The invention relates to an adhesive tape with a carrier composed of a film, there being applied on one side of the carrier an adhesive based on natural rubber or synthetic rubber, where the film is a biaxially oriented film made of polypropylene, polyethylene or polyester such as PET, and on the side of the carrier not coated with adhesive there is a release layer, based in particular on carbamate.

The present invention is directed toward an adhesive composition comprising: a first component; and a second component that chemically reacts with the first component, the second component comprising: a polythiol curing agent; and an alkanolamine. Also disclosed are methods of forming a bond between two substrates and adhesive bonds.

A thin adhesive tape includes a base and an adhesive layer provided on one surface of the base, wherein the base has a thickness of 2 to 25 m, the adhesive layer has a thickness of 0.1 to 10 m, the adhesive tape has a thickness of 30 m or less, the adhesive tape has a peel adhesion of 0.50 N/10 mm or more in accordance with JIS Z 0237:2000, and the adhesive tape has a strength to repel members calculated by the following formula of 70 MPa.Math.mm or less, the adhesive tape being excellent in a balance between fixability of members and followability to members:

Strength to repel members (MPa.Math.mm)=tensile elastic modulus (MPa) of adhesive tapethickness (mm) of adhesive tape.

The invention provides an adhesive composition. The adhesive composition includes a halohydrin compound, a blocked isocyanate compound and latex, in which the adhesive composition does not include resorcinol, formaldehyde and epoxy compound. The invention also provides a method for treating organic fiber. The method includes impregnating an organic fiber or a fabric with the abovementioned adhesive composition; and drying the organic fiber or the fabric.

The invention provides a synthetic rubber pressure-sensitive adhesive which has excellent heat resistance and substrate adhesiveness, is capable of inhibiting offset, peeling or the like even in a high-temperature environment and is suitable for applications in a high-temperature environment, a pressure-sensitive adhesive sheet and a polishing member laminate. The synthetic rubber pressure-sensitive adhesive of the invention contains: a synthetic rubber (A) including a styrene-isoprene block copolymer, an adhesion-imparting resin (B), and a fatty acid ester (C) with a weight reduction rate of 1 wt % or less after being heated at 150 C. for 10 minutes. Based on 100 parts by weight of the synthetic rubber (A), the content of the adhesion-imparting resin (B) is set as 5 parts by weight to 60 parts by weight, and the content of the fatty acid ester (C) is set as 0.1 parts by weight to 10 parts by weight.

Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

An adhesive strain sensing pod includes at least one strain sensor, electronics for electrically sensing at least one strain signal from the at least one strain sensor, and a sensor adhesive for adhering the strain sensor to a surface of a structural element. The pod may have a protective case for protecting the strain sensor and the electronics and for transferring at least part of a force, pressing the pod against the surface, to press the strain sensor against the surface. The sensor adhesive may be a liquid adhesive contained in a fragile pouch that ruptures when the pod is forced against the surface, or may be a thermally activated adhesive film that is activated to bond the strain sensor to the surface. A protective film may protect the sensor adhesive prior to installation of the pod and is removed prior to installation of the pod on the surface.

A process for adhesively bonding at least two substrates includes the application to the at least two substrates of an uncured adhesive formulation. The uncured adhesive formulation includes at least two curable resin components of epoxy novolac resin, bisphenol A-epichlorohydrin epoxy, or 4,4-Isopropylidenediphenol, oligomeric reaction products with 1-chloro-2,3-epoxypropane in a total amount of at least 60 total weight percent. An epoxy curing agent is also present in the formulation. The uncured adhesive formulation cures at an elevated onset temperature of at least 140 C. to adhesively bonding the at least two substrates. The adhesive formulation is also provided with a cure accelerator. An assembly is provided that includes a first substrate of nylon or carbon fiber filled polymer and a second substrate of nylon or carbon fiber filled polymer. A layer of the cured adhesive formulation is present in simultaneous contact with the first substrate and the second substrate.

The present disclosure is directed to a precursor composition for a curable adhesive, the precursor comprising: a) a part (A) comprising: i. a first epoxy curing agent comprising at least one polyether amine and having an amine equivalent weight of at least 45 grams per mole of amine equivalents; ii. a second epoxy curing agent distinct from the first epoxy curing agent; iii. a metal nitrate catalyst; iv. optionally, a metal triflate catalyst; and b) a part (B) comprising: i. an epoxy resin; ii. a filler material; iii. an epoxy-based reactive diluent; and iv. optionally, a core-shell polymer toughening agent; and wherein the amount of filler material is selected such as to provide the part (B) with a hysteresis area of at least 30 Pa1/s, when measured at 23 C according to the test method described in the experimental section. The compositions of the present disclosure are particularly suitable for use in structural bonding applications, in particular for adhesively bonding small parts in manufacturing operations in aeronautic and aerospace industries. The present disclosure also relates to method of using such epoxy resin based curable compositions.