A curable composition containing: a blocked isocyanate prepolymer containing a polyol compound, a polyisocyanate compound, a branching agent, and a blocking agent; an epoxy resin; and a curing agent and/or a curing accelerator, wherein the polyol compound is polytetramethylene glycol, the branching agent is a compound having at least three reactive functional groups capable of reacting with an isocyanate group, an amount by mole of the isocyanate group in the polyisocyanate compound is 2 mol or less relative to 1 mol of a total amount by mole of a hydroxy group in the polyol compound and the reactive functional groups capable of reacting with the isocyanate group in the branching agent, and an amount of the reactive functional groups in the branching agent is more than 50 mol % of the total amount of the hydroxy group in the polyol compound and the reactive functional groups in the branching agent.

Disclosed herein is an adhesive composition comprising: an epoxy-containing component; and a blocked polyisocyanate curing agent comprising a blocking group derived from a blocking agent comprising an alpha-hydroxy amide, ester, or thioester, or a combination thereof. Also disclosed are methods for forming a bonded substrate with the adhesive composition. Also disclosed is an article comprising first and second substrates and the adhesive composition.

Disclosed herein is an adhesive composition comprising: an epoxy-containing component; and a blocked polyisocyanate curing agent comprising a blocking group derived from a blocking agent comprising an alpha-hydroxy amide, ester, or thioester, or a combination thereof. Also disclosed are methods for forming a bonded substrate with the adhesive composition. Also disclosed is an article comprising first and second substrates and the adhesive composition.

A fast response force sensor is disclosed. The fast response force sensor comprises a solid-state bonding (SSB) spacer and piezo material therein. The SSB spacer is sandwiched between a top stack and a bottom stack of the force sensor. The SSB spacer maintains a fixed relative position between a top stack and a bottom stack of the force sensor when a fixed force is applied or removed. The SSB spacer is in solid state and shall not be significantly deformed while being depressed by a user, and therefore the response time of an output signal is vastly determined by the properties of the piezo material of the force sensor when a force is applied against the force sensor. Therefore, a fast response force sensor can respond quickly to a force applied against it.

A fast response force sensor is disclosed. The fast response force sensor comprises a solid-state bonding (SSB) spacer and piezo material therein. The SSB spacer is sandwiched between a top stack and a bottom stack of the force sensor. The SSB spacer maintains a fixed relative position between a top stack and a bottom stack of the force sensor when a fixed force is applied or removed. The SSB spacer is in solid state and shall not be significantly deformed while being depressed by a user, and therefore the response time of an output signal is vastly determined by the properties of the piezo material of the force sensor when a force is applied against the force sensor. Therefore, a fast response force sensor can respond quickly to a force applied against it.

A two-component solventless adhesive composition is disclosed, the adhesive composition comprising an isocyanate component comprising at least one isocyanate, and a polyol component comprising at least one amine-initiated polyol having a functionality of from 3 to 8 and a hydroxyl number of from 20 to 1,000. Further, a method for forming a laminate is disclosed, the method comprising forming a solventless adhesive composition comprising an amine-initiated polyol, applying a layer of the adhesive composition to a surface of a film, bringing the layer into contact with a surface of another film to form a laminate, and curing the adhesive composition. Still further, a laminate formed by the method is disclosed.

The present invention relates to an adhesive material, especially an electrically and/or thermally and/or radiation-curing or curable adhesive material, having at least one adhesive constituent and/or adhesive matrix, and moreover having at least one additive in the form of a carbon material, especially based on carbon nanomaterials and/or carbon micromaterials, present in the adhesive constituent and/or adhesive matrix. The invention further relates to a method for producing, activating and/or curing an adhesive material. Finally the invention also relates to a method for adhesively bonding two substrates.

The invention relates to an article (1) having a main body composed of a polymeric material having elastic properties, in particular an air spring bellows (1), a metal-rubber element or a vibration damper. In order to improve its fire-retardant and/or flame-retardant properties, the article has been provided partially or completely with a flock (9).

The invention relates to an article (1) having a main body composed of a polymeric material having elastic properties, in particular an air spring bellows (1), a metal-rubber element or a vibration damper. In order to improve its fire-retardant and/or flame-retardant properties, the article has been provided partially or completely with a flock (9).

A two-component solventless adhesive composition is disclosed, the adhesive composition comprising an isocyanate component comprising at least one isocyanate, and a polyol component comprising at least one amine-initiated polyol having a functionality of from 3 to 8 and a hydroxyl number of from 20 to 1,000, wherein the first and second components are formulated to be applied to separate substrates before being brought together. Further, a method for forming a laminate is disclosed, the method comprising uniformly applying the isocyanate component to a first substrate, uniformly applying the polyol component to a second substrate, bringing the first and second substrates together, thereby mixing and reacting the isocyanate component and the polyol component to form an adhesive between the first and second substrates, and curing the adhesive to bond the first and second substrates. Still further, a laminate formed by the method is disclosed.