A thermoplastic composition which comprises at least one polyamide, which preferably has a melting point of less than 185° C., and at least one liquid polysiloxane compound which preferably has a viscosity of 750 to 100,000 mPas at 25° C. and is OH terminated, wherein the thermoplastic composition is obtainable by a process comprising the steps: 1a) heating the at least one polyamide to a temperature above the melting point of the at least one polyamide and preferably below 185° C.; 2a) adding under stirring the at least one liquid polysiloxane compound to the heated compound(s) of step 1a), wherein the temperature is kept above the melting point of the at least one polyamide and preferably below 185° C.; and 3a) mixing the obtained mixture of step 2a) preferably at 80° to 180° C., more preferably 110 to 140° C.

Use of this the thermoplastic composition according to the present invention in sealants, adhesives, or as rheological modifier or surface modifier. Furthermore, to a hot melt adhesive comprising the thermoplastic composition according to the present invention. And use of this hot melt in vehicle parts, constructions, windows, glazing, sanitary applications, fittings, roofing, plumbing, appliance application and bonding of panes.

The invention relates to an adhesive composition comprising at least one polyamide noted A, with a mean number of carbon atoms per nitrogen atom, noted C.sub.A, of between 4 and 8.5 and advantageously between 4 and 7; at least one polyamide noted B, with a melting point of greater than or equal to 180° C. and a mean number of carbon atoms per nitrogen atom, noted C.sub.B, of between 7 and 10 and advantageously between 7.5 and 9.5; at least one polyamide noted C, with a mean number of carbon atoms per nitrogen atom, noted C.sub.C, of between 9 and 18 and advantageously between 10 and 18; at least 50% by weight of the said composition being formed from one or more polyamides chosen from polyamides A, B and C, the mass-weighted mean of the heats of fusion of these polyamides in the said composition being greater than 25 J/g (DSC), the mean number of carbon atoms per nitrogen atom of the polyamides A, B and C also satisfying the following strict inequality: C.sub.A<C.sub.B<C.sub.C, and also to multilayer structures using the said composition.

The invention relates to an adhesive composition comprising at least one polyamide noted A, with a mean number of carbon atoms per nitrogen atom, noted C.sub.A, of between 4 and 8.5 and advantageously between 4 and 7; at least one polyamide noted B, with a melting point of greater than or equal to 180° C. and a mean number of carbon atoms per nitrogen atom, noted C.sub.B, of between 7 and 10 and advantageously between 7.5 and 9.5; at least one polyamide noted C, with a mean number of carbon atoms per nitrogen atom, noted C.sub.C, of between 9 and 18 and advantageously between 10 and 18; at least 50% by weight of the said composition being formed from one or more polyamides chosen from polyamides A, B and C, the mass-weighted mean of the heats of fusion of these polyamides in the said composition being greater than 25 J/g (DSC), the mean number of carbon atoms per nitrogen atom of the polyamides A, B and C also satisfying the following strict inequality: C.sub.A<C.sub.B<C.sub.C, and also to multilayer structures using the said composition.

The invention relates to an adhesive composition comprising at least one polyamide noted A, with a mean number of carbon atoms per nitrogen atom, noted C.sub.A, of between 4 and 8.5 and advantageously between 4 and 7; at least one polyamide noted B, with a melting point of greater than or equal to 180° C. and a mean number of carbon atoms per nitrogen atom, noted C.sub.B, of between 7 and 10 and advantageously between 7.5 and 9.5; at least one polyamide noted C, with a mean number of carbon atoms per nitrogen atom, noted C.sub.C, of between 9 and 18 and advantageously between 10 and 18; at least 50% by weight of the said composition being formed from one or more polyamides chosen from polyamides A, B and C, the mass-weighted mean of the heats of fusion of these polyamides in the said composition being greater than 25 J/g (DSC), the mean number of carbon atoms per nitrogen atom of the polyamides A, B and C also satisfying the following strict inequality: C.sub.A<C.sub.B<C.sub.C, and also to multilayer structures using the said composition.

In one aspect, adhesives for use with a 3D printer are described herein. In some embodiments, an adhesive for use with a 3D printer comprises a first polymeric component comprising a poly(vinyl alcohol) and a second polymeric component. The poly(vinyl alcohol), in some embodiments, comprises amorphous poly(vinyl alcohol). In some embodiments, the second polymeric component comprises a water-soluble polymer. Further, in some embodiments, an adhesive described herein further comprises a solvent, a surfactant, and/or a preservative.

In one aspect, adhesives for use with a 3D printer are described herein. In some embodiments, an adhesive for use with a 3D printer comprises a first polymeric component comprising a poly(vinyl alcohol) and a second polymeric component. The poly(vinyl alcohol), in some embodiments, comprises amorphous poly(vinyl alcohol). In some embodiments, the second polymeric component comprises a water-soluble polymer. Further, in some embodiments, an adhesive described herein further comprises a solvent, a surfactant, and/or a preservative.

A method of manufacturing a footwear includes the steps of providing a leather base layer and providing a leather attachment layer. The leather base layer and the leather attachment layer are fixed against each other with an intermediate application of adhesive between them. The applied adhesive is activated. The leather base layer and the leather attachment layer are forced against each other under a pressure with the adhesive between them. The adhesive is cured and thereby the leather base layer and the leather attachment layer are bonded to each other. The bonded leather base layer and the leather attachment layer are integrated as part of the footwear.

A method is described for debonding a carrier and device substrate using a high-intensity, pulsed, broadband light system that is suitable for wafer-level packaging applications. The carrier substrate is a transparent wafer with a light absorbing layer on one side of the wafer. This method utilizes the high intensity light to rapidly heat up the light absorbing layer to decompose or melt a bonding material layer that is adjacent to the light absorbing layer. After exposure to light, the carrier substrate can be lifted off the surface of the device wafer with little or no force.

The present invention relates to a two-part epoxy-based structural adhesive composition, comprising a first part and a second part, the first part comprising: i) a first aromatic difunctional epoxy resin having an epoxide equivalent weight (EEW) of less than 400 g/eq, ii) a second aromatic difunctional epoxy resin having an epoxide equivalent weight of from 400 g/eq to 3000 g/eq, and iii) a shell-core toughening agent; the second part comprising: I) a non-aromatic polyetheramide amine and II) an alicyclic amine. Moreover, the present invention also relates to a method for bonding substrates using the adhesive composition and an article bonded with the cured product of the adhesive composition and use of the composition in assembly of articles.

The present invention relates to a two-part epoxy-based structural adhesive composition, comprising a first part and a second part, the first part comprising: i) a first aromatic difunctional epoxy resin having an epoxide equivalent weight (EEW) of less than 400 g/eq, ii) a second aromatic difunctional epoxy resin having an epoxide equivalent weight of from 400 g/eq to 3000 g/eq, and iii) a shell-core toughening agent; the second part comprising: I) a non-aromatic polyetheramide amine and II) an alicyclic amine. Moreover, the present invention also relates to a method for bonding substrates using the adhesive composition and an article bonded with the cured product of the adhesive composition and use of the composition in assembly of articles.