C09J171/00

BIS-PRIMARY AMINES AS CROSS-LINKERS FOR THE CURING OF ACETOACETYLATED RESIN COMPOSITIONS

This invention provides a composition comprising I. a first component comprising at least one resin having two or more functional groups selected from the group consisting of -ketoester and malonate functional groups, and II. a second component having at least one or at least two primary amine functional groups.

CURABLE COMPOSITIONS COMPRISING ACETOACETYLATED RESINS, ALDEHYDES AND CERTAIN AMINES

This invention relates to a curable composition comprising: comprising: I. a first component comprising a resin having at least one functional group selected from the group consisting of -ketoester and malonate functional groups, II. a second component comprising at least one curing agent having at least one aldehyde functional group, and III. a third component comprising at least one primary amine or at least one secondary amine, salts thereof, or combinations thereof.

CURABLE ACETOACETYLATED RESIN COMPOSITIONS COMPRISING ALDEHYDES AND CERTAIN BASIC CATALYSTS

This invention relates to a curable adhesive composition comprising: I. Component (I) comprising at least one amorphous or semi-crystalline polyester or at least one polyether or combinations thereof having at least one or at least two functional groups selected from the group consisting of -ketoester and malonate functional groups, II. Component (II) comprising at least one or at least two aldehyde functional groups or isomers thereof, and III. Component (III) comprising at least one basic catalyst, salts thereof, or combinations thereof.

CURABLE ACETOACETYLATED RESIN COMPOSITIONS COMPRISING ALDEHYDES AND CERTAIN BASIC CATALYSTS

This invention relates to a curable adhesive composition comprising: I. Component (I) comprising at least one amorphous or semi-crystalline polyester or at least one polyether or combinations thereof having at least one or at least two functional groups selected from the group consisting of -ketoester and malonate functional groups, II. Component (II) comprising at least one or at least two aldehyde functional groups or isomers thereof, and III. Component (III) comprising at least one basic catalyst, salts thereof, or combinations thereof.

FLEXIBLE SUBSTRATES COMPRISING CURABLE COMPOSITIONS CONTAINING ACETOACETYLATED RESINS

This invention relates to an article of manufacture comprising at least one flexible substrate coated with at least one curable composition comprising: I. a first component (I) comprising at least one resin having at least one functional group selected from the group consisting of -ketoester and malonate functional groups, II. a second component (II) comprising at least one curing agent having at least one aldehyde functional group, and III. a third component (III) comprising at least one compound having amine functionality, salts thereof, or combinations thereof.

Workpiece treating method, semiconductor device, process for manufacturing the same, and temporary fixing composition for shear peeling

A workpiece treating method includes a step (1) of forming a stack including a support, a temporary fixing material and a workpiece wherein the material includes a layer containing a polymer (A) in a range of not less than 50 mass %, the polymer (A) including a structural unit represented by the formula (A1), and the workpiece is held on the material; a step (2) of processing the workpiece and/or transporting the stack; and a step (3) of applying a shear force to the material to thereby separate the workpiece from the support. ##STR00001## R.sup.1 is a divalent organic group including at least one aromatic ring, each of two oxygen atoms bonded to R.sup.1 in (A1) is bonded to the aromatic ring, and, when R.sup.1 includes two or more aromatic rings, each of the two oxygen atoms is bonded to any one of the aromatic rings.

Workpiece treating method, semiconductor device, process for manufacturing the same, and temporary fixing composition for shear peeling

A workpiece treating method includes a step (1) of forming a stack including a support, a temporary fixing material and a workpiece wherein the material includes a layer containing a polymer (A) in a range of not less than 50 mass %, the polymer (A) including a structural unit represented by the formula (A1), and the workpiece is held on the material; a step (2) of processing the workpiece and/or transporting the stack; and a step (3) of applying a shear force to the material to thereby separate the workpiece from the support. ##STR00001## R.sup.1 is a divalent organic group including at least one aromatic ring, each of two oxygen atoms bonded to R.sup.1 in (A1) is bonded to the aromatic ring, and, when R.sup.1 includes two or more aromatic rings, each of the two oxygen atoms is bonded to any one of the aromatic rings.

LACTIDE COPOLYMERS AND RING-OPENED LACTIDE COPOLYMERS

An article of manufacture. The article of manufacture includes a ring-opened lactide copolymer. The ring-opened lactide copolymer is formed in a process that includes reacting a functionalized lactide monomer with a BPA-derived monomer. The reaction forms a lactide copolymer, which is reacted to form the ring-opened lactide copolymer.

LACTIDE COPOLYMERS AND RING-OPENED LACTIDE COPOLYMERS

An article of manufacture. The article of manufacture includes a ring-opened lactide copolymer. The ring-opened lactide copolymer is formed in a process that includes reacting a functionalized lactide monomer with a BPA-derived monomer. The reaction forms a lactide copolymer, which is reacted to form the ring-opened lactide copolymer.

Adhesive-attached copper foil, copper-clad laminate, and wiring substrate
10660213 · 2020-05-19 · ·

There are provided a wiring substrate having a low dielectric constant and a low dielectric loss tangent, and an adhesive-attached copper foil and a copper-clad laminate that are suitable for manufacture of the wiring substrate and have improved adhesiveness to a copper foil. An adhesive-attached copper foil includes: a copper foil on one surface; and an adhesive layer provided on one surface of the copper foil, in which this copper foil has a roughened surface that is surface-treated by methacrylic silane, acrylic silane, or isocyanurate silane, and the adhesive layer is formed on the roughened surface and is made of a resin composition containing, as a main component thereof, modified polyphenylene ether resulting from modification of a hydroxyl group present at the end of the main chain with an ethylenically unsaturated compound.