A curable composition for use in wound care comprising, apportioned between at least one Part A and at least one Part B: one or more alkenyl-group containing polymers (i) having at least one alkenyl group or moiety per molecule, one or more SiH-containing polymers (ii) having at least one Si—H unit per molecule; and a catalyst (iii) for curing by addition of alkenyl-containing polymer (i) to SiH-containing polymer (ii), Part A and Part B independently having viscosity at 23° C. in the range 5-300 Pa.Math.s, preferably 10-100 Pa.Math.s, at a shearing rate of 10 s.sup.−1, and when combined in one Part having cure time at 23° C. in the range from 0.5 min to 25 min, wherein when dispensed into a location about a wound dressing, said wound dressing overlying a wound site and skin thereabout, said dispensing being so as to intimately contact and overlie an edge of said dressing and skin about said edge, the composition cures in contact with said edge and skin at 32° C. to an elastomer exhibiting zero or low tack at a time in the range from 0.5 to less than 30 minutes, apparatus for use with said composition comprising dispensing apparatus or wound dressing, a kit comprising the same, and methods of dispensing and curing the same and of using the same in sealing a wound dressing and in treating a wound site of a human in need thereof.

The purpose of the present invention is therefore to provide a thermally conductive composite tape which is in a form of sheet and, therefore, easy to handle, excellent in strength and electrical insulation, easily stick to an element or heat release-member, and shows strong adhesion to the heat-release member. The present invention provides a thermally conductive composite comprising a first thermally conductive adhesive layer, a reinforcing layer (A) layered on one surface of the first thermally conductive adhesive layer, and a second thermally conductive adhesive layer layered on a free surface of the reinforcing layer (A), wherein the first and second thermally conductive adhesive layers comprise, independently of each other, a silicone composition comprising the following components (a) to (e): 100 parts by mass of (a) linear or branched organopolysiloxane, 1,000 to 3,000 parts by mass of (b) thermally conductive filler, 100 to 500 parts by mass of (c) silicone resin, 1 to 10 parts by mass of (d) organohydrogenpolysiloxane, and 0.5 to 5 parts by mass of (e) organic peroxide.

The purpose of the present invention is therefore to provide a thermally conductive composite tape which is in a form of sheet and, therefore, easy to handle, excellent in strength and electrical insulation, easily stick to an element or heat release-member, and shows strong adhesion to the heat-release member. The present invention provides a thermally conductive composite comprising a first thermally conductive adhesive layer, a reinforcing layer (A) layered on one surface of the first thermally conductive adhesive layer, and a second thermally conductive adhesive layer layered on a free surface of the reinforcing layer (A), wherein the first and second thermally conductive adhesive layers comprise, independently of each other, a silicone composition comprising the following components (a) to (e): 100 parts by mass of (a) linear or branched organopolysiloxane, 1,000 to 3,000 parts by mass of (b) thermally conductive filler, 100 to 500 parts by mass of (c) silicone resin, 1 to 10 parts by mass of (d) organohydrogenpolysiloxane, and 0.5 to 5 parts by mass of (e) organic peroxide.

Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than −40° C.

Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than −40° C.

To provide a technique of improving adhesion of a resin molded article including a polyalkylene terephthalate resin to a silicon adhesive. A polyalkylene terephthalate resin is used in which an aromatic dicarboxylic acid excluding terephthalic acid, and/or an ester compound thereof is subjected to copolymerization as a modified component, and the content of the modified component relative to the total dicarboxylic acid component is at least 13 mol % and no more than 35 mol %. It is preferable if the modified polyalkylene terephthalate resin is a modified polybutylene terephthalate resin, and the aromatic dicarboxylic acid and/or an ester compound thereof is isophthalic acid and/or an ester compound thereof.

To provide a technique of improving adhesion of a resin molded article including a polyalkylene terephthalate resin to a silicon adhesive. A polyalkylene terephthalate resin is used in which an aromatic dicarboxylic acid excluding terephthalic acid, and/or an ester compound thereof is subjected to copolymerization as a modified component, and the content of the modified component relative to the total dicarboxylic acid component is at least 13 mol % and no more than 35 mol %. It is preferable if the modified polyalkylene terephthalate resin is a modified polybutylene terephthalate resin, and the aromatic dicarboxylic acid and/or an ester compound thereof is isophthalic acid and/or an ester compound thereof.

The invention described herein generally pertains to a composition that includes a silyl-terminated polymer having silyl groups linked to a polymer backbone via triazole. The silyl-terminated polymer is a reaction product of a functionalized polymer backbone and a functionalized silane. The polymer backbone includes a first functional group, which may be one of an azide or an alkyne. The functionalized silane includes a second functional group may also be one of an azide or an alkyne, but is also different from the first functional group. The functionalized polymer backbone is reacted with the functionalized silane in the presence of a metal catalyst.

The invention described herein generally pertains to a composition that includes a silyl-terminated polymer having silyl groups linked to a polymer backbone via triazole. The silyl-terminated polymer is a reaction product of a functionalized polymer backbone and a functionalized silane. The polymer backbone includes a first functional group, which may be one of an azide or an alkyne. The functionalized silane includes a second functional group may also be one of an azide or an alkyne, but is also different from the first functional group. The functionalized polymer backbone is reacted with the functionalized silane in the presence of a metal catalyst.

The present invention relates to a permanently attached UHF band RFID tire tag and a manufacturing method thereof, and more specifically, the present invention relates to a permanently attached UHF band RFID tire tag and a manufacturing method thereof, which is attached to a tire surface during the manufacturing process of a tire in a high-temperature and high-pressure environment, enabling the management of tire manufacturing history from the beginning of the production to product shipment, and thereafter, the durability is maintained even in the flexing motion of a tire that occurs while the tire is installed and operated in a vehicle such that chip damage of a tag and tag detachment from the tire do not occur, and therefore, it enables RFID communication to be performed without obstacles until the end of a tire life.