C09J2425/00

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

A method for manufacturing an electronic device includes at least a preparing step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is reduced by external stimuli, and an unevenness-absorbing resin layer (C) provided between the base material layer and the adhesive resin layer (A) or between the base material layer and the adhesive resin layer (B), an electronic component attached to the adhesive resin layer (A) of the adhesive film and having an uneven structure, and a support substrate attached to the adhesive resin layer (B) of the adhesive film; and a sealing step of sealing the electronic component with a sealing material.

Adhesive composition having excellent kisstack

The an adhesive composition characterized in that the kisstack, which is defined as the force measured when a sheet coated with the adhesive composition is instantaneously peeled off after being attached, is about 6 N/inch or higher. The composition not only has excellent loop tack but also exhibits high kisstack characteristics, and thus can be widely used for various substrates.

Adhesive composition having excellent kisstack

The an adhesive composition characterized in that the kisstack, which is defined as the force measured when a sheet coated with the adhesive composition is instantaneously peeled off after being attached, is about 6 N/inch or higher. The composition not only has excellent loop tack but also exhibits high kisstack characteristics, and thus can be widely used for various substrates.

PRESSURE-SENSITIVE ADHESIVE SHEET

Provided is a PSA sheet comprising a fabric sheet and a PSA layer laminated on the fabric sheet. The PSA layer comprises a base polymer and a tackifier resin. The base polymer is a block copolymer of a monovinyl-substituted aromatic compound and a conjugated diene compound. The PSA layer has a thickness greater than 100 μm and less than 190 μm.

Polymers For Bonding Coral

The disclosure relates to a thin layer comprising a catechol containing polymer or oligomer, as well as methods of making and using the thin layer comprising the catechol containing polymer or oligomer. The disclosure also relates to a thin layer comprising a catechol containing polymer or oligomer adjacent to and in contact with a bulk adhesive layer. The layers demonstrate improved adhesion between coral and coral-like materials.

ADHESIVE FOR BATTERY, AND ADHESIVE LAYERED BODY FOR BATTERY
20230272248 · 2023-08-31 · ·

An adhesive agent for a battery containing a sulfide-based solid electrolyte, the adhesive agent including a metal compound and a resin, wherein the metal compound is contained in an amount of 1% by weight or more and less than 60% by weight relative to a total weight of the metal compound and the resin. The metal compound is preferably a polyvalent metal salt, and more preferably a copper compound. An adhesive layered body for a battery including a sulfide-based solid electrolyte, the adhesive layered body including a substrate and a layer of the adhesive agent for a battery, the layer being provided on the substrate.

Thermally crosslinkable composition
11739239 · 2023-08-29 · ·

The present invention relates to a thermally crosslinkable composition comprising an acid-modified polymer A having a melting point of 110 to 150° C. and a crystallization temperature of 50 to 90° C., an acid-modified polymer B having a melting point of 30 to 110° C. and a crystallization temperature of lower than 50° C., a tackifier resin, and a curing agent, wherein the thermally crosslinkable composition has a crystallization temperature of 30 to 70° C.

Thermally crosslinkable composition
11739239 · 2023-08-29 · ·

The present invention relates to a thermally crosslinkable composition comprising an acid-modified polymer A having a melting point of 110 to 150° C. and a crystallization temperature of 50 to 90° C., an acid-modified polymer B having a melting point of 30 to 110° C. and a crystallization temperature of lower than 50° C., a tackifier resin, and a curing agent, wherein the thermally crosslinkable composition has a crystallization temperature of 30 to 70° C.

TACKIFIER COMPOSITION
20220154047 · 2022-05-19 ·

A tackifier polymeric additive including an emulsion polymerization reaction product of: (a) at least one aromatic monomer; (b) at least one acrylate or methacrylate monomer; and (c) at least one chain transfer agent; and a tackified acrylic adhesive composition including (I) at least one acrylic adhesive polymer; and (II) the above tackifier polymeric additive.

THERMOPLASTIC RESIN MATERIAL WITH PRIMER, AND RESIN-RESIN CONJUGATE

A primer-attached thermoplastic resin material having a thermoplastic resin material and one or plural primer layers laminated on the thermoplastic resin material, wherein at least one layer of the primer layers is a layer derived from a film.