The present invention has for its object to provide an adhesive composition that is based on a naturally occurring material less likely to have adverse influences on the human body and has a tensile shear strength (adhesive strength) of at least 1 MPa with respect to a variety of adherends. The present invention provides an adhesive composition including at least a first pack and a second pack, wherein the first pack contains a tannic acid derivative in which a hydrogen atom in at least some hydroxyl group of tannic acid is substituted by a chain hydrocarbon group having at least one hydroxyl group, and the second pack contains a hydrocarbon having at least two cyanate groups or a derivative of the hydrocarbon.

A method for manufacturing a semiconductor device includes at least the following three steps. A step (A) of preparing a structure including a semiconductor wafer having a circuit-formed surface and an adhesive film attached to the circuit-formed surface side of the semiconductor wafer. A step (B) of back grinding a surface on a side opposite to the circuit-formed surface side of the semiconductor wafer. A step (C) of radiating ultraviolet rays to the adhesive film and then removing the adhesive film from the semiconductor wafer. In addition, as the adhesive film, an adhesive film having a base material layer, an antistatic layer, and an adhesive resin layer including a conductive additive in this order is used, and the adhesive film is used so that the adhesive resin layer faces the circuit-formed surface side of the semiconductor wafer.

Fiber-containing composites are described that include woven or non-woven fibers, and a binder that holds the fibers together. The binder may include the reaction product of a starch and a polycarboxylic acid. The starch has a weight average molecular weight that ranges from 110.sup.6 Daltons to 1010.sup.6 Daltons. The fiber-containing composite has an unaged tensile strength of greater than 4.0 and an aged tensile strength greater than 3.0. Also described are methods of making the fiber-containing composites. The methods may include applying a binder composition to fibers to form coated fibers, measuring a moisture content of the coated fibers, and curing the coated fibers in a curing oven to form the fiber-containing composite. The binder composition may include a starch having a weight average molecular weight that ranges from 110.sup.6 Daltons to 1010.sup.6 Daltons, and a polycarboxylic acid.

An algal bio-adhesive comprising algae mass, a crosslinking agent and an inorganic filler.

An algal bio-adhesive comprising algae mass, a crosslinking agent and an inorganic filler.

The invention provides a material having a structure including three or more anthracene structures per molecule as a photosensitive unit. That structure allows the material to remain in a liquid state at room temperature due to its reduced crystallinity. After coated on an application member in a liquid state, it is irradiated with light from outside so that it can be cured by way of photocrosslinking, and when heated, it returns back to the original state as the linkage is cleaved. By use of this material it is possible to form a reversibly detachable layer that serves as an adhesive layer at an interface to an application member and a coating layer at the surface of the application member.

Distiller's Grain (DG) based bio-adhesives consisting of DG biomass, crosslinking agents, and fillers are described as substitutes for formaldehyde based wood glue for making wood panels. Algal bio-adhesives consisting of algal biomass, crosslinking agents, and fillers are described as substitutes for formaldehyde based glue for making wood panels. Processes for preparing such DG based bio-adhesives and algal bio-adhesives are provided, comprising the steps of: combining DG biomass or algal material with a cross-linking agent and inorganic fillers to form a blend; micronization or homogenization of the blend to obtain powdery material; and mixing the powdery material with additional water to form a bio-adhesive.

Distiller's Grain (DG) based bio-adhesives consisting of DG biomass, crosslinking agents, and fillers are described as substitutes for formaldehyde based wood glue for making wood panels. Algal bio-adhesives consisting of algal biomass, crosslinking agents, and fillers are described as substitutes for formaldehyde based glue for making wood panels. Processes for preparing such DG based bio-adhesives and algal bio-adhesives are provided, comprising the steps of: combining DG biomass or algal material with a cross-linking agent and inorganic fillers to form a blend; micronization or homogenization of the blend to obtain powdery material; and mixing the powdery material with additional water to form a bio-adhesive.

Binders, resinated furnishes, and methods for making composite lignocellulose products therefrom. The binder can include about 70 wt % to about 99.7 wt % of an aldehyde-based resin, about 0.3 wt % to about 30 wt % of an isocyanate-based resin, about 10 wt % to about 63 wt % of an extender, and about 145 wt % to about 230 wt % of water, where all weight percent values are based on a combined solids weight of the aldehyde-based resin and the isocyanate-based resin. The binder has a long pot life and can be used with lignocellulose substrates having a water content of 10 wt % or more.

A method for manufacturing a semiconductor device includes at least the following three steps. A step (A) of preparing a structure including a semiconductor wafer having a circuit-formed surface and an adhesive film attached to the circuit-formed surface side of the semiconductor wafer. A step (B) of back grinding a surface on a side opposite to the circuit-formed surface side of the semiconductor wafer. A step (C) of radiating ultraviolet rays to the adhesive film and then removing the adhesive film from the semiconductor wafer. In addition, as the adhesive film, an adhesive film having a base material layer, an antistatic layer, and an adhesive resin layer including a conductive additive in this order is used, and the adhesive film is used so that the adhesive resin layer faces the circuit-formed surface side of the semiconductor wafer.