Provided is a hot-melt adhesive which satisfies both solidification rate and adhesiveness. A base polymer for a hot-melt adhesive which satisfies the following (1) and (2): (1) a modulus of elasticity in tension at 23° C. is 400 MPa or less; and (2) a semi-crystallization time at 23° C. is 20 minutes or less.

Provided is a hot-melt adhesive which satisfies both solidification rate and adhesiveness. A base polymer for a hot-melt adhesive which satisfies the following (1) and (2): (1) a modulus of elasticity in tension at 23° C. is 400 MPa or less; and (2) a semi-crystallization time at 23° C. is 20 minutes or less.

A composite film 10 according to the present invention is provided with: a resin film 1 which is formed of a cured product of a photocurable adhesive composition; and solid particles 3 which are affixed, in the form of a single layer, to the resin film 1, while having edges thereof exposed from one and the other main surfaces of the resin film 1. The resin film 1 is formed by irradiating an adhesive layer 1a in a semi-cured state with light 13, said adhesive layer 1a being formed of the adhesive composition.

A method for bonding a fabric to a polyolefin elastomer. The method comprises applying to the fabric: (a) from 10 to 90 wt % of an aqueous dispersion of a thermoplastic polymer; and (b) from 90 to 10 wt % of an aqueous dispersion of a rosin, wherein percentages are based on total dry weight of thermoplastic polymer and rosin.

The present invention relates to self-foaming hot melt adhesive compositions and methods of making and using the same. Self-foaming hot melt adhesive compositions are formed by admixing a dispersion concentrate including a chemical blowing agent and a compatible carrier (liquid or molten) with a molten base hot melt adhesive composition at a temperature below the decomposition temperature of the chemical blowing agent. The resolidified material is processed through a device that heats the material above the decomposition temperature of the chemical agent and cools it below such temperature before being dispensed. The device preferably includes sensors and a controller configured to prevent the material from accumulating an adverse thermal history during processing.

The present invention relates to self-foaming hot melt adhesive compositions and methods of making and using the same. Self-foaming hot melt adhesive compositions are formed by admixing a dispersion concentrate including a chemical blowing agent and a compatible carrier (liquid or molten) with a molten base hot melt adhesive composition at a temperature below the decomposition temperature of the chemical blowing agent. The resolidified material is processed through a device that heats the material above the decomposition temperature of the chemical agent and cools it below such temperature before being dispensed. The device preferably includes sensors and a controller configured to prevent the material from accumulating an adverse thermal history during processing.

A double-sided adhesive sheet has a laminate structure including a first adhesive layer containing an electrolyte, a second adhesive layer, and a conduction substrate. A double-sided adhesive sheet joined body includes, for example, an adhesive sheet having such a laminate structure, a first conductive adherend to which the first adhesive layer adheres, and a second adherend to which the second adhesive layer adheres. A method for joining/separating adherends includes joining first and second adherends to each other via the adhesive sheet, then applying a voltage to the first adhesive layer so as to generate a potential difference in a thickness direction of the first adhesive layer, and separating the first and second adherends from each other.

A double-sided adhesive sheet has a laminate structure including a first adhesive layer containing an electrolyte, a second adhesive layer, and a conduction substrate. A double-sided adhesive sheet joined body includes, for example, an adhesive sheet having such a laminate structure, a first conductive adherend to which the first adhesive layer adheres, and a second adherend to which the second adhesive layer adheres. A method for joining/separating adherends includes joining first and second adherends to each other via the adhesive sheet, then applying a voltage to the first adhesive layer so as to generate a potential difference in a thickness direction of the first adhesive layer, and separating the first and second adherends from each other.

An approach for curing ultraviolet sensitive polymer materials (e.g., polymer inks, coatings, and adhesives) using ultraviolet radiation is disclosed. The ultraviolet sensitive polymer materials curing can utilize ultraviolet light at different wavelength emissions arranged in a random, mixed or sequential arrangement. In one embodiment, an ultraviolet light C (UV-C) radiation emitter having a set of UV-C sources that emit UV-C radiation at a predetermined UV-C duration and intensity operate in conjunction with an ultraviolet light B (UV-B) radiation emitter having a set of UV-B sources configured to emit UV-B radiation at a predetermined UV-B duration and intensity and/or an ultraviolet light A (UV-A) radiation emitter having a set of UV-A sources configured to emit UV-A radiation at a predetermined UV-A duration and intensity, to cure the ultraviolet sensitive polymer materials.

An approach for curing ultraviolet sensitive polymer materials (e.g., polymer inks, coatings, and adhesives) using ultraviolet radiation is disclosed. The ultraviolet sensitive polymer materials curing can utilize ultraviolet light at different wavelength emissions arranged in a random, mixed or sequential arrangement. In one embodiment, an ultraviolet light C (UV-C) radiation emitter having a set of UV-C sources that emit UV-C radiation at a predetermined UV-C duration and intensity operate in conjunction with an ultraviolet light B (UV-B) radiation emitter having a set of UV-B sources configured to emit UV-B radiation at a predetermined UV-B duration and intensity and/or an ultraviolet light A (UV-A) radiation emitter having a set of UV-A sources configured to emit UV-A radiation at a predetermined UV-A duration and intensity, to cure the ultraviolet sensitive polymer materials.