A resin composition includes 20 parts by weight to 45 parts by weight of a phosphorus-containing bismaleimide and 100 parts by weight of a thermosetting resin, wherein the phosphorus-containing bismaleimide has a structure of Formula (I); the thermosetting resin is selected from a vinyl-containing polyphenylene ether resin, a maleimide resin, a polyolefin resin, a prepolymer of maleimide resin, and a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including flame retardancy, outgassing properties, arc resistance, copper foil peeling strength, X-axis coefficient of thermal expansion, glass transition temperature and water absorption rate. ##STR00001##

A resin composition includes 20 parts by weight to 45 parts by weight of a phosphorus-containing bismaleimide and 100 parts by weight of a thermosetting resin, wherein the phosphorus-containing bismaleimide has a structure of Formula (I); the thermosetting resin is selected from a vinyl-containing polyphenylene ether resin, a maleimide resin, a polyolefin resin, a prepolymer of maleimide resin, and a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including flame retardancy, outgassing properties, arc resistance, copper foil peeling strength, X-axis coefficient of thermal expansion, glass transition temperature and water absorption rate. ##STR00001##

A multilayer film bonded to a base fabric includes a first layer bonded to the base fabric; and a second layer disposed on the first layer. The first layer, the second layer, or both includes a thermoplastic elastomer. The thermoplastic elastomer is at least one selected from the group consisting of a polyester-based elastomer, a polyurethane-based elastomer, and a polyamide-based elastomer. A melt strength of the multilayer film is greater than or equal to 7.5 mN.

A multilayer film bonded to a base fabric includes a first layer bonded to the base fabric; and a second layer disposed on the first layer. The first layer, the second layer, or both includes a thermoplastic elastomer. The thermoplastic elastomer is at least one selected from the group consisting of a polyester-based elastomer, a polyurethane-based elastomer, and a polyamide-based elastomer. A melt strength of the multilayer film is greater than or equal to 7.5 mN.

A moisture curable, non-bitumen based and non-asphaltic based adhesive includes an extender, a compatibilizer, and a polymer, wherein the polymer includes reactive silyl groups.

A moisture curable, non-bitumen based and non-asphaltic based adhesive includes an extender, a compatibilizer, and a polymer, wherein the polymer includes reactive silyl groups.

This invention relates to a curable composition comprising: I. a first component comprising a resin having at least one functional group selected from the group consisting of β-ketoester and malonate functional groups, II. a second component comprising at least one curing agent having at least one aldehyde functional group, and III. a third component comprising at least one primary amine or at least one secondary amine, salts thereof, or combinations thereof.

This invention relates to a curable composition comprising: I. a first component comprising a resin having at least one functional group selected from the group consisting of β-ketoester and malonate functional groups, II. a second component comprising at least one curing agent having at least one aldehyde functional group, and III. a third component comprising at least one primary amine or at least one secondary amine, salts thereof, or combinations thereof.

This invention relates to a curable composition comprising: I. Component (I) comprising a resin having at least one functional group selected from the group consisting of β-ketoester and malonate functional groups; II. Component (II) comprising at least one curing agent having at least one aldehyde functional group; III. Component (III) comprising at least one amine, salts thereof, or combinations thereof; and, optionally IV. Component (IV) comprising at least one reactivity delayer; wherein said curing agent is at least one dialdehyde selected from the group consisting of 1,3-cyclohexanedicarboxaldehyde; 1,4 -cyclohexanedicarboxaldehyde; mixtures of 1,3-cyclohexanedicarboxaldehyde and 1,4-cyclohexanedicarboxaldehyde; 2,6-norbornanedicarboxaldehyde; 2,5-norbornanedicarboxaldehyde; cyclododecane-1,4,8-tricarbaldehyde; 3-(4 -formylcyclohexyl)propanal; tricyclodecane dialdehyde; o-phthalaldehyde; terephthalaldehyde; isophthalaldehyde; cyclopentane-1,3-dicarbaldehyde; cyclopenta-3,5-diene-1,3-dicarbaldehyde; glutaraldehyde; benzenedipropanal; any isomers thereof; and any mixtures thereof.

This invention relates to a curable composition comprising: I. Component (I) comprising a resin having at least one functional group selected from the group consisting of β-ketoester and malonate functional groups; II. Component (II) comprising at least one curing agent having at least one aldehyde functional group; III. Component (III) comprising at least one amine, salts thereof, or combinations thereof; and, optionally IV. Component (IV) comprising at least one reactivity delayer; wherein said curing agent is at least one dialdehyde selected from the group consisting of 1,3-cyclohexanedicarboxaldehyde; 1,4 -cyclohexanedicarboxaldehyde; mixtures of 1,3-cyclohexanedicarboxaldehyde and 1,4-cyclohexanedicarboxaldehyde; 2,6-norbornanedicarboxaldehyde; 2,5-norbornanedicarboxaldehyde; cyclododecane-1,4,8-tricarbaldehyde; 3-(4 -formylcyclohexyl)propanal; tricyclodecane dialdehyde; o-phthalaldehyde; terephthalaldehyde; isophthalaldehyde; cyclopentane-1,3-dicarbaldehyde; cyclopenta-3,5-diene-1,3-dicarbaldehyde; glutaraldehyde; benzenedipropanal; any isomers thereof; and any mixtures thereof.