The powder adhesive comprises a thermoplastic resin and particles of an aromatic compound, wherein the particles of an aromatic compound are particles of a compound that has an aromatic ring and an azo bond bonded to the aromatic ring, or are particles of a compound comprising a heteroaromatic ring comprising nitrogen atom; the thermoplastic resin comprises an ester group; and, designating Es (mmol/g) as an ester group concentration in the thermoplastic resin, M (mass %) as a content of the aromatic compound particles in the powder adhesive, and N (mmol/g) as a nitrogen atom concentration in the aromatic compound particles, Es is from 1.0 mmol/g to 4.5 mmol/g, M is from 1.0×10.sup.−4 mass % to 1.0×10.sup.0 mass %, and N is from 5.0 mmol/g to 15.0 mmol/g.

The powder adhesive comprises a thermoplastic resin and particles of an aromatic compound, wherein the particles of an aromatic compound are particles of a compound that has an aromatic ring and an azo bond bonded to the aromatic ring, or are particles of a compound comprising a heteroaromatic ring comprising nitrogen atom; the thermoplastic resin comprises an ester group; and, designating Es (mmol/g) as an ester group concentration in the thermoplastic resin, M (mass %) as a content of the aromatic compound particles in the powder adhesive, and N (mmol/g) as a nitrogen atom concentration in the aromatic compound particles, Es is from 1.0 mmol/g to 4.5 mmol/g, M is from 1.0×10.sup.−4 mass % to 1.0×10.sup.0 mass %, and N is from 5.0 mmol/g to 15.0 mmol/g.

This invention relates to a heat and humidity resistant adhesive composition, comprising a first part comprising at least one ethylenically unsaturated monomer; a second part comprising at least one initiator; and at least one blocked isocyanate compound comprised in the first part, the second part and/or a third separate part. The adhesive composition exhibits excellent aging performance under rigorous conditions.

A hot-melt adhesive for reinforcing a conductor terminal of a flexible flat cable, said hot-melt adhesive comprising at least one member selected from the group consisting of (P1) a hydrogenated product of a block copolymer of an aromatic vinyl compound and a conjugated diene compound, wherein the content of a structural unit derived from the aromatic vinyl compound is not more than 65 mass % relative to the sum of the content of the structural unit derived from the aromatic vinyl compound and the content of a structural unit derived from the conjugated diene compound, (P2) a hydrogenated product of a random copolymer of an aromatic vinyl compound and a conjugated diene compound, (P3) an acid-modified hydrogenated product of a copolymer of an aromatic vinyl compound and a conjugated diene compound, and (P4) an amine-modified hydrogenated product of a copolymer of an aromatic vinyl compound and a conjugated diene compound; and a reinforcing tape wherein a layer of the hot-melt adhesive is formed on one surface of an insulating film.

Pressure-sensitive adhesive compound comprising at least two components forming one phase each, from which an IPN with at least two phases is produced by a cross-linking build-up reaction, the first phase having at least a softening point temperature of less than 23° C., and the second phase, after the build up reaction, having a softening temperature of greater than 23° C., the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.

Provided is a pressure-sensitive adhesive sheet that may be used for the grinding of a hard and brittle substrate in a backgrinding step for the hard and brittle substrate, the pressure-sensitive adhesive sheet being excellent in all of low contamination property, productivity, grinding accuracy, and peelability. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer has a thickness of from 1 μm to 300 μm, and wherein a microhardness H (Pa) of the pressure-sensitive adhesive layer at 25° C. and the thickness, which is represented by h.sub.A (μm), of the pressure-sensitive adhesive layer satisfy a relationship represented by the following expression (1). log H≥1.9385×log h.sub.A+4.2611 . . . (1)

Provided in the present invention is a hot melt adhesive sheet formed of one layer or a plurality of layers, the hot melt adhesive sheet including at least one adhesive layer that adheres to an adherend, the adhesive layer being formed of a polymer composition including a styrene-based rubber and a tackifier, and the tackifier including two tackifiers selected from a group consisting of a rosin-based resin, an alicyclic resin, and a terpene-based resin.

A process for continuously preparing a polymer by free-radical polymerization, the process includes: continuously feeding to a reactor a mixture including about 20 wt % to about 96 wt % of a vinylic monomer, the vinylic monomer comprising a styrenic monomer, a (meth)acrylic monomer, or a mixture thereof, greater than 0 wt % to about 0.25 wt % of a polymerization initiator, and about 4 wt % to about 80 wt % of a reaction solvent; maintaining the reactor at a temperature from about 120° C. to about 190° C.; and collecting the polymer; where the polymer has a weight average molecular weight (Mw) from 20,000 g/mol to about 300,000 g/mol.

A process for continuously preparing a polymer by free-radical polymerization, the process includes: continuously feeding to a reactor a mixture including about 20 wt % to about 96 wt % of a vinylic monomer, the vinylic monomer comprising a styrenic monomer, a (meth)acrylic monomer, or a mixture thereof, greater than 0 wt % to about 0.25 wt % of a polymerization initiator, and about 4 wt % to about 80 wt % of a reaction solvent; maintaining the reactor at a temperature from about 120° C. to about 190° C.; and collecting the polymer; where the polymer has a weight average molecular weight (Mw) from 20,000 g/mol to about 300,000 g/mol.

An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesive strength and impact strength uniformly over a wide temperature range. In addition, the adhesive composition of the present application may have a level of viscosity capable of ensuring excellent processability.