An adhesive tape includes a composite membrane and an adhesive layer, where the composite membrane includes a substrate and a hardening layer provided on a surface of the substrate, and a hardness of the hardening layer is 3H to 9H. The adhesive tape provided in this application has both small thickness and high hardness, which increases volumetric energy density of the electrochemical apparatus and can further effectively avoid tape wrinkling of the electrochemical apparatus.

The invention relates to an adhesive tape comprising an adhesive tape comprising a layer A comprising at least one anisotropic tape, wherein said tape comprises ultrahigh molecular weight polyethylene; and a layer B comprising a first adhesive being a pressure sensitive adhesive, wherein layer A covers at least 60% of the surface area of layer B. The invention also relates to the use of said adhesive tape in different applications.

The double-sided tape for fixing an electrode constituent body is used in an electrochemical device that houses in a pouch-type outer casing an electrode constituent body wherein a positive electrode member, a separator member and a negative electrode member are layered or wound. The double-sided tape comprises a surface having a pressure-sensitive adhesive for adhering to the electrode constituent body, and a surface having a heat-sensitive adhesive for adhering to the pouch-type outer casing.

Disclosed are pre-cure RFID-enabled bead labels based on an RFID inlay construction consisting of an aluminum antenna etched on to a high temperature resistant polyimide film that is connected to an integrated memory circuit positioned on the surface of the polyimide film. This RFID inlay being further inserted into an overall label construction having a plurality of layers that include, for example, a plurality of polyester layers and a plurality of high temperature resistant adhesive layers that bond/adhere layers together, the plurality of layers further protecting and insulating the RFID inlay while the label is bonded to the external bead (or sidewall) of a tire. The compositions/devices disclosed herein can be used for electronic identification when applied on rubber-based articles (e.g., tires) prior to being subjected to stress related to the vulcanization process and normal use of this article during the manufacturing process.

Adhesives comprising: a) 35-85 weight percent of a pressure sensitive adhesive comprising: i) a polymer selected from rubbers and polyacrylate polymers and ii) optionally one or more tackifiers; and dispersed therein b) 15-50 weight percent fire retardant (FR) particles comprising one or more phosphorus-containing compounds selected from organophosphine oxides and organophosphi-nates. In some embodiments, the phosphorus-containing compounds comprise 35-65 weight percent of an organophosphine oxide and 65-35 weight percent of an organophosphinate. The FR particles may have a D50 particle size of 1-120 micrometers, 40-120 micrometers, or 70-120 micrometers. Adhesive films comprising the adhesives described herein may be free-standing adhesive films or adhesive layers comprised in tapes.

Disclosed are pre-cure RFID-enabled bead labels based on an RFID inlay construction consisting of an aluminum antenna etched on to a high temperature resistant polyimide film that is connected to an integrated memory circuit positioned on the surface of the polyimide film. This RFID inlay being further inserted into an overall label construction having a plurality of layers that include, for example, a plurality of polyester layers and a plurality of high temperature resistant adhesive layers that bond/adhere layers together, the plurality of layers further protecting and insulating the RFID inlay while the label is bonded to the external bead (or sidewall) of a tire. The compositions/devices disclosed herein can be used for electronic identification when applied on rubber-based articles (e.g., tires) prior to being subjected to stress related to the vulcanization process and normal use of this article during the manufacturing process.

The present invention relates to a foam tape for a sound-absorbing tire, the foam tape including a release film; a tacky adhesive layer formed underneath the release film; a base film formed underneath the tacky adhesive layer; an adhesive layer formed underneath the base film; and a sound-absorbing material layer having a porous structure and formed underneath the adhesive layer, and the foam tape having enhanced adhesive force to a tire, and the present invention also relates to a sound-absorbing tire including the foam tape for a sound-absorbing tire.

A pressure-sensitive adhesive sheet for covering according to an embodiment of the present invention includes a non-crosslinked rubber component having a maximum peak of the molecular weight distribution in the range of 50,000 to 3,000,000, an oil component having a maximum peak of the molecular weight distribution in the range of 1,000 to 20,000, and carbon black. The content of the non-crosslinked rubber component is 25% to 65% by mass, the content of the oil component is 35% to 75% by mass, and the content of the carbon black relative to 100 parts by mass of the total of the non-crosslinked rubber component and the oil component is 1 to 40 parts by mass.

An adhesive tape (1), including a substrate (6) including a stitched fleece (2) and an adhesive layer (7) applied on one side to the substrate (6), wherein the stitched fleece (2) is formed at least 80% of long fibers (3) that have a fiber length (L.sub.1) of 80 mm to 120 mm. The adhesive tape having improved abrasion properties while maintaining a high noise damping.

Provided herein are multilayer tape constructions comprising a damping layer and a bonding layer, wherein the multilayer tape construction effectively dissipates vibrations at low temperatures. The materials and configurations of the layers are selected such that the glass transition temperature of the bonding layer is greater than the glass transition of the damping layer, and the difference between the glass transition temperatures is related to the relative thicknesses of the damping layer and the bonding layer. The multilayer tape constructions may further comprise a carrier layer. Also provided are systems and methods using the disclosed multilayer tape constructions.