Described herein are articles and methods of making articles, for example glass articles, comprising a thin sheet and a carrier, wherein the thin sheet and carrier are bonded together using a modification (coating) layer, for example an aromatic polymer coating layer, and associated deposition methods and inert gas treatments that may be applied on the thin sheet, the carrier, or both, to control van der Waals, hydrogen and covalent bonding between the thin sheet and the carrier. The modification layer bonds the thin sheet and carrier together with sufficient bond strength to prevent delamination of the thin sheet and the carrier during high temperature processing while preventing a permanent bond during high temperature processing.

A semiconductor package includes a semiconductor die, a substrate for supporting the semiconductor die, an encapsulant covering the semiconductor die and at least part of the substrate, and a die attach material attaching the semiconductor die to the substrate. The die attach material includes molecules having a first functional group with at least one free electron pair and a second functional group chemically reacted or reactable with the encapsulant in a way that promotes adhesion with the encapsulant. A corresponding method of manufacturing the semiconductor package is also described.

A semiconductor package includes a semiconductor die, a substrate for supporting the semiconductor die, an encapsulant covering the semiconductor die and at least part of the substrate, and a die attach material attaching the semiconductor die to the substrate. The die attach material includes molecules having a first functional group with at least one free electron pair and a second functional group chemically reacted or reactable with the encapsulant in a way that promotes adhesion with the encapsulant. A corresponding method of manufacturing the semiconductor package is also described.

A semiconductor package includes a semiconductor die, a substrate for supporting the semiconductor die, an encapsulant covering the semiconductor die and at least part of the substrate, and a die attach material attaching the semiconductor die to the substrate. The die attach material includes molecules having a first functional group with at least one free electron pair and a second functional group chemically reacted or reactable with the encapsulant in a way that promotes adhesion with the encapsulant. A corresponding method of manufacturing the semiconductor package is also described.

The present invention relates to a curable composition containing a thiol compound (A) having at least two thiol groups in a molecule thereof, an epoxy compound (B2) having at least two epoxy groups in a molecule thereof, a phosphine compound (C), and an acid (D); and, a curable composition containing the thiol compound (A), an epoxy compound (B1) having at least one epoxy group in a molecule thereof, an isocyanate compound (E2) having at least two isocyanate groups in a molecule thereof, a phosphine compound (C), and an acid (D).

A method for applying a release coating to a metal support includes the following steps: i. depositing on the metal support one or more continuous layers of a tie sublayer comprising one or more polymers selected from the group consisting of polyaryletherketones (PAEK), polyethyleneimines (PEI), polyimides (PI), polyamide imides (PAI) and polybenzymidazoles (PBI) in an amount of 20% to 95% by weight of the total weight of said sublayer, characterized in that it comprises only a single sintering step at T C.>400 C., and that of the total, after the deposition of the various layers.

The present invention provides a sheet-forming body containing a thiourethane bond-having compound and a thiol group-having compound, wherein, in an IR absorption spectrum thereof, the ratio of the peak intensity A of the absorption peak based on the carbonyl group in the thiourethane bond to the peak intensity B of the absorption peak based on the thiol group (A/B) is 20 or more and 250 or less. Using the sheet-forming body, rubber members, especially vulcanized rubber members can be strongly bonded, and the sheet-forming body and an adhesive sheet, which are excellent in handleability and workability, and a laminate produced by bonding rubber layers using the sheet-forming body are provided.

An adhesive sheet, the adhesive sheet having an adhesive composition layer, the adhesive composition layer being formed using a composition including: a polythiol compound; a (meth)acrylic compound having a plurality of at least one of an acryloyl group or a methacryloyl group; a radical generator; and a Michael addition catalyst, a ratio (Ac/SH) of a total molar number (Ac) of the at least one of an acryloyl group or a methacryloyl group contained in the (meth)acrylic compound to a total molar number (SH) of thiol groups contained in the polythiol compound being from 0.25 to 0.80.

An adhesive sheet, the adhesive sheet having an adhesive composition layer, the adhesive composition layer being formed using a composition including: a polythiol compound; a (meth)acrylic compound having a plurality of at least one of an acryloyl group or a methacryloyl group; a radical generator; and a Michael addition catalyst, a ratio (Ac/SH) of a total molar number (Ac) of the at least one of an acryloyl group or a methacryloyl group contained in the (meth)acrylic compound to a total molar number (SH) of thiol groups contained in the polythiol compound being from 0.25 to 0.80.

A material for forming an adhesive film used for an adhesive film formed directly under a resist upper layer film, contains: (A) a resin having at least one structural unit containing a fluorine-substituted organic sulfonyl anion structure and having at least one structural unit shown by the following general formula (2) besides the structural unit containing the fluorine-substituted organic sulfonyl anion structure; (B) a thermal acid generator; and (C) an organic solvent. The material forms an adhesive film in a fine patterning process by a multilayer resist method in a semiconductor device manufacturing process, where the material gives an adhesive film that has high adhesiveness to a resist upper layer film, has an effect of suppressing fine pattern collapse, and also makes it possible to form an excellent pattern profile. A patterning process uses the material. A method forms the adhesive film. ##STR00001##