An adhesive sheet capable of bonding adhesive layers together at normal temperatures, with little stickiness of the adhesive layers due to a plasticizer seeping out from a substrate providing a protective material using the adhesive sheet and a wire harness. An adhesive sheet including: a substrate containing 20-100 parts by mass of a polyester-based plasticizer to 100 parts by mass of a vinyl halide-based resin; a primer layer; adhesive layers included amount of a tackifier is 0-250 parts by mass and the inorganic microparticles is 0-250 parts by mass to 100 parts by mass of an elastomer, and a total value of the included amounts of the tackifier and the inorganic microparticles is 0-350 parts by mass; wherein the adhesive layers probe tack of 7 N/cm2 or less with ASTM D 2979, and the adhesive force between the adhesive layers width of 15 mm is 1.5 N or more.

Adhesive tapes include a plasticized polyvinyl chloride backing, a primer including an ethylene/carbon monoxide-containing terpolymer, and an adhesive.

An automated method of manufacturing a decoupling underlayment membrane is provided, the method retrieving a membrane sheet, thermoforming a set of cavities into a top surface of the membrane sheet and pressing a set of through holes into the membrane sheet.

Provided is a sticky cleaner whose adhesive face can be easily renewed and whish is less susceptible to roll-loosening. The sticky cleaner provided by this invention comprises a PSA tape having an adhesive face on the first face of a substrate. The PSA tape forms a PSA tape roll wound with the adhesive face on the outside. On the first face of the substrate, the PSA tape comprises a first layer formed of a PSA and a second layer formed of an acrylic viscoelastic material. The adhesive face comprises first sections where the first layer is exposed and second sections where the second layer is exposed. The second sections protrude further out of the PSA tape roll relative to the first sections. The PSA tape roll shows an unwinding force F.sub.0 at 0 C. and an unwinding force F.sub.30 at 30 C.

A one-component heat-curing epoxy resin adhesive has at least one epoxy resin having an average of more than one epoxy group per molecule; at least one latent hardener for epoxy resins; and at least one carboxylic acid selected from substituted or unsubstituted adipic acid, substituted or unsubstituted succinic acid, substituted or unsubstituted phthalic acid, substituted or unsubstituted terephthalic acid, substituted or unsubstituted isophthalic acid, substituted or unsubstituted benzenetricarboxylic acid and substituted or unsubstituted nitrobenzoic acid, excluding 2-hydroxysuccinic acid and 2,3-dihydroxysuccinic acid as carboxylic acid, and wherein the epoxy resin adhesive contains 0.0015 to 0.04 mol of the at least one carboxylic acid per 100 g of the epoxy resin adhesive and the epoxy resin adhesive has a viscosity of 500-5000 Pas at 25 C. The epoxy resin adhesive is notable for a very heat-resistant bond on particular metal substrates such as steel having a zinc-magnesium coating.

The invention relates to an adhesive tape with a carrier composed of a film, there being applied on one side of the carrier an adhesive based on natural rubber or synthetic rubber, where the film is a biaxially oriented film made of polypropylene, polyethylene or polyester such as PET, and on the side of the carrier not coated with adhesive there is a release layer, based in particular on carbamate.

An adhesive article includes a pressure-sensitive adhesive layer with a release liner releasably adhered thereto. The release liner comprises a thermoplastic polymer and a first release agent represented by the formula: Each R.sup.1 represents a hydrocarbylene group having from 2 to 40 carbon atoms; each R.sub.f independently represents a perfluorinated alkyl group of having 3 to 5 carbon atoms; and each X.sup.1 is NH or a covalent bond. Methods of making the adhesive articles are also disclosed. ##STR00001##

Several embodiments of the present technology are directed to bonding sheets having enhanced plasma resistant characteristics, and being used to bond to semiconductor devices. In some embodiments, a bonding sheet in accordance with the present technology comprises a base bond material having one or more thermal conductivity elements embedded therein, and one or more etched openings formed around particular regions or corresponding features of the adjacent semiconductor components. The bond material can include PDMS, FFKM, or a silicon-based polymer, and the etch resistant components can include PEEK, or PEEK-coated components.

A fastening tape, mechanical fastener, methods of making them, and personal hygiene articles including them are disclosed. The fastening tape includes a tape backing having a fastening portion, an adhesive disposed on the fastening portion, and a release surface for the adhesive. The release surface is a either a release tape attached along one of its edges to the tape backing or a release coating disposed on at least a portion of a surface of the tape backing. At least one of the tape backing or the release surface comprises a microporous film having an opaque, microporous region and at least one see-through region of lower porosity within the opaque, microporous region. The mechanical fastener includes such a microporous film and mechanical fastening elements on at least one surface. The at least one see-through region extends through the thickness of the microporous film.

An adhesive composition and use thereof for providing self-healing adhered roofing systems. The adhesive composition includes at least one rubber component, at least one organic solvent, and 12.5-40 wt.-% of at least one powdered superabsorber polymer, based on the total weight of the adhesive composition. Further, a self-healing membrane composite, to a method for forming a self-healing adhered roofing system, to a self-healing adhered roofing system and to use of at least one powdered superabsorber polymer in an adhesive for providing a self-healing adhered roofing system.