This invention relates to polyetheramines based on 1,3-dialcohols, in particular to an etheramine mixture comprising at least 90% by weight, based on the total weight of the etheramine mixture, of an amine of Formula (I) and/or (II), ##STR00001##
wherein R.sub.1-R.sub.12 are independently selected from H, alkyl, cycloalkyl, aryl, alkylaryl, or arylalkyl, wherein at least one of R.sub.1-R.sub.6 and at least one of R.sub.7-R.sub.12 is different from H, wherein A.sub.1-A.sub.9 are independently selected from linear or branched alkylenes having 2 to 18 carbon atoms, wherein Z.sub.1-Z.sub.4 are independently selected OH, CH.sub.2CH.sub.2CH.sub.2NH.sub.2, NH.sub.2, NHR or NRR, wherein the degree of amination is <50%, wherein R and R are independently selected from alkylenes having 2-6 carbon atoms, and wherein the sum of x+y is in the range of from 2 to 200, wherein x1 and y1; and x.sub.1+y.sub.1 is in the range of from 2 to 200.

This invention relates to polyetheramines based on 1,3-dialcohols, in particular to an etheramine mixture comprising at least 90% by weight, based on the total weight of the etheramine mixture, of an amine of Formula (I) and/or (II), ##STR00001##
wherein R.sub.1-R.sub.12 are independently selected from H, alkyl, cycloalkyl, aryl, alkylaryl, or arylalkyl, wherein at least one of R.sub.1-R.sub.6 and at least one of R.sub.7-R.sub.12 is different from H, wherein A.sub.1-A.sub.9 are independently selected from linear or branched alkylenes having 2 to 18 carbon atoms, wherein Z.sub.1-Z.sub.4 are independently selected OH, CH.sub.2CH.sub.2CH.sub.2NH.sub.2, NH.sub.2, NHR or NRR, wherein the degree of amination is <50%, wherein R and R are independently selected from alkylenes having 2-6 carbon atoms, and wherein the sum of x+y is in the range of from 2 to 200, wherein x1 and y1; and x.sub.1+y.sub.1 is in the range of from 2 to 200.

An adhesive composition including predominantly one or two polyamide(s) having units chosen from: at least one unit denoted A with a mean number of carbon atoms per nitrogen atom, denoted CA, ranging from 4 to 8.5, advantageously from 4 to 7; at least one unit denoted B with a mean number of carbon atoms per nitrogen atom, denoted CB, ranging from 7 to 10, advantageously from 7.5 to 9.5; at least one unit denoted C with a mean number of carbon atoms per nitrogen atom, denoted CC, ranging from 9 to 18, advantageously from 10 to 18, and to the use thereof.

An adhesive composition including predominantly one or two polyamide(s) having units chosen from: at least one unit denoted A with a mean number of carbon atoms per nitrogen atom, denoted CA, ranging from 4 to 8.5, advantageously from 4 to 7; at least one unit denoted B with a mean number of carbon atoms per nitrogen atom, denoted CB, ranging from 7 to 10, advantageously from 7.5 to 9.5; at least one unit denoted C with a mean number of carbon atoms per nitrogen atom, denoted CC, ranging from 9 to 18, advantageously from 10 to 18, and to the use thereof.

An adhesive composition including predominantly one or two polyamide(s) having units chosen from: at least one unit denoted A with a mean number of carbon atoms per nitrogen atom, denoted CA, ranging from 4 to 8.5, advantageously from 4 to 7; at least one unit denoted B with a mean number of carbon atoms per nitrogen atom, denoted CB, ranging from 7 to 10, advantageously from 7.5 to 9.5; at least one unit denoted C with a mean number of carbon atoms per nitrogen atom, denoted CC, ranging from 9 to 18, advantageously from 10 to 18, and to the use thereof.

An adhesive composition is provided which exhibits not only adhesiveness to a polyimide film or copper foil, but also high adhesiveness to gold-plated copper foil, and is also superior in heat resistance such as soldering heat resistance.

The adhesive composition comprises a solvent-soluble polyamide resin (A) which is solid at 25 C., an epoxy resin (B), and an imidazole compound (C) having an alkoxysilyl group, wherein the mass ratio (A)/(B) of the component (A) to the component (B) is 99/1-50/50, and the content of the component (C) is 0.3-5 parts by mass with respect to 100 parts by mass of the total of the component (A) and the component (B).

An adhesive composition is provided which exhibits not only adhesiveness to a polyimide film or copper foil, but also high adhesiveness to gold-plated copper foil, and is also superior in heat resistance such as soldering heat resistance.

The adhesive composition comprises a solvent-soluble polyamide resin (A) which is solid at 25 C., an epoxy resin (B), and an imidazole compound (C) having an alkoxysilyl group, wherein the mass ratio (A)/(B) of the component (A) to the component (B) is 99/1-50/50, and the content of the component (C) is 0.3-5 parts by mass with respect to 100 parts by mass of the total of the component (A) and the component (B).

The invention relates to biomimetic adhesive compositions emulating mussel adhesive proteins, wherein multiple chains of a copolymer are interlinked via specific hydrogen bonds and/or ligand-metal-ligand bonds, which serve as sacrificial breakable bonds upon mechanical stress and thereby effectively dissipate the mechanical energy. Accordingly, toughened adhesive compositions with improved ductility and strength may be obtained.

The invention relates to biomimetic adhesive compositions emulating mussel adhesive proteins, wherein multiple chains of a copolymer are interlinked via specific hydrogen bonds and/or ligand-metal-ligand bonds, which serve as sacrificial breakable bonds upon mechanical stress and thereby effectively dissipate the mechanical energy. Accordingly, toughened adhesive compositions with improved ductility and strength may be obtained.

A plasticizer composition for mastics, plastisols and adhesives is disclosed. The plasticizer includes at least one hydrocarbon-containing cut or a cut originating from biomass conversion and at least one fatty acid monoester. The plasticizer is free of phthalates.