEK-PEDEK copolymer having a PEEK/PEDEK mole ratio ranging from about 60/40 to about 30/70 and a melting point (Tm) greater than 320° C., and where the polymer composition includes less than 10 wt. % of a sulfur-or-carbonyl-containing solvent, based on the total weight of the polymer composition. Also disclosed are methods of making the polymer-metal junction and articles including the polymer-metal junction.

Disclosed is a polymer-metal junction including a polymer composition in contact with a metal substrate, where the polymer composition comprises a polymer component including a PEEK-PEDEK copolymer having a PEEK/PEDEK mole ratio ranging from about 60/40 to about 30/70 and a melting point (Tm) greater than 320° C., and where the polymer composition includes less than 10 wt. % of a sulfur-or-carbonyl-containing solvent, based on the total weight of the polymer composition. Also disclosed are methods of making the polymer-metal junction and articles including the polymer-metal junction.

Disclosed is a polymer-metal junction including a polymer composition in contact with a metal substrate, where the polymer composition comprises a polymer component including a PEEK-PEDEK copolymer having a PEEK/PEDEK mole ratio ranging from about 60/40 to about 30/70 and a melting point (Tm) greater than 320° C., and where the polymer composition includes less than 10 wt. % of a sulfur-or-carbonyl-containing solvent, based on the total weight of the polymer composition. Also disclosed are methods of making the polymer-metal junction and articles including the polymer-metal junction.

A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.

A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.