C09J201/00

PRESSURE-SENSITIVE ADHESIVE SHEET

The present invention relates to a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer containing a base polymer and a pigment, the pressure-sensitive adhesive sheet having a transmittance for light having wavelengths of 380-600 nm of 25% or less, transmittance for light having wavelengths 800-2,500 nm of 60% or greater, and a change in light transmittance in the wavelength range of 600 to 800 nm of 0.1%/nm or greater.

PRESSURE-SENSITIVE ADHESIVE SHEET

The present invention relates to a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer containing a base polymer and a pigment, wherein the light transmittance in the wavelength range of 380 to 500 nm is 25% or less, the light transmittance in the wavelength range of 800 to 2,500 nm is 60% or more, L* defined by the L*a*b* color space is or less, a* is −10 or more and 40 or less, and b* is −20 or more and 30 or less.

METHOD FOR MANUFACTURING BONDED OBJECT AND BONDED OBJECT MANUFACTURING APPARATUS
20230130441 · 2023-04-27 ·

A bonded object manufacturing apparatus is for manufacturing a bonded object in which a first object and a second object, which is more flexible than the first object, are bonded by a bonding agent, viscosity of which is variable, and includes: a bonding agent supplier that supplies the bonding agent to a first or second bonding surfaces; a thickening unit that increases the viscosity of the bonding agent; and a loading unit that applies a load to and deforms the second object against the bonding agent that closely adheres to the first bonding surface and becomes harder than the second object. In a method for manufacturing a bonded object, the first and second bonding surfaces are brought close to each other to hold the bonding agent therebetween, the bonding agent closely adheres to a required portion of the first bonding surface, and the second object is loaded and deformed against the bonding agent that closely adheres to the first bonding surface and is harder than the second object.

THREADLIKE ADHESIVE STICKING APPARATUS AND METHOD OF STICKING THREADLIKE ADHESIVE
20230126074 · 2023-04-27 ·

A threadlike adhesive sticking apparatus of the present invention is an adhesive sticking apparatus that presses a threadlike adhesive wound around a winding body against an object while feeding out the threadlike adhesive, and includes an assist mechanism configured to apply an external force in a feeding direction to the threadlike adhesive fed out from the winding body, and a pressing unit configured to press the threadlike adhesive fed out from the winding body against the object.

Method for manufacturing semiconductor device, heat-curable resin composition, and dicing-die attach film
11634614 · 2023-04-25 ·

A method for manufacturing a semiconductor device according to an aspect of the present disclosure includes a step of preparing a dicing/die-bonding integrated film including an adhesive layer formed of a heat-curable resin composition having a melt viscosity of 3100 Pa.Math.s or higher at 120° C., a tacky adhesive layer, and a base material film; a step of sticking a surface on the adhesive layer side of the dicing/die-bonding integrated film and a semiconductor wafer together; a step of dicing the semiconductor wafer; a step of expanding the base material film and thereby obtaining adhesive-attached semiconductor elements; a step of picking up the adhesive-attached semiconductor element from the tacky adhesive layer; a step of laminating this semiconductor element to another semiconductor element, with the adhesive interposed therebetween; and a step of heat-curing the adhesive.

Conductive adhesive

There is provided a conductive adhesive with which the connection stability between objects that are conductive members is excellent, the connection stability is maintained even when the conductive adhesive is subjected to high temperature, and rising towards the back side of an object is less likely to occur. A conductive adhesive 1 includes a binder component 12, and metal particles (A) 11 having a 20% compressive strength of 25 MPa or less in a 170° C. environment. The metal particles 11 preferably include a metal having a melting point of 280° C. or less. The content of the metal having a melting point of 280° C. or less in the metal particles (A) 11 is preferably 80% by mass or more.

Conductive adhesive

There is provided a conductive adhesive with which the connection stability between objects that are conductive members is excellent, the connection stability is maintained even when the conductive adhesive is subjected to high temperature, and rising towards the back side of an object is less likely to occur. A conductive adhesive 1 includes a binder component 12, and metal particles (A) 11 having a 20% compressive strength of 25 MPa or less in a 170° C. environment. The metal particles 11 preferably include a metal having a melting point of 280° C. or less. The content of the metal having a melting point of 280° C. or less in the metal particles (A) 11 is preferably 80% by mass or more.

Gas separation membrane module

The present disclosure provides a gas separation membrane module that has high, long-term utility. The present disclosure provides a gas separation membrane module that has: a housing; a gas separation membrane that is arranged inside the housing; and an adhesive part that fixes the gas separation membrane to the housing.

Solvent composition and production method therefor
11629237 · 2023-04-18 · ·

A solvent composition includes an organic solvent including one or more organic solvents (A) and one or more organic solvents (B), and one or more types of core-shell polymer particles each comprising a core layer and a shell layer. The organic sol vents (A) have a polar teen δp of a Hansen solubility parameter of less than 11 and a hydrogen bond term δh of less than 10, and the organic solvents (B) satisfy at least one of 11 or more of the polar term δp or 10 or more of the hydrogen bond term δh. A weight ratio of (A) to (B) ranges from 15:85 to 95:5. Based on a total weight of the solvent composition, a content of the core-shell polymer particles is 20 to 40% by weight and a water content is 1% by weight or less.

Image display device and circularly polarizing plate with photosensitive adhesive

An image display device which suppresses destruction of an image display panel due to static electricity carried by a phase difference film, and has excellent adhesiveness between the phase difference film and the image display panel even in a moisture-heat environment, and a circularly polarizing plate with a photosensitive adhesive. The image display device includes a circularly polarizing plate having a linear polarizer and a phase difference film, and an image display panel in this order from a viewing side, in which the phase difference film and the image display panel are bonded by a pressure-sensitive adhesive, the phase difference film has an optically anisotropic layer obtained by polymerizing a polymerizable liquid crystal composition containing at least one kind of polymerizable liquid crystal compound having a predetermined structure, and the pressure-sensitive adhesive contains a polymer having an acid value of 1 to 30 mgKOH/g and an antistatic agent.