The present invention provides a hotmelt adhesive composition, comprising: (A) an olefin block copolymer of ethylene and octene, having a melt index of 10 to 35 g/10 min @ 190° C., 2.16 kg, preferably 15 to 30 g/10 min @ 190° C., 2.16 kg, and (B) a wax modified with carboxylic acid and/or carboxylic acid anhydride.

The invention relates to amorphous poly-alpha-olefins, which are characterized in that said amorphous poly-alpha-olefins have a viscosity at 190° C. of less than 5000 mPas, a molar mass distribution (Mw/Mn) of 3 to 8, a quotient Mz/Mw of less than or equal to 3.0 and a quotient Mz/Mn of less than 21.0. The invention further relates to a method for producing degraded amorphous poly-alpha-olefins, in particular the amorphous poly-alpha-olefins according to the invention, and to the use of the amorphous polyalpha-olefins according to the invention or produced according to the invention in hot-melt adhesive compositions.

The present disclosure relates to a co-extruded multilayer adhesive assembly comprising: a) a heat-activatable adhesive resin layer comprising a (co)polymer of one or more monomers selected from the group consisting of olefins; and b) a pressure sensitive adhesive polymeric foam layer comprising a rubber-based elastomeric material; wherein the heat-activatable adhesive resin layer is in direct contact with the pressure sensitive adhesive foam layer, and wherein the surface of the heat-activatable adhesive resin layer which is in direct contact with the pressure sensitive adhesive foam layer and the surface of the pressure sensitive adhesive foam layer which is indirect contact with the heat-activatable adhesive resin layer are free of any chemical or physical adhesion-promoting surface treatment. The present disclosure also relates to a method of manufacturing such a co-extruded multilayer adhesive assembly and uses thereof.

A protective film of the present invention is used at the time of performing heat bending on the resin substrate, and includes a base material layer and a pressure sensitive adhesive layer adhered to a resin substrate, in which the base material layer includes a first layer which is positioned on an opposite side of the pressure sensitive adhesive layer and has a melting point of 150° C. or higher, and includes a second layer which is positioned on a pressure sensitive adhesive layer side and has a melting point of lower than 150° C., the pressure sensitive adhesive layer has a melting point of lower than 150° C., and MFR of a thermoplastic resin contained in the second layer, which is measured in conformity with JIS K7210, is in a range of 0.5 g/10 min to 4.0 g/10 min.

The present invention relates to a hot-melt adhesive resin film having an excellent adhesive force and durability to various adherends such as metal, glass, and plastic, and a production method thereof. More particularly, the present invention relates to a hot-melt adhesive resin film including a first surface layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second surface layer, which are laminated in this order, in which the first intermediate layer and the second intermediate layer include a resin which is obtained by modifying a copolymer of propylene and 1-butene with maleic acid, and a production method thereof.

Provided is a novel transparent adhesive material having low relative permittivity as well as excellent adhesive characteristics, whereby an olefinic polymer resin layer and an acrylic polymer adhesive layer can be suitably integrated. Suggested is a transparent adhesive material provided with an outermost surface layer containing an acrylic polymer (B) and a photocrosslinking initiator, and an intermediate layer containing an olefinic polymer (A), a crosslinking agent, and a photocrosslinking initiator, in which the intermediate layer contains a (meth)acrylate monomer as the crosslinking agent.

An embodiment of the present invention provides (i) a method for producing a thermoplastic adhesive product which can be continuously and automatically supplied and (ii) an apparatus for producing the thermoplastic adhesive product. The method includes the steps of: a) extruding a long object through a discharge hole of an extruder, the long object being made of a thermoplastic adhesive and having a string shape or a sheet shape; b) cooling the long object having been thus extruded; and c) collecting the long object having been thus cooled. The production apparatus (100) includes an extruder (101), cooling equipment (102), and a winder (107).

The present application relates to an adhesive composition comprising a polypropylene resin, a tackifying resin and a plasticizer resin having a superior balance of properties in regard of Brookfield viscosity and maximum probe tack. It further relates to an article comprising the adhesive composition and to a process for producing said article. The application also relates to the use of the adhesive composition in the preparation of an article.

A method for manufacturing a semiconductor device according to the present invention includes at least the following three steps: (A) a step of preparing a first structure (100) including an adhesive laminate film (50) having a heat-resistant resin layer (10), a flexible resin layer (20) and an adhesive resin layer (30) in this order, and a first semiconductor component (60) adhered to the adhesive resin layer (30) and having a first terminal (65); (B) a step of performing solder reflow processing on the first structure (100) in a state where the first semiconductor component (60) is adhered to the adhesive resin layer (30); and (C) a step of, after the step (B), peeling the heat-resistant resin layer (10) from the adhesive laminate film (50).

Provided is a novel transparent adhesive material having low relative permittivity as well as excellent adhesive characteristics, whereby an olefinic polymer resin layer and an acrylic polymer adhesive layer can be suitably integrated. Suggested is a transparent adhesive material provided with an outermost surface layer containing an acrylic polymer (B) and a photocrosslinking initiator, and an intermediate layer containing an olefinic polymer (A), a crosslinking agent, and a photocrosslinking initiator, in which the intermediate layer contains a (meth)acrylate monomer as the crosslinking agent.