A building material comprising a substrate layer and a pressure-sensitive adhesive layer, where the pressure-sensitive adhesive layer includes expandable graphite.

The present invention provides: an adhesive composition for sealing an electronic device, the adhesive composition comprising an isobutylene-isoprene copolymer as a main component, the isobutylene-isoprene copolymer having a content of repeating units derived from isoprene of 0.1 to 99 mol % based on total repeating units; an adhesive sheet comprising a gas barrier film, and an adhesive layer that is formed on the gas barrier film, the gas barrier film having a water vapor transmission rate at a temperature of 40° C. and a relative humidity of 90% of 0.1 g/m.sup.2/day or less, and having a total light transmittance of 80% or more, and the adhesive layer comprising an adhesive composition that comprises an isobutylene-isoprene copolymer as a main component; and an electronic device or the like in which the adhesive composition and the adhesive sheet are used as a sealant for an organic electroluminescent element or the like. According to the present invention, provided are: an adhesive composition that is useful as a material for forming an adhesive layer that exhibits an excellent water barrier capability and excellent adhesion; an adhesive sheet; and an electronic device or the like.

The present invention provides: an adhesive composition for sealing an electronic device, the adhesive composition comprising an isobutylene-isoprene copolymer as a main component, the isobutylene-isoprene copolymer having a content of repeating units derived from isoprene of 0.1 to 99 mol % based on total repeating units; an adhesive sheet comprising a gas barrier film, and an adhesive layer that is formed on the gas barrier film, the gas barrier film having a water vapor transmission rate at a temperature of 40° C. and a relative humidity of 90% of 0.1 g/m.sup.2/day or less, and having a total light transmittance of 80% or more, and the adhesive layer comprising an adhesive composition that comprises an isobutylene-isoprene copolymer as a main component; and an electronic device or the like in which the adhesive composition and the adhesive sheet are used as a sealant for an organic electroluminescent element or the like. According to the present invention, provided are: an adhesive composition that is useful as a material for forming an adhesive layer that exhibits an excellent water barrier capability and excellent adhesion; an adhesive sheet; and an electronic device or the like.

An adhesive agent that is favorable in terms of peeling form, adhesive strength, and viscosity is provided. The adhesive agent contains an epoxy resin (A), fine polymer particles (B), and a non-crosslinked acrylic resin (C). With respect to 100 parts by mass of the epoxy resin (A), 1 part by mass to 100 parts by mass of fine polymer particles (B) and 1 part by mass to 100 parts by mass of a non-crosslinked acrylic resin (C) are contained in the adhesive agent. The fine polymer particles (B) contain a rubber-containing graft copolymer that includes (i) an elastic body containing a specific material and (ii) a graft part containing a specific material.

A display apparatus includes an adhesive layer disposed between a display panel and a cover member. The adhesive layer includes an adhesive member, and the adhesive member includes an acrylic copolymer including a first repeating unit having a glass transition temperature of −50° C. or less, a second repeat unit having a glass transition temperature of −45° C. to −10° C., and a third repeating unit having a glass transition temperature of 90° C. or more and the acrylic copolymer having a degree of crosslinking of 55% to 65%. The adhesive member further includes an elastomer and an inorganic nanofiller.

The present invention relates to an adhesive composition containing a base polymer, a water-absorbing material, and a moisture-curable component, wherein the moisture-curable component is contained in an unreacted state, an adhesive layer made from the adhesive composition, and an adhesive sheet including the adhesive layer.

Provided is a PSA sheet comprising a fabric sheet and a PSA layer laminated on the fabric sheet. The PSA layer comprises a base polymer and a tackifier resin. The base polymer is a block copolymer of a monovinyl-substituted aromatic compound and a conjugated diene compound. The PSA layer has a thickness greater than 100 μm and less than 190 μm.

A method of and system for adhesive bonding. The method and system a) treat a surface of an element to be bonded to provide an adherent structure including one or more rubber compounds on the surface; b) place a polymerizable adhesive composition, including at least one photoinitiator and at least one energy converting material, in contact with the adherent structure and two or more components to be bonded to form an assembly, c) irradiated the assembly with radiation at a first wavelength, capable of conversion by the at least one energy converting material, to a second wavelength capable of activating the at least one photoinitiator to produce from the polymerizable adhesive composition a cured adhesive composition; and d) adhesively join the two or more components by way of the adherent structure and the cured adhesive composition.

The invention relates to an adhesive-coated polymer substrate comprising (a) a polymer substrate containing or consisting of a thermoplastic polymer with a Vicat A50 softening point according to DIN EN ISO 306 of up to 220° C., and (b) an adhesive composition coated directly on at least one side of the polymer substrate, wherein the adhesive composition (b) is a UV-curable or UV-cured hot melt pressure sensitive adhesive (PSA). The invention relates moreover to a process for the manufacture of the adhesive-coated polymer substrate as well as to the use thereof.

The present invention is an assembly layer for a flexible device. Within a temperature range of between about −30° C. to about 90° C., the assembly layer has a shear storage modulus at a frequency of 1 Hz that does not exceed about 2 MPa, a shear creep compliance (J) of at least about 6×10.sup.−6 1/Pa measured at 5 seconds with an applied shear stress between about 50 kPa and about 500 kPa, and a strain recovery of at least about 50% at at least one point of applied shear stress within the range of about 5 kPa to about 500 kPa within about 1 minute after removing the applied shear stress. The assembly layer includes at least one of a polyisoprene, a polybutadiene, an olefin block copolymer, a polyisobutylene, and high alkyl polyolefin.