A decorative sheet according to one aspect of the present disclosure comprises a decorative plate and an adhesive layer disposed on a first side of the decorative plate. The decorative plate comprises (A) a decorative layer disposed on a second side from the first side, (B) a core layer made of a prepreg containing a fiber base material, and (C) a balancing layer including mixed paper containing an endothermic metal hydroxide as a base material.

Polar silane linkers are provided that attach to resins to form silane-functionalized resins. The functionalized resins can be bound to hydroxyl groups on the surface of silica particles to improve the dispersibility of the silica particles in rubber mixtures. Further disclosed are synthetic routes to provide the silane-functionalized resins, as well as various uses and end products that benefit from the unexpected properties of the silane-functionalized resins. Silane-functionalized resins impart remarkable properties on various rubber compositions, such as tires, belts, hoses, brakes, and the like. Automobile tires incorporating the silane-functionalized resins are shown to possess excellent results in balancing the properties of rolling resistance, tire wear, and wet braking performance.

A temperature-variable adhesive sheet, and a method for manufacturing a temperature-variable adhesive sheet using the same are provided. The adhesive sheet includes a first adhesive layer and a second adhesive layer consecutively provided on a barrier film, wherein initial adhesive strength between the second adhesive layer and a SUS304 substrate is 200 gf/in or less, and adhesive strength, after 20 minutes passed under a condition of 50 C. and 5 atmospheres, is 400 gf/in or greater.

A moisture barrier material including a carrier, an adhesive layer formed on at least one surface of the carrier, and a release treated liner, wherein the moisture barrier material has a non-planar shape.

The present invention aims to provide a curable resin composition which has low viscosity as well as properties such as high elongation property, high tensile strength, and hydrogen gas barrier property. A curable resin composition includes the following ingredients (A) to (D): ingredient (A): a vinyl polymer having one or more alkenyl groups in one molecule; ingredient (B): a compound having one or more hydrosilyl groups in one molecule; ingredient (C): a hydrosilylation catalyst; ingredient (D): a polyfunctional vinyl ether compound.

An adhesive sheet capable of bonding adhesive layers together at normal temperatures, with little stickiness of the adhesive layers due to a plasticizer seeping out from a substrate providing a protective material using the adhesive sheet and a wire harness. An adhesive sheet including: a substrate containing 20-100 parts by mass of a polyester-based plasticizer to 100 parts by mass of a vinyl halide-based resin; a primer layer; adhesive layers included amount of a tackifier is 0-250 parts by mass and the inorganic microparticles is 0-250 parts by mass to 100 parts by mass of an elastomer, and a total value of the included amounts of the tackifier and the inorganic microparticles is 0-350 parts by mass; wherein the adhesive layers probe tack of 7 N/cm2 or less with ASTM D 2979, and the adhesive force between the adhesive layers width of 15 mm is 1.5 N or more.

The present invention is an assembly layer for a flexible device. Within a temperature range of between about 30 C. to about 90 C., the assembly layer has a shear storage modulus at a frequency of 1 Hz that does not exceed about 2 MPa, a shear creep compliance (J) of at least about 610.sup.6 l/Pa measured at 5 seconds with an applied shear stress between about 50 kPa and about 500 kPa, and a strain recovery of at least about 50% at at least one point of applied shear stress within the range of about 5 kPa to about 500 kPa within about 1 minute after removing the applied shear stress.

Provided is a reaction-curable adhesive that exhibits an excellent adhesive strength even under a low-temperature environment. The reaction-curable adhesive includes an epoxy compound and an amine compound, the reaction-curable adhesive being cured through a reaction between the epoxy compound and the amine compound, in which a compound having a specific molecular structure is used as at least one of the epoxy compound or the amine compound.

Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively prevent moisture or oxygen added to an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively prevent moisture or oxygen added to an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.