The invention is directed to an aqueous binder composition for mineral fibers.

The present invention relates to a method for increasing the reactivity of lignin which method comprises the following steps; providing a mixture comprising lignin and an alkali solution wherein the concentration of the alkali solution of the mixture is between 5-50% by weight, storing said mixture for a period of at least 1 day whereby the reactivity of the lignin is increased. The present invention also relates to a resin composition comprising said lignin and use of said resin composition.

The present invention relates to a lignin-based phenolic resin, particularly useful in the manufacture of oriented strand boards (OSB).

The present invention relates to an activated lignin composition, its manufacture and its use thereof. It also relates to a resin comprising lignin, its manufacture and use.

The present invention relates to a process for preparing a bonding resin, wherein a resin prepared from lignin, phenol and formaldehyde is mixed with a resin prepared from phenol and formaldehyde to achieve a mixture useful as a bonding resin useful in the manufacture of laminates, mineral wool insulation and wood products such as plywood, laminated veneer lumber (LVL), medium density fiberboards (MDF) and particle boards.

The present invention relates to a process for preparing a bonding resin, wherein a resin prepared from lignin, phenol and formaldehyde and comprising a formaldehyde scavenger, is mixed with a resin prepared from phenol and formaldehyde and comprising a formaldehyde scavenger to achieve a mixture useful as a bonding resin useful in the manufacture of oriented strand board (OSB).

The present invention relates to an adhesive formulation comprising lignin, suitable for use in the manufacture of for example wood products. The lignin is provided in the form of a solution or dispersion or in dry solid form, such as in the form of a powder. The adhesive formulation also comprises phenol-formaldehyde (PF) resin and/or lignin-phenol-formaldehyde (LPF) resin. The adhesive formulation may also comprise extenders, hardeners, fillers and other additives, to achieve an adhesive formulation useful in the manufacture of for example wood products, such as plywood and laminated veneer lumber (LVL). The adhesive formulation can also be used in the manufacture of laminates and oriented strand boards.

The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of an aqueous solution and mixed with one or more of glycerol diglycidyl ether, polyglycerol diglycidyl ether, polyglycerol polyglycidyl ether, glycerol triglycidyl ether, sorbitol polyglycidyl ether, alkoxylated glycerol polyglycidyl ether, trimethylolpropane triglycidyl ether, trimethylolpropane diglycidyl ether, polyoxypropylene glycol diglycidylether, polyoxypropylene glycol triglycidyl ether, diglycidylether of cyclohexane dimethanol, resorcinol diglycidyl ether, isosorbide diglycidyl ether, pentaerythritol tetraglycidyl ether, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether having 2-9 ethylene glycol units, propylene glycol diglycidyl ether having 1-5 propylene glycol units, and/or diglycidyl ether of terminal diol having a linear carbon chain of 3-6 carbon atoms; and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards.

The present invention relates to a bonding resin comprising lignin and plasticizer. The invention also relates to a method for producing the bonding resin as well as the use of the bonding resin. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards. The bonding resin is also useful for example in composites, molding compounds and foundry applications.

The present invention relates to a new aqueous curable binder composition comprising a polyphenolic macromolecular compound which bears a multitude of catechol radicals (dihydroxybenzene), preferably lignosulfonate salts and condensed tannins and mixtures thereof, and a polyamine functional compound comprising primary and/or secondary and/or tertiary and/or quaternary amine functional groups, suitable for bonding particulate matter, such as fibers, more particulary mineral wool fibers, or particles, such as wood particles.