A laminate for a battery with a polypropylene adhesive layer and a metal substrate layer: (1) the adhesive includes 40-94 wt % of a propylene copolymer (A), 3-30 wt % of a butene-containing copolymer (B), 3-30 wt % of an ethylene-α-olefin copolymer (C) ((A), (B), and (C) is 100 wt %), (2) the copolymer (A) has a melting point of 130° C. or more measured with a differential scanning calorimeter, and a total proportion of a structural unit derived from ethylene is 4-25 mol % relative to 100 mol % of a total structural units forming all the copolymers (A) contained in the adhesive, (3) the copolymer (B) includes less than 1 mol % of a structural unit derived from ethylene, and has a melting point of 100° C. or less measured with a differential scanning calorimeter, and (4) the copolymer (C) includes 50-99 mol % of a structural unit derived from ethylene.

A method and system of using a polyolefin-based, hot melt adhesive improves creep performance of elastic strands adhered to another substrate. Some deflection, greater than 1°, of the exit angle formed by a line normal to the axis of a neutrally-positioned applicator and the elastic strand extending from the applicator is introduced. Preferably, deflection of the entrance angle is also introduced and a head tilt angle is also provided. The use of deflection improves creep performance or allows for a reduced amount of adhesive to be used to achieve the same or similar creep performance. The elastic strands may be used to form a leg cuff in personal care products, such as diapers, and the substrate to which they are applied could be a polyethylene film or non-woven materials.

Provided is a self-adhesive sheet including a 4-methyl-1-pentene-based polymer. In the self-adhesive sheet, it is preferable that at least one or more temperatures showing a local maximum value of a loss tangent (tan δ) , which is obtained by dynamic viscoelasticity measurement under conditions of a temperature rising rate of 4° C./min, a frequency of 1.59 Hz, and a strain amount of 0.1%, are present in a range of 10° C. or higher and 100° C. or lower, the local maximum value of the loss tangent is 0.5 or more and 3.5 or less, an arithmetic average roughness Ra on one surface of the self-adhesive sheet is in a range of 0.01 to 10 .Math.m, and a ten-point average roughness Rz is in a range of 0.1 to 50 .Math.m.

An adhesive tape includes a composite membrane and an adhesive layer, where the composite membrane includes a substrate and a hardening layer provided on a surface of the substrate, and a hardness of the hardening layer is 3H to 9H. The adhesive tape provided in this application has both small thickness and high hardness, which increases volumetric energy density of the electrochemical apparatus and can further effectively avoid tape wrinkling of the electrochemical apparatus.

Disclosed are a method of manufacturing a flexible thin-film type super-capacitor device and a super-capacitor device manufactured by the same. The flexible thin-film type super-capacitor device comprises a base film which has flexibility; a separator which is interposed between the base films; and an active material which is formed on the base film. Thus, flexibility is given since thickness is very thin while maintaining high electrical conductivity and high binding property. In addition, economic feasibility is high and mass production is possible. Further, it is possible to stably and efficiently contain a highly corrosive material.

A composite hot-melt adhesive mesh film and preparation process thereof, in particular, a composite hot-melt adhesive mesh film and preparation process thereof for bonding metal and non-polar material are disclosed. The mesh film is compounded of a polar polyamide hot-melt adhesive and a non-polar polyolefin hot-melt adhesive mesh film containing a compatibilizer. The mesh film has a high adhesive strength and a durable and stable adhesion, and is especially suitable for bonding stainless steel, aluminum, copper or other metal materials and polyethylene, polypropylene or other non-polar polymers. Additionally, the preparation process is completed in one set of production process from raw material pretreatment to the final preparation of the hot melt adhesive mesh film product, thereby greatly reducing production failures, and providing high production efficiency and low costs.

An encapsulant sheet suitable for encapsulating a light-emitting element in, for example, a self-luminous display or for direct backlights. The encapsulant sheet is a single-layer or multi-layer resin sheet that includes an adhesive layer exposed at a topmost surface. The Vicat softening point is greater than 60° C. and no higher than 100° C. The melt viscosity of the encapsulant sheet, at a shear velocity of 2.43×10 sec.sup.−1 and measured at a temperature of 120° C. is at least 5.0×10.sup.4 poise and no more than 1.0×10.sup.5 poise. The adhesive layer contains a polyolefin and a silane component, and a content of the silane component relative to the resin component of the adhesive layer is at least 0.03% by mass and less than 10% by mass.

The double-sided tape for fixing an electrode constituent body is used in an electrochemical device that houses in a pouch-type outer casing an electrode constituent body wherein a positive electrode member, a separator member and a negative electrode member are layered or wound. The double-sided tape comprises a surface having a pressure-sensitive adhesive for adhering to the electrode constituent body, and a surface having a heat-sensitive adhesive for adhering to the pouch-type outer casing.

A dielectric welding film capable of providing excellent adhesiveness to a variety of adherends in a short period of dielectric heating, and an welding method using the dielectric welding film are provided. The dielectric welding film is configured to adhere a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a first thermoplastic resin as an A1 component having a predetermined solubility parameter, a second thermoplastic resin as an A2 component having a solubility parameter larger than the solubility parameter of the first thermoplastic resin, and a dielectric filler as a B component. The welding method uses the dielectric welding film.

Provided are an adhesive film, a composition for forming the same and an electronic device. The composition includes: a thermoplastic polymeric resin and an antistatic agent, the antistatic agent is an amide organic compound represented by Formula (I). The above antistatic agent contains a strong-polarity amide group and an optional polar group. The amide group may form an intramolecular hydrogen bond, which has a shorter bond length, and a dipole electric field generated by positive and negative ions formed after ionization is strong and a voltage generated by an external electrostatic field may be counteracted, such that the antistatic agent has a better antistatic property. The optional polar group may improve the above antistatic property: The thermoplastic polymeric resin has good thermal processability, and after it and the antistatic agent are subjected to melt extrusion, the adhesive film with the better antistatic property and processability may be formed.

##STR00001##