The present application relates to a retort food packaging film containing graphene and a method for manufacturing the retort food packaging film.

The current disclosure describes carrier tape systems, which include a carrier tape including a plurality of pockets. Each pocket contains a semiconductor device adhered to a bottom surface of the pocket by an adhesive. In some embodiments, the adhesive is a reversible adhesive. Use of the adhesive reduces the likelihood the semiconductor device will be damaged due to movement of the semiconductor device in the pocket during shipment of the carrier tape. Methods of forming a semiconductor device carrier systems and methods of supplying semiconductor devices are also described.

A material for a printed circuit board, which is a film composed of a fluorinated resin layer, where the fluorinated resin layer contains a composition containing a fluorinated copolymer having at least one functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, has a melt flow rate of at most 15 g/10 min measured at 372 C. under a load of 49N, and has a storage elastic modulus of at least 650 MPa.

Adhesive tapes include a plasticized polyvinyl chloride backing, a primer including an ethylene/carbon monoxide-containing terpolymer and a styrene-containing block copolymer and an epoxidized polymer, and an adhesive.

Provided is a masking tape for a shot peening process, including: a substrate having a first surface and a second surface; and a pressure-sensitive adhesive layer disposed on the first surface of the substrate. The masking tape has a breaking strength of 55 N/15 mm or more and exhibits an impact absorption rate of 20% or more in a falling ball impact test. Further, the masking tape has a displacement distance of 2 mm or less after 1 h from an initial position in a holding power test at 40 C. which is performed by applying a load of 500 g.

Adhesive tapes include a plasticized polyvinyl chloride backing, a primer including an ethylene/carbon monoxide-containing terpolymer and a styrene-containing block copolymer, and an adhesive.

The present invention relates to materials and systems useful for increasing the safety profile of a candle. In particular, the present invention provides a thermally-protective material that is useful to prepare labels or wraps to encircle or surround a candle. The present invention further provides a cool-touch thermally-protected candle assembly.

A laminated product in which a first base material layer, an adhesive layer and a second base material layer are stacked in this order, wherein an edge of the laminated product is covered with a layer formed by a curable composition including at least one perfluoropolyether group-containing compound.

Provided is a method of producing a pressure-sensitive adhesive containing a cured product of a curable composition containing a crosslinkable silicon group-containing organic polymer and an adhesion-imparting resin as a pressure-sensitive adhesive layer; curing of the curable composition does not proceed when heated during production, i.e., the curable composition has excellent stability when heated, and the crosslinking reaction of the curable composition proceeds by some sort of trigger. The pressure-sensitive adhesive contains, as a pressure-sensitive adhesive layer, a cured product of a curable composition containing (A) a crosslinkable silicon group-containing organic polymer, (B) an adhesion-imparting resin, (C) a SiF bond-containing silicon compound, and (D) a photobase generator.

A material having a fluorinated resin layer is subjected to heat treatment. The fluorinated resin layer is composed of a composition containing a fluorinated copolymer (a) having at least one type of functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, having a melting point of from 280 to 320 C. and a melt flow rate of at least 2 g/10 min measured at 372 C. under a load of 49 N. The heat treatment is carried out at a temperature of at least 250 C. and lower by at least 5 C. than the melting point of the fluorinated copolymer (a) so that the ratio of the melt flow rate of the fluorinated resin layer after the heat treatment to that before the heat treatment, and the melt flow rate of the fluorinated resin layer after the heat treatment, are respectively within specific ranges.