Method for bonding by wrapping a medium which is capable of expanding transversely to a winding with an adhesive tape, in which: an adhesive tape is unrolled from an adhesive tape roll, the unrolled adhesive tape is provided on one side of a carrier film (1) with an adhesive cement layer (2) and on an opposite side with a separating agent layer (3), the separating agent layer (3) is subjected to a plasma treatment, the plasma-treated adhesive tape is wound around the medium which is capable of expanding transversely to a winding, so that at least a portion of the adhesive tape is bonded to a lower winding ply by the adhesive cement layer (2).

Method for bonding by wrapping a medium which is capable of expanding transversely to a winding with an adhesive tape, in which: an adhesive tape is unrolled from an adhesive tape roll, the unrolled adhesive tape is provided on one side of a carrier film (1) with an adhesive cement layer (2) and on an opposite side with a separating agent layer (3), the separating agent layer (3) is subjected to a plasma treatment, the plasma-treated adhesive tape is wound around the medium which is capable of expanding transversely to a winding, so that at least a portion of the adhesive tape is bonded to a lower winding ply by the adhesive cement layer (2).

A bonding arrangement comprising a silicone-base adhesive composition is suited for temporarily bonding a wafer to a support for wafer processing. The bonding arrangement includes a first temporary bond layer of non-silicone thermoplastic resin, and a second temporary bond layer of thermosetting silicone polymer and/or a third temporary bond layer of thermosetting siloxane-modified polymer. The second and/or third bond layer contains an antistatic agent.

A bonding arrangement comprising a silicone-base adhesive composition is suited for temporarily bonding a wafer to a support for wafer processing. The bonding arrangement includes a first temporary bond layer of non-silicone thermoplastic resin, and a second temporary bond layer of thermosetting silicone polymer and/or a third temporary bond layer of thermosetting siloxane-modified polymer. The second and/or third bond layer contains an antistatic agent.

Provided is a release agent composition for silicone adhesives in which organopolysiloxane having a specific structure is added, as a heavy release component, to a release agent composition for silicone adhesives that includes organopolysiloxane modified with a fluorine-containing organic group.

Provided is a release agent composition for silicone adhesives in which organopolysiloxane having a specific structure is added, as a heavy release component, to a release agent composition for silicone adhesives that includes organopolysiloxane modified with a fluorine-containing organic group.

A new generation elastomeric biopolymer produced by yeast belonging to the family Saccharomycetaceae, and an isolated yeast belonging to the genus Williopsis that produces and secretes the biopolymer.

A new generation elastomeric biopolymer produced by yeast belonging to the family Saccharomycetaceae, and an isolated yeast belonging to the genus Williopsis that produces and secretes the biopolymer.

An object of the present invention is to provide an adhesive composition for a high-power optical fiber having a low pull-in amount. The adhesive composition for a high-power optical fiber of the present invention contains: a compound (A) having an aromatic ring and a reactive silicon-containing group; a glycidyl compound (B); and a compound (C) having a silsesquioxane cage structure.

An object of the present invention is to provide an adhesive composition for a high-power optical fiber having a low pull-in amount. The adhesive composition for a high-power optical fiber of the present invention contains: a compound (A) having an aromatic ring and a reactive silicon-containing group; a glycidyl compound (B); and a compound (C) having a silsesquioxane cage structure.