Flexible films comprise an adhesive layer and a fibrous supporting layer and the thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates where they can reduce the formation of galvanic corrosion.

Flexible films comprise an adhesive layer and a fibrous supporting layer and the thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates where they can reduce the formation of galvanic corrosion.

Flexible films of thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates.

Flexible films of thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates.

The invention relates to an adhesive film that can be wound and stamped, having an epoxy-based adhesive compound that can be activated by UV radiation, characterized in that the adhesive compound comprises: a) 2-40 wt % of film former, b) 10-70 wt % of aromatic epoxy resins, c) cycloaliphatic epoxy resins, the cycloaliphatic epoxy resins not exceeding 35 wt %, d) 0.5-7 wt % of cationic initiators, e) 0-50 wt % of epoxy-enhanced polyether compounds, and f) 0-20 wt % of polyol, the proportions adding up to 100%, and the adhesive compound having an open time of 10 seconds to 60 minutes after the UV activation, during which open time the film has a pressure-sensitive adhesive characteristic.

A bond adhesive composition comprising a polymer having a silicon-containing hydrolyzable terminal group and a hydrocarbon resin, where the composition is substantially devoid of phenolic resin.

A bond adhesive composition comprising a polymer having a silicon-containing hydrolyzable terminal group and a hydrocarbon resin, where the composition is substantially devoid of phenolic resin.

Tape adhesives suitable for impregnating processes for insulation systems are described. Embodiments of the tape adhesives include solid insulation material such as mica, anhydride-free impregnating resins and accelerators for the anhydride-free impregnating resins. The tape adhesives may be adjusted with respect to the reactivity of the accelerators for the anhydride-free impregnating resins in relation for the storage stability of the overall insulation systems.

Disclosed are joining compositions that are suitable for use as adhesives or sealants in various embodiments. Generally, the compositions include silyl-modified polyether polymers in combination with dibenzoate plasticizers. When used as sealant compositions, the joining compositions can exhibit improved stability and reduced leaching of plasticizer components. When used as adhesives, the joining compositions can be used in numerous applications including residential and commercial building applications. Methods of manufacture and use of the compositions are also disclosed.

There are provided a wiring substrate having a low dielectric constant and a low dielectric loss tangent, and an adhesive-attached copper foil and a copper-clad laminate that are suitable for manufacture of the wiring substrate and have improved adhesiveness to a copper foil. An adhesive-attached copper foil includes: a copper foil on one surface; and an adhesive layer provided on one surface of the copper foil, in which this copper foil has a roughened surface that is surface-treated by methacrylic silane, acrylic silane, or isocyanurate silane, and the adhesive layer is formed on the roughened surface and is made of a resin composition containing, as a main component thereof, modified polyphenylene ether resulting from modification of a hydroxyl group present at the end of the main chain with an ethylenically unsaturated compound.