A pellicle is proposed in which an adhesive layer is formed of an adhesive which undergoes a hardness change at a rate from 50% through +50% of its initial hardness, measured after curing, when it is let to sit in atmosphere of a temperature of 300 degrees C. for 7 days on end; the rate of hardness change being defined by a following equation:
Rate of hardness change (%)={(hardness after the sitting)(initial hardness before the sitting)}initial hardness before the sitting)100.

A pellicle is proposed in which an adhesive layer is formed of an adhesive which undergoes a hardness change at a rate from 50% through +50% of its initial hardness, measured after curing, when it is let to sit in atmosphere of a temperature of 300 degrees C. for 7 days on end; the rate of hardness change being defined by a following equation:
Rate of hardness change (%)={(hardness after the sitting)(initial hardness before the sitting)}initial hardness before the sitting)100.

A fast response force sensor is disclosed. The fast response force sensor comprises a solid-state bonding (SSB) spacer and piezo material therein. The SSB spacer is sandwiched between a top stack and a bottom stack of the force sensor. The SSB spacer maintains a fixed relative position between a top stack and a bottom stack of the force sensor when a fixed force is applied or removed. The SSB spacer is in solid state and shall not be significantly deformed while being depressed by a user, and therefore the response time of an output signal is vastly determined by the properties of the piezo material of the force sensor when a force is applied against the force sensor. Therefore, a fast response force sensor can respond quickly to a force applied against it.

The present invention aims to provide an interlayer filling material for a touch panel which is used for filling an interlayer space between a touch panel and another component or an interlayer space between transparent conductive films included in the touch panel in production of a personal digital assistant and enables production of a touch panel laminate that is less likely to suffer cracks or breakage in a surface protection panel or a glass substrate. The present invention also aims to provide a touch panel laminate produced using the interlayer filling material for a touch panel. The present invention relates to an interlayer filling material for a touch panel used for filling an interlayer space between a touch panel and another component, or at least one interlayer spaces included in the touch panel between transparent conductive films, between a glass sheet and one of the transparent conductive films, between a glass sheet and another glass sheet, between a glass sheet and a polarizing film, between a substrate and a glass sheet, between a substrate and one of the transparent conductive films, and between a substrate and a polarizing film, the interlayer filling material containing: a polyvinyl acetal; and a plasticizer, the interlayer filling material having a flexural modulus at 25 C. of 2.410.sup.9 Pa or higher.

The present invention aims to provide an interlayer filling material for a touch panel which is used for filling an interlayer space between a touch panel and another component or an interlayer space between transparent conductive films included in the touch panel in production of a personal digital assistant and enables production of a touch panel laminate that is less likely to suffer cracks or breakage in a surface protection panel or a glass substrate. The present invention also aims to provide a touch panel laminate produced using the interlayer filling material for a touch panel. The present invention relates to an interlayer filling material for a touch panel used for filling an interlayer space between a touch panel and another component, or at least one interlayer spaces included in the touch panel between transparent conductive films, between a glass sheet and one of the transparent conductive films, between a glass sheet and another glass sheet, between a glass sheet and a polarizing film, between a substrate and a glass sheet, between a substrate and one of the transparent conductive films, and between a substrate and a polarizing film, the interlayer filling material containing: a polyvinyl acetal; and a plasticizer, the interlayer filling material having a flexural modulus at 25 C. of 2.410.sup.9 Pa or higher.

A moisture-curing two-component composition consisting of a component A containing at least one polyoxyalkylene, polyolefin and/or polyacrylate prepolymer having at least one hydrolysable silane group and at least one solid inert additive selected from hydrocarbons, polyesters or polyamides, a component B containing at least one crosslinking compound for the prepolymers, and auxiliary substances and additives in one or both components, the component A and the two-component composition each having hot-melt adhesive properties.

A moisture-curing two-component composition consisting of a component A containing at least one polyoxyalkylene, polyolefin and/or polyacrylate prepolymer having at least one hydrolysable silane group and at least one solid inert additive selected from hydrocarbons, polyesters or polyamides, a component B containing at least one crosslinking compound for the prepolymers, and auxiliary substances and additives in one or both components, the component A and the two-component composition each having hot-melt adhesive properties.

Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110 C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than 40 C.

Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110 C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than 40 C.

The invention relates to a crosslinkable one-component laminating adhesive containing 25 to 80 wt. % of polyester prepolymers, polyether prepolymers and/or polyurethane prepolymers, which have at least two cross-linkable alkoxysilane groups and have a molecular weight of 2000 to 30,000 g/mol, 75 to 19 wt. % of organic solvent having a boiling point up to 130 C., 1 to 20 wt. % of polymers which contain anhydride groups, and 0 to 15 wt. % of additives, wherein the viscosity of the adhesive is between 50 and 20,000 mPas (according to DIN ISO 2555), measured at 15 to 45 C.