The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol % of the (A1) residue and 0.01-60 mol % of the (B1) residue.

The present application relates to a pressure-sensitive adhesive composition for a foldable display and a use thereof. The pressure-sensitive adhesive composition of the present application has excellent bending reliability while having appropriate adhesive force and cohesive force, thereby being useful for forming a pressure-sensitive adhesive layer for a foldable display having improved release force.

A temporary adhesive is good peelability, heat resistance and cleaning removability after polishing of the rear surface of the wafer. A layered body for processing a rear surface of a wafer opposite to a circuit surface of the wafer, the layered body being a temporary adhesive loaded between a support and circuit surface of the wafer and including an adhesive layer (A) that includes a polyorganosiloxane to be cured by a hydrosilylation reaction and is releasably bonded, and a separation layer (B) includes a polyorganosiloxane and is releasably bonded, in which the polyorganosiloxane forming the separation layer (B) is a polyorganosiloxane containing a siloxane unit of RRSiO.sub.2/2 (provided that each R is bonded to a silicon atom as a SiC bond), and at least one R is an aralkyl group, epoxy group, or phenyl group. Methods for producing and separating these layered bodies and composition for forming the separation layer.

The present disclosure is directed to a method of making a composite part. The method comprises covering a mold tool for a composite part with a parting film. The method further comprises laying up at least one layer of pre-preg on the parting film covering the mold tool to form a laid-up composite part and removing the laid-up composite part from the parting film. The parting film comprises a polymer sheet having a first major surface and a second major surface; and a first adhesive disposed on the first major surface of the polymer sheet, the first adhesive adhering the polymer sheet to the mold tool.

A method for creating and using a repositionable adhesive coated slip sheet is described herein. This repositionable adhesive coated slip sheet attaches to a worktable and temporarily anchors a substrate and its cutouts while the substrate is cut. The method principally comprises the steps of placing a layer of adhesive onto the top surface of a binding layer, placing the binding layer onto a worktable, placing a substrate onto the layer of adhesive, cutting the substrate with a blade, and then removing the cut substrate from the layer of adhesive, wherein the parts cut therefrom are prevented from moving, slipping, or falling off of the worktable during the cutting process. This allows the substrate and the cutouts cut therefrom to be removed from the worktable at the completion of the cutting process without damage to the worktable, cutter, or substrate.

A puncture sealing agent is disclosed which comprises natural rubber latex, an aqueous solution of an adhesive, and an antifreezing agent. The natural rubber latex, the aqueous solution of the adhesive and the antifreezing agent are natural components and the adhesive is a carbohydrate.

An electronic apparatus includes an electronic panel foldable together with a window; and a first functional layer and a second functional layer each foldable together with the window and the electronic panel. The second functional layer is disposed farther from the window than the first functional layer, and has a thickness in a range from about 30 micrometers to about 50 micrometers and a modulus in a range from about 3 gigapascals to about 8 gigapascals, and the first functional layer is disposed closer to the window than the second functional layer, and has both a thickness equal to or greater than that of the second functional layer, and a modulus less than that of the second functional layer.

A polymer foam adhesive tape including: a substrate film; a polymer foam layer provided on one surface of the substrate film; a first adhesive layer provided on the polymer foam layer; and a second adhesive layer provided on the other surface of the substrate film, in which the polymer foam adhesive tape has a dielectric constant of 2.5 to 4.5 at a frequency of 10.sup.5 Hz.

The present invention relates to a thermally conductive adhesive composition having excellent mechanical properties and a method of manufacturing the same. Further, the present invention relates to method of manufacturing an article comprising the thermally conductive adhesive composition and articles obtainable by the described method.

The present invention relates to a kneadable adhesive sealant composition comprising a first outer portion of a first material comprising an uncured reactive polymer or resin composition and a second inner portion of a second material comprising a curing agent capable of curing the uncured reactive polymer or resin composition, wherein the first portion substantially surrounds the second portion and a process for making the same.