The invention relates to a thermally curable adhesive compound consisting of the following components: (A) 4.9 to 34.9 wt % (relative to the total amount of the curable adhesive compound) of an epoxide-functionalized (co)polymer having a weight-average molar mass in the range of 5,000 g/mol to 200,000 g/mol, based on more than 30 to 100 wt %, preferably 50 to 100 wt %, (relative to the total amount of the monomers on which the epoxide-functionalized (co)polymer is based) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group, (B) 0.1 to 5 wt % (relative to the total amount of the curable adhesive compound) of at least one thermally activatable curing agent for a cationic curing of epoxides, (C) 65 to 95 wt % (relative to the total amount of the curable adhesive compound) of at least one type of matrix polymer as a film-forming agent, (D) optionally 0 to 30 wt % of additional components.

The invention relates to a thermally curable adhesive compound consisting of the following components: (A) 4.9 to 34.9 wt % (relative to the total amount of the curable adhesive compound) of an epoxide-functionalized (co)polymer having a weight-average molar mass in the range of 5,000 g/mol to 200,000 g/mol, based on more than 30 to 100 wt %, preferably 50 to 100 wt %, (relative to the total amount of the monomers on which the epoxide-functionalized (co)polymer is based) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group, (B) 0.1 to 5 wt % (relative to the total amount of the curable adhesive compound) of at least one thermally activatable curing agent for a cationic curing of epoxides, (C) 65 to 95 wt % (relative to the total amount of the curable adhesive compound) of at least one type of matrix polymer as a film-forming agent, (D) optionally 0 to 30 wt % of additional components.

The invention relates to a thermally curable adhesive compound consisting of the following components: (A) 4.9 to 34.9 wt % (relative to the total amount of the curable adhesive compound) of an epoxide-functionalized (co)polymer having a weight-average molar mass in the range of 5,000 g/mol to 200,000 g/mol, based on more than 30 to 100 wt %, preferably 50 to 100 wt %, (relative to the total amount of the monomers on which the epoxide-functionalized (co)polymer is based) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group, (B) 0.1 to 5 wt % (relative to the total amount of the curable adhesive compound) of at least one thermally activatable curing agent for a cationic curing of epoxides, (C) 65 to 95 wt % (relative to the total amount of the curable adhesive compound) of at least one type of matrix polymer as a film-forming agent, (D) optionally 0 to 30 wt % of additional components.

A liquid adhesion composition can include at least one polymerizable compound comprising at least two functional groups; a solvent; a catalyst; and a cross-linking agent, wherein the cross-linking agent can have a structure of Formula (1): A [X(OY).sub.n1N(CH.sub.2OR).sub.2].sub.n2 (1), wherein A is an alkyl group, or an aromatic group, or a heteroaromatic group; X is C.sub.1-5 alkyl, Y is C.sub.1-4 linear or branched alkyl; n.sub.1 is 1-10; R is C.sub.1-6 alkyl; and n.sub.2 is 1-6. The liquid adhesion composition can be cured at elevated temperatures and may be applied in nanoimprint lithography for attaching an imprint resist layer on a substrate.

A liquid adhesion composition can include at least one polymerizable compound comprising at least two functional groups; a solvent; a catalyst; and a cross-linking agent, wherein the cross-linking agent can have a structure of Formula (1): A [X(OY).sub.n1N(CH.sub.2OR).sub.2].sub.n2 (1), wherein A is an alkyl group, or an aromatic group, or a heteroaromatic group; X is C.sub.1-5 alkyl, Y is C.sub.1-4 linear or branched alkyl; n.sub.1 is 1-10; R is C.sub.1-6 alkyl; and n.sub.2 is 1-6. The liquid adhesion composition can be cured at elevated temperatures and may be applied in nanoimprint lithography for attaching an imprint resist layer on a substrate.

To provide an adhesive sheet, the sheet increasing manufacturing efficiency of products including an adhesive agent layer, while using the adhesive agent layer to which an electro-conductive organic polymer compound is added. An adhesive sheet for use in applying a wiring board to a surface onto which the wiring board is to be applied, the adhesive sheet is constituted by an adhesive agent layer including an electro-conductive organic polymer compound and an adhesive material; a first releasing sheet provided on front surface of the adhesive agent layer; and a second releasing sheet provided on a back surface corresponding to a back surface of the front surface in the adhesive agent layer.

The present disclosure is directed to peelable, heat-sealable lidding films for containers of diverse polymer compositions storing various products such as foodstuffs and pharmaceuticals. The lidding films disclosed herein can be heat-sealed to crystalline polyester trays (CPET), easily peeled, and contain improved antifogging performance by incorporating a non-migratory antifogging additive into the heat sealable layer of the film without deteriorating seal strengths.

A liquid adhesion composition can include at least one polymerizable compound comprising at least two functional groups; a solvent; a catalyst; and a cross-linking agent, wherein the cross-linking agent can have a structure of Formula (1): A [X(OY).sub.n1-N(CH.sub.2OR).sub.2].sub.n2 (1), wherein A is an alkyl group, or an aromatic group, or a heteroaromatic group; X is C.sub.1-5 alkyl, Y is C.sub.1-4 linear or branched alkyl; n.sub.1 is 1-10; R is C.sub.1-6 alkyl; and n.sub.2 is 1-6. The liquid adhesion composition can be cured at elevated temperatures and may be applied in nanoimprint lithography for attaching an imprint resist layer on a substrate.

A liquid adhesion composition can include at least one polymerizable compound comprising at least two functional groups; a solvent; a catalyst; and a cross-linking agent, wherein the cross-linking agent can have a structure of Formula (1): A [X(OY).sub.n1-N(CH.sub.2OR).sub.2].sub.n2 (1), wherein A is an alkyl group, or an aromatic group, or a heteroaromatic group; X is C.sub.1-5 alkyl, Y is C.sub.1-4 linear or branched alkyl; n.sub.1 is 1-10; R is C.sub.1-6 alkyl; and n.sub.2 is 1-6. The liquid adhesion composition can be cured at elevated temperatures and may be applied in nanoimprint lithography for attaching an imprint resist layer on a substrate.

The present disclosure is directed to peelable, heat-sealable lidding films for containers of diverse polymer compositions storing various products such as foodstuffs and pharmaceuticals. The lidding films disclosed herein can be heat-sealed to crystalline polyester trays (CPET), easily peeled, and contain improved antifogging performance by incorporating a non-migratory antifogging additive into the heat sealable layer of the film without deteriorating seal strengths.