A cover for an ultrasound scanning assembly is provided, wherein the cover exerts compressive force on the patient during use. The cover includes an outer frame and a nonporous or porous film extending across the outer frame. The outer frame is formed of a soft touch material.

A cover for an ultrasound scanning assembly is provided, wherein the cover exerts compressive force on the patient during use. The cover includes an outer frame and a nonporous or porous film extending across the outer frame. The outer frame is formed of a soft touch material.

An adhesive composition for oil bleeding silicone rubber comprising any of: (A) an alcohol-based organic solvent solution adding 45 to 120 parts by weight of organometallic compound and 2 to 10 parts by weight of water, based on 100 parts by weight of vinyltrialkoxysilane, (B) a solution in which 5 parts by weight or less, preferably 1 to 5 parts by weight, of 3-aminopropyltrialkoxysilane is added to the above alcohol-based organic solvent solution (A), or (C) a solution in which uncrosslinked silicone rubber dissolved beforehand in an organic solvent is added to the above alcohol-based organic solvent solution (A) or (B) in which the amount of the organometallic compound is changed to 5 to 20 parts by weight, at a ratio of 0.1 to 5 wt. %, based on the total solid matters of vinyltrialkoxysilane and the organometallic compound. The adhesive composition has excellent adhesion to various substrates, including metals.

An adhesive composition for oil bleeding silicone rubber comprising any of: (A) an alcohol-based organic solvent solution adding 45 to 120 parts by weight of organometallic compound and 2 to 10 parts by weight of water, based on 100 parts by weight of vinyltrialkoxysilane, (B) a solution in which 5 parts by weight or less, preferably 1 to 5 parts by weight, of 3-aminopropyltrialkoxysilane is added to the above alcohol-based organic solvent solution (A), or (C) a solution in which uncrosslinked silicone rubber dissolved beforehand in an organic solvent is added to the above alcohol-based organic solvent solution (A) or (B) in which the amount of the organometallic compound is changed to 5 to 20 parts by weight, at a ratio of 0.1 to 5 wt. %, based on the total solid matters of vinyltrialkoxysilane and the organometallic compound. The adhesive composition has excellent adhesion to various substrates, including metals.

Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110 C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than 40 C.

Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110 C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than 40 C.

Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110 C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than 40 C.

Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110 C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than 40 C.

A two-component adhesive composition is disclosed. The adhesive composition comprises an isocyanate component comprising an isocyanate-terminated prepolymer that is the reaction product of a polyisocyanate and an isocyanate reactive component having an average molecular weight less than 1,500. The NCO content of the isocyanate component without solvent is between 9 and 18%. The composition further comprises a polyol component comprising a polyester polyol having a molecular weight greater than 1,500 that is the reaction product of a polyhydric alcohol and a polybasic acid. The composition still further comprises an adhesion promoter. The average functionality of the adhesive composition is from 2 to 2.4. The adhesive composition provides for improved performance and processability at a solid content greater than 45 wt %. A methods of forming the adhesive composition is also disclosed. A laminate formed by this method is also disclosed.

The present invention is a curable composition comprising a component (A) and a component (B), the curable composition producing a cured product that has a solid-state Si nuclear magnetic resonance spectrum in which a peak is observed within a range from 80 ppm or more to less than 40 ppm, and a half-width of the peak is 500 to 900 Hz, the component (A) being a curable polysilsesquioxane compound that comprises a repeating unit represented by a formula (a-1),
R.sup.1SiO.sub.3/2(a-1) the component (B) being at least one silane coupling agent selected from a group consisting of a silane coupling agent that comprises a nitrogen atom in its molecule, and a silane coupling agent that comprises an acid anhydride structure in its molecule, and a method for producing the curable composition, and a cured product, and a method for using the curable composition, and an optical device.