The invention relates to an adhesive composition comprising: ground pea seeds comprising between 5 wt % and 40 wt % of crude proteins on the total weight of the ground pea seeds, an amine-based azetidinium-functional cross-linker, and water.

The invention also relates to an article and its preparation process, use of the adhesive composition according to the invention, and use of ground pea seeds.

Disclosed are an adhesive film which may be applied to not only rigid electronic devices but also soft electronic devices by having excellent mechanical strength and adhesive strength due to hydrogen bonding and galloyl interaction, as well as high transparency, coating uniformity, and flexibility, an adhesive member including the same, and a bonding method using the same.

Disclosed are an adhesive film which may be applied to not only rigid electronic devices but also soft electronic devices by having excellent mechanical strength and adhesive strength due to hydrogen bonding and galloyl interaction, as well as high transparency, coating uniformity, and flexibility, an adhesive member including the same, and a bonding method using the same.