Disclosed is a biaxially stretched polyester film containing an antimony compound as a catalyst component, and a magnesium compound and a phosphorus compound as additives, in which an amount of metal antimony included in residues on a membrane filter having an average pore diameter of 0.1 m, after a solution in which 1 g of the biaxially stretched polyester is dissolved in 5 ml of hexafluoroisopropanol is filtered by the filter, is 10 to 100 mg per 1 kg of the biaxially stretched polyester.

Described herein is a thermosetting resin composition, obtained from the reaction of at least: a polycarbodiimide (i), where the number of carbodiimide groups per molecule is in the range of from 1 to 10; a mixture of crystalline and amorphous polyols (ii), where the molar ratio of carbodiimide groups in the polycarbodiimide according to (i) to hydroxyl groups in the mixture according to (ii) is in the range of from 1:2 to 2:1 and where at least 25 weight-% of the mixture according to (ii) consists of at least one crystalline polyesterol, based on the overall weight of the mixture being 100 weight-%. Also described herein is a method of using the thermosetting resin composition as an adhesive, as well as processes for preparation of adhesives, an element including an adhesive layer on at least one substrate, and an adhesive film, obtained from one of the processes.

Described herein is a thermosetting resin composition, obtained from the reaction of at least: a polycarbodiimide (i), where the number of carbodiimide groups per molecule is in the range of from 1 to 10; a mixture of crystalline and amorphous polyols (ii), where the molar ratio of carbodiimide groups in the polycarbodiimide according to (i) to hydroxyl groups in the mixture according to (ii) is in the range of from 1:2 to 2:1 and where at least 25 weight-% of the mixture according to (ii) consists of at least one crystalline polyesterol, based on the overall weight of the mixture being 100 weight-%. Also described herein is a method of using the thermosetting resin composition as an adhesive, as well as processes for preparation of adhesives, an element including an adhesive layer on at least one substrate, and an adhesive film, obtained from one of the processes.

The aim of the invention is to provide polyester/primer/metallic coating composite films having good adherence of the metallic coating in dry and humid conditions. Said films also form a good gas barrier: oxygen permeability less than or equal to 0.8 cc/m2/d; water vapour permeability less than or equal to 0.3 g/m2/d. To this end, the invention concerns a composite film comprising a polyester substrate, at least one coating adhering on at least one of the faces of the substrate and at least one layer of primer for cross-linked adhesion between the substrate and the coating. Said primer comprises at least one acrylic and/or methacrylic polymer P1, at least one acrylic and/or methacrylic polymer P2 different from P1, at least one cross-linking agent, and, preferably, at least one polyester that is soluble or dispersible in water: P1 having a gel content TG1>70% by dry weight with respect to P1; P2 having a gel content TG2TG1 and 20% by dry weight, with respect to P2; P1 having a surface-grafted free weak acid content >0.8 in meq/g of polymer; [P2]60% by weight on dry by weight in respect to P1+P2. The method for producing said film, the adhering primer, and the articles obtained using said film, also form part of the present invention.

The present disclosure is directed to peelable, heat-sealable lidding films for containers of diverse polymer compositions storing various products such as foodstuffs and pharmaceuticals. The lidding films disclosed herein can be heat-sealed to crystalline polyester trays (CPET), easily peeled, and contain improved antifogging performance by incorporating a non-migratory antifogging additive into the heat sealable layer of the film without deteriorating seal strengths.

Provided are an interlayer insulating resin film, an interlayer insulating resin film having an adhesive auxiliary layer, and a printed circuit board obtained using the interlayer insulating resin film or the interlayer insulating resin film having an adhesive auxiliary layer, with which it is possible to obtain an interlayer insulating layer having exceptional adhesion to a circuit board even after accelerated environmental testing, and exceptional heat resistance, dielectric characteristics, and low thermal expansion. Specifically: an interlayer insulating resin film containing an epoxy resin (A), a cyanate resin (B), and a dicyandiamide (C); an interlayer insulating resin film having an adhesive auxiliary layer, the adhesive auxiliary layer being provided on one surface of the above-mentioned interlayer insulating resin film, wherein the adhesive auxiliary layer having an adhesive auxiliary layer contains an epoxy resin (a), a cyanate resin (b), and an inorganic filer (c); and a printed circuit board obtained using the interlayer insulating resin film or the interlayer insulating resin film having an adhesive auxiliary layer.

Provided are an interlayer insulating resin film, an interlayer insulating resin film having an adhesive auxiliary layer, and a printed circuit board obtained using the interlayer insulating resin film or the interlayer insulating resin film having an adhesive auxiliary layer, with which it is possible to obtain an interlayer insulating layer having exceptional adhesion to a circuit board even after accelerated environmental testing, and exceptional heat resistance, dielectric characteristics, and low thermal expansion. Specifically: an interlayer insulating resin film containing an epoxy resin (A), a cyanate resin (B), and a dicyandiamide (C); an interlayer insulating resin film having an adhesive auxiliary layer, the adhesive auxiliary layer being provided on one surface of the above-mentioned interlayer insulating resin film, wherein the adhesive auxiliary layer having an adhesive auxiliary layer contains an epoxy resin (a), a cyanate resin (b), and an inorganic filer (c); and a printed circuit board obtained using the interlayer insulating resin film or the interlayer insulating resin film having an adhesive auxiliary layer.

The present invention is a cyanate ester compound represented by the following formula (1): ##STR00001## wherein Ar represents an aromatic ring; R.sub.1 each independently represents a hydrogen atom, an alkyl group, or an aryl group; n each independently represents an integer of 1 to 3; m+n is the same as the total number of hydrogen atoms in a monovalent aromatic group containing the aromatic ring and the hydrogen atoms; R.sub.2 represents a hydrogen atom (excluding a case where Ar represents a benzene ring; n each represents 1; R.sub.1 represents a hydrogen atom; m each represents 4, and a cyanate group is bonded to the benzene ring in the 4-position relative to an adamantyl group), or an alkyl group having 1 to 4 carbon atoms; and R.sub.3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.

The present invention is a cyanate ester compound represented by the following formula (1): ##STR00001## wherein Ar represents an aromatic ring; R.sub.1 each independently represents a hydrogen atom, an alkyl group, or an aryl group; n each independently represents an integer of 1 to 3; m+n is the same as the total number of hydrogen atoms in a monovalent aromatic group containing the aromatic ring and the hydrogen atoms; R.sub.2 represents a hydrogen atom (excluding a case where Ar represents a benzene ring; n each represents 1; R.sub.1 represents a hydrogen atom; m each represents 4, and a cyanate group is bonded to the benzene ring in the 4-position relative to an adamantyl group), or an alkyl group having 1 to 4 carbon atoms; and R.sub.3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.

The present disclosure relates generally to the field of adhesives, more specifically to the field of structural adhesive tapes, in particular for use in bonding metal parts. The present disclosure also relates to a method of bonding two parts and to a composite article. The present disclosure is further directed to the use of a structural adhesive tape for industrial applications, such as construction and automotive applications, in particular for body-in-white bonding applications in the automotive industry.