A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.

A moisture curable, non-bitumen based and non-asphaltic based adhesive includes an extender, a compatibilizer, and a polymer, wherein the polymer includes reactive silyl groups.

A moisture curable, non-bitumen based and non-asphaltic based adhesive includes an extender, a compatibilizer, and a polymer, wherein the polymer includes reactive silyl groups.

The invention includes a method of bonding a perfluoroelastomer material to first surface that includes: (a) contacting a first surface with a bonding agent comprising a curable perfluoropolymer and a curing agent; (b) curing the bonding agent to form a perfluoroelastomer material that is bonded to the first surface. In the practice of such method, the bonding agent may be a solution prepared by dissolving the curable perfluoroelastomer and the curing agent in a solvent. In an embodiment of the invention, the perfluoroelastomer material formed in step (b) is a coating layer or, alternatively, the first surface is a surface of a perfluoroelastomer member and the perfluoroelastomer material formed is a perfluoroelastomer weld.

The invention includes a method of bonding a perfluoroelastomer material to first surface that includes: (a) contacting a first surface with a bonding agent comprising a curable perfluoropolymer and a curing agent; (b) curing the bonding agent to form a perfluoroelastomer material that is bonded to the first surface. In the practice of such method, the bonding agent may be a solution prepared by dissolving the curable perfluoroelastomer and the curing agent in a solvent. In an embodiment of the invention, the perfluoroelastomer material formed in step (b) is a coating layer or, alternatively, the first surface is a surface of a perfluoroelastomer member and the perfluoroelastomer material formed is a perfluoroelastomer weld.

A sheet-shaped stretchable structure including stretchable resin sheets laminated together is provided. A conductive layer may be disposed at least at one of several positions. For example, the conductive layer may be disposed between any two adjacent ones of the laminated stretchable resin sheets. The conductive layer may be disposed on a top surface of an uppermost one of the laminated stretchable resin sheets. Further, the conductive layer may be disposed on a bottom surface of a lowermost one of the laminated stretchable resin sheets, and a via hole.

A sheet-shaped stretchable structure including stretchable resin sheets laminated together is provided. A conductive layer may be disposed at least at one of several positions. For example, the conductive layer may be disposed between any two adjacent ones of the laminated stretchable resin sheets. The conductive layer may be disposed on a top surface of an uppermost one of the laminated stretchable resin sheets. Further, the conductive layer may be disposed on a bottom surface of a lowermost one of the laminated stretchable resin sheets, and a via hole.

The purpose of the present invention is to provide a thermally conductive moisture-curable resin composition which develops excellent thermal conductivity and peelability after curing.

The thermally conductive moisture-curable resin composition contains the following components (A) to (C): component (A): an organic polymer containing two or more hydrolyzable silyl groups; component (B): a thermally conductive filler; and component (C): a silicone compound having a polar group and/or a polar chain at a terminal or a side chain.

The purpose of the present invention is to provide a thermally conductive moisture-curable resin composition which develops excellent thermal conductivity and peelability after curing.

The thermally conductive moisture-curable resin composition contains the following components (A) to (C): component (A): an organic polymer containing two or more hydrolyzable silyl groups; component (B): a thermally conductive filler; and component (C): a silicone compound having a polar group and/or a polar chain at a terminal or a side chain.

A moisture curable, non-bitumen based and non-asphaltic based adhesive includes an extender, a compatibilizer, and a polymer, wherein the polymer includes reactive silyl groups.