A tackifying resin includes a farnesene-based polymer having monomeric units derived from a farnesene monomer and one or more optional comonomers selected from the group consisting of dienes, branched mono-olefins, and vinyl aromatics and has a softening point greater than or equal to 80 degrees Celsius. A method of making the farnesene-based polymer includes combining a farnesene monomer and a solvent and optionally adding one or more comonomers selected from the group consisting of dienes, branched mono-olefins, and vinyl aromatics, to provide a monomer feed, and polymerizing the monomer feed by combining the monomer feed with a Friedel-Crafts catalyst in a vessel. The tackifying resin may be combined with an elastomer to form a hot melt adhesive composition.

A thermoset adhesive for bonding two materials having different linear expansion coefficients with reduced warping and without spaces being formed therebetween. The thermoset adhesive of the present invention comprises an epoxy resin, a core-shell rubber, thermally expansive microparticles, and a curing agent. The thermally expansive microparticles can have at least one or any combination of an average particle size of from 9 to 19 m, an expansion initiation temperature of from 70 to 100 C., and a maximum expansion temperature of from 110 to 135 C.

A thermoset adhesive for bonding two materials having different linear expansion coefficients with reduced warping and without spaces being formed therebetween. The thermoset adhesive of the present invention comprises an epoxy resin, a core-shell rubber, thermally expansive microparticles, and a curing agent. The thermally expansive microparticles can have at least one or any combination of an average particle size of from 9 to 19 m, an expansion initiation temperature of from 70 to 100 C., and a maximum expansion temperature of from 110 to 135 C.

A sheet for an image display unit to be provided on the front face side of an image display unit includes a substrate layer containing a cycloolefin copolymer as a principal component and an elastomer having a refractive index substantially equal to the refractive index of the cycloolefin copolymer, in an amount of no less than 2 parts by mass and no greater than 7 parts by mass with respect to 100 parts by mass of the cycloolefin copolymer. The substrate layer preferably has an average thickness of no less than 100 m and no greater than 500 m, a water absorbing rate preferably no greater than 0.5%, a tensile strength of preferably no less than 40 MPa and no greater than 70 MPa, and a tensile elongation in a longitudinal direction at 25 C. is preferably no less than 4% and no greater than 15%.

A heat-sealable adhesive tape is provided that includes: a hot-melt adhesive layer; and a pressure-sensitive adhesive layer adjacent to the hot-melt adhesive layer, the pressure-sensitive adhesive layer comprising a blend of: b1) at least one poly(meth)acrylate, and b2) at least one selected from an elastomeric material and a thermoplastic-elastomeric material.

The present invention provides an electrically conductive adhesive composition comprising (A) at least one non-toughened epoxy resin, (B) optionally at least one toughened epoxy resin, (C) at least one imidazole compound, (D) at least one latent amine curing agent other than imidazole compound, (E) at least one silver filler having a D50 particle size of no more than 20 ?m, and (F) at least one silver filler having a D50 particle size of from 20 to 100 ?m.

Provided is a method for producing a glass unit. The method comprises a step (A) of obtaining a glass plate; a step (B) of applying a protective sheet to one face of the glass plate; an optional step (C) of subjecting the glass plate to at least one process selected from the group consisting of transportation, storage, processing, washing and handling; a step (D) of removing the protective sheet from the glass plate; and a step (E) of assembling a glass unit using the glass plate. The protective sheet comprises a substrate layer, and a PSA layer provided to at least one face of the substrate layer. The PSA layer has a surface hardness of 0.3 MPa or greater.

A thermoset adhesive for bonding two materials having different linear expansion coefficients with reduced warping and without spaces being formed therebetween. The thermoset adhesive of the present invention comprises an epoxy resin, a core-shell rubber, thermally expansive microparticles, and a curing agent. The thermally expansive microparticles can have at least one or any combination of an average particle size of from 9 to 19 m, an expansion initiation temperature of from 70 to 100 C., and a maximum expansion temperature of from 110 to 135 C.

A thermoset adhesive for bonding two materials having different linear expansion coefficients with reduced warping and without spaces being formed therebetween. The thermoset adhesive of the present invention comprises an epoxy resin, a core-shell rubber, thermally expansive microparticles, and a curing agent. The thermally expansive microparticles can have at least one or any combination of an average particle size of from 9 to 19 m, an expansion initiation temperature of from 70 to 100 C., and a maximum expansion temperature of from 110 to 135 C.

The present invention relates to a method for producing a single-sided adhesive film (1) for securing a load, comprising providing a backing layer (2) and coating a first side of the backing layer (2) with an adhesive layer (3), wherein a plastic (4) is applied to a second side of the backing layer (2) in order to form a non-slip surface on the adhesive film (1). Moreover, the present invention relates to a single-sided adhesive film (1) produced by the above method.