C09J2423/00

Protective film

A protective film of the present invention is used at the time of performing heat bending on the resin substrate, and includes a base material layer and a pressure sensitive adhesive layer adhered to a resin substrate, in which the base material layer includes a first layer which is positioned on an opposite side of the pressure sensitive adhesive layer and has a melting point of 150° C. or higher, and includes a second layer which is positioned on a pressure sensitive adhesive layer side and has a melting point of lower than 150° C., the pressure sensitive adhesive layer has a melting point of lower than 150° C., and MFR of a thermoplastic resin contained in the second layer, which is measured in conformity with JIS K7210, is in a range of 0.5 g/10 min to 4.0 g/10 min.

RESIN COMPOSITION FOR TACKIFIER OR ADHESIVE AND PREPARATION METHOD THEREOF
20220356379 · 2022-11-10 ·

Provided are a resin composition for a tackifier or an adhesive and a preparation method thereof. Provided is a resin composition for a tackifier or an adhesive, which includes a hydrogenated petroleum resin with a controlled hydrogenation rate to have excellent compatibility with polyolefin and to exhibit high transparency while having improved quality including adhesive property.

RESIN COMPOSITION AND ARTICLE MADE THEREFROM
20230101785 · 2023-03-30 ·

A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance, thermal resistance after moisture absorption and rigidity and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.

##STR00001##

PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE LAYER, PRESSURE-SENSITIVE ADHESIVE SHEET, OPTICAL MEMBER, AND TOUCH PANEL

An object of the present invention is to provide a pressure-sensitive adhesive composition that enables a pressure-sensitive adhesive layer to be formed, the pressure-sensitive adhesive layer allowing the appearance of a display device and an input device to be unlikely to deteriorate even under low pressure conditions, a pressure-sensitive adhesive layer, a pressure-sensitive adhesive sheet, an optical member, and a touch panel. The pressure-sensitive adhesive composition of the present invention contains an acrylic polymer (A) and a hydrogenated polyolefinic resin (B). The acrylic polymer (A) contains a (meth)acrylic alkyl ester having an alkyl group having 8 or more carbon atoms as a constituent monomer component. The hydrogenated polyolefinic resin (B) contains a hydrogenated polyolefin.

PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE LAYER, PRESSURE-SENSITIVE ADHESIVE SHEET, OPTICAL MEMBER, AND TOUCH PANEL

An object of the present invention is to provide a pressure-sensitive adhesive composition that enables a pressure-sensitive adhesive layer to be formed, the pressure-sensitive adhesive layer allowing the appearance of a display device and an input device to be unlikely to deteriorate even under low pressure conditions, a pressure-sensitive adhesive layer, a pressure-sensitive adhesive sheet, an optical member, and a touch panel. The pressure-sensitive adhesive composition of the present invention contains an acrylic polymer (A) and a hydrogenated polyolefinic resin (B). The acrylic polymer (A) contains a (meth)acrylic alkyl ester having an alkyl group having 8 or more carbon atoms as a constituent monomer component. The hydrogenated polyolefinic resin (B) contains a hydrogenated polyolefin.

FILM HAVING LIGHT TRANSMITTANCE AND MANUFACTURING METHOD THEREOF

The present disclosure relates to a film having light transmittance and a manufacturing method thereof. The film includes a Polyurethane (PU) surface layer, and a thermoplastic elastomer layer. The thermoplastic elastomer layer is disposed under the PU surface layer. The thermoplastic elastomer layer includes color masterbatch material. The color masterbatch material is between 0.1-1% weight. By controlling the amount of color masterbatch material in the thermoplastic elastomer layer, the film of the present disclosure has real color appearance and good light transmittance.

Extrudable pressure sensitive adhesive based on polybutene-1 polymer and a styrene copolymer suitable for reclosable packagings

The present invention relates to a pressure sensitive adhesive composition comprising: (i) at least one butene-1 (co)polymer; (ii) at least one liquid tackifier; (iii) at least one solid tackifier; (iv) at least one styrene copolymer; (v) optionally at least one further (co)polymer, different from (i) and (iv); (vi) optionally at least one additive. Furthermore, the use of the pressure sensitive adhesive composition according to the invention as closing mean for a packaging unit for foods, for packaging units to be heated in a microwave or oven, for a closing mean for packaging unit for drugs, hygienic tissues, cleaning tissues or cosmetic tissues. An article comprising the pressure sensitive adhesive composition according to the invention and a method of obtaining the article.

ASSEMBLY FOR FUEL CELL, AND LAMINATED BODY

The invention provides an assembly for fuel cell which has an excellent adhesive force in the presence of hot water, and a laminated body which is used for the assembly for fuel cell. The assembly for fuel cell comprises an adhesive resin layer containing a polyolefin having at least one group selected from the group consisting of an acidic group and an acid anhydride group and having an acid value of 0.01 mgKOH/g to 6.5 mgKOH/g; and two or more members bonded with the adhesive resin layer interposed therebetween, wherein at least one of the members is a metal member having a ratio of a dipole term in surface free energy of 0.01% to 5.0%.

Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layer

A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and picking up each device chip from the polyolefin sheet.

ADHESIVE COMPOSITIONS

Disclosed herein are pressure sensitive adhesive compositions that can include a styrene-butadiene rubber latex and a tackifier agent. In another example, the pressure sensitive adhesive compositions can include a styrene-butadiene rubber latex and acrylic polymer. The adhesive compositions can further include mineral oil and ethylene propylene diene monomer rubber. The pressure sensitive adhesives compositions can have a have low volatile organic compound vapor pressures while having effective adhesion properties on low surface energy substrates.