Disclosed herein are improved adhesive compositions for bonding textiles and methods of producing the same.

Disclosed herein are improved adhesive compositions for bonding textiles and methods of producing the same.

The invention concerns a linerless self-adhesive material obtained starting from a self-adhesive material with a liner, by means of a process that comprises the delamination of the liner from a self-adhesive layer, activation of the liner or self- adhesive layer, transferral of the liner over the self-adhesive layer and re-lamination of the two components so as to produce the linerless self-adhesive material. The liner or the self-adhesive layer is coated with a thermo-adhesive that allows for permanent lamination of the liner located on the self-adhesive layer.

The invention concerns a linerless self-adhesive material obtained starting from a self-adhesive material with a liner, by means of a process that comprises the delamination of the liner from a self-adhesive layer, activation of the liner or self- adhesive layer, transferral of the liner over the self-adhesive layer and re-lamination of the two components so as to produce the linerless self-adhesive material. The liner or the self-adhesive layer is coated with a thermo-adhesive that allows for permanent lamination of the liner located on the self-adhesive layer.

The present invention relates to a conductive adhesive for screen printing containing metal colloid particles (A) containing metal nanoparticles (A1) and a protective colloid (A2) containing an organic compound having a carboxyl group and a polymer dispersant having a carboxyl group, a viscosity modifier (B) having an amide bond and/or a urea bond, and a dispersion solvent (C).

The present invention relates to a conductive adhesive for screen printing containing metal colloid particles (A) containing metal nanoparticles (A1) and a protective colloid (A2) containing an organic compound having a carboxyl group and a polymer dispersant having a carboxyl group, a viscosity modifier (B) having an amide bond and/or a urea bond, and a dispersion solvent (C).

The present invention relates to a conductive adhesive for screen printing containing metal colloid particles (A) containing metal nanoparticles (A1) and a protective colloid (A2) containing an organic compound having a carboxyl group and a polymer dispersant having a carboxyl group, a viscosity modifier (B) having an amide bond and/or a urea bond, and a dispersion solvent (C).

The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.

The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.

Provided is an adhesive as follows. The adhesive can bond/secure an adherend to a support with maintaining high adhesiveness during the existence of the need for securing of the adherend to the support, even in a high-temperature environment or in an environment with abrupt temperature change. The adhesive enables debonding of the adherend from the support without breakage of the adherend when the securing becomes unnecessary. The adhesive can be easily removed when remained on the adherend after debonding. The adhesive according to the present invention contains (A) a multivalent vinyl ether compound, (B) a compound including two or more of a constitutional unit represented by Formula (b), and (C) a thermoplastic resin. In the formula, X is selected from hydroxy and carboxy.

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