A present invention related to a method for manufacturing a dot bonding shoe insole using an adhesive resin containing hydrophobic nano-silica, including: melting adhesive resin made of any one selected from thermoplastic polyurethane (TPU) or ethylene vinyl acetate (EVA) containing hydrophobic nano-silica in the range of 0.2 to 5 phr and applying to the surface of the transfer roller in which the intaglio dot pattern is formed in a mesh shape in the shape of the shoe insole; removing the adhesive resin applied other area than the intaglio dot pattern of the surface of the transfer roller; transferring the adhesive resin applied to the intaglio dot pattern of the surface of the transfer roller to either one of the foam or the fabric; bonding the foam and the fabric by compressing; and cutting a shoe insole shape in a package in which the foam and the fabric are bonded.

A present invention related to a method for manufacturing a dot bonding shoe insole using an adhesive resin containing hydrophobic nano-silica, including: melting adhesive resin made of any one selected from thermoplastic polyurethane (TPU) or ethylene vinyl acetate (EVA) containing hydrophobic nano-silica in the range of 0.2 to 5 phr and applying to the surface of the transfer roller in which the intaglio dot pattern is formed in a mesh shape in the shape of the shoe insole; removing the adhesive resin applied other area than the intaglio dot pattern of the surface of the transfer roller; transferring the adhesive resin applied to the intaglio dot pattern of the surface of the transfer roller to either one of the foam or the fabric; bonding the foam and the fabric by compressing; and cutting a shoe insole shape in a package in which the foam and the fabric are bonded.

An adhesive article is described comprising a foamed adhesive layer and a non-foamed adhesive layer. The adhesive of each adhesive layer comprises a tetrahydrofurfuryl (meth)acrylate copolymer; an epoxy resin; a polyether polyol; and optionally a hydroxy-functional film-forming polymer. The adhesive may be used in structural and semi-structural bonding applications and is designed to fail cohesively.

An adhesive formulation is provided that is a waterborne bonding adhesive for adhering sheet membranes that may incorporate a solid plasticizer. The formulation is fast-curing and develops bond strength rapidly after application to a substrate as the adhesive dries, when the sheet membrane is mated to the substrate. The fast-curing characteristic is important to ensure the membrane is not displaced from the surface in windy exterior applications. The adhesive is formulated to form the bond between sheet membranes to substrates that illustratively include, steel, wood, concrete, roof boards, insulation, and fiberglass mat roof boards.

An adhesive formulation is provided that is a waterborne bonding adhesive for adhering sheet membranes that may incorporate a solid plasticizer. The formulation is fast-curing and develops bond strength rapidly after application to a substrate as the adhesive dries, when the sheet membrane is mated to the substrate. The fast-curing characteristic is important to ensure the membrane is not displaced from the surface in windy exterior applications. The adhesive is formulated to form the bond between sheet membranes to substrates that illustratively include, steel, wood, concrete, roof boards, insulation, and fiberglass mat roof boards.

A laminate for forming objects that include Sodium Polyacrylate includes an adhesive substrate and a layer of Sodium Polyacrylate powder. The adhesive substrate includes a first surface facing a first direction away from the substrate, a second surface facing a second direction away from the substrate, and a thickness defined by the distance between the first surface and the second surface. The Sodium Polyacrylate is adhered to at least one of the first and second surfaces.

Methods of bonding together substrates that do not require use of primers, mixing, fixturing, or autoclaving. These methods can include the steps of disposing an adhesive layer on a bonding surface of either substrate, the adhesive layer comprising a curable composition that is dimensionally stable at ambient conditions; either before or after disposing the adhesive layer on the bonding surface, irradiating the adhesive layer with ultraviolet radiation to initiate curing of the curable composition; placing one substrate so as to be bonded to the other substrate by the adhesive layer; and allowing the adhesive layer to cure.

According to various embodiments of the present disclosure, a composition includes about 5 to about 40 parts by weight of a solute copolymer component. The solute component optionally has one T.sub.g or T.sub.m of at least 25° C. The composition further includes about 60 to about 95 parts by weight of a solvent monomer. The solvent monomer component includes (meth)acrylate monomers and a multifunctional acrylate. The sum of the solute copolymer component and the solvent monomer component is 100 parts by weight. The composition further includes about 5 to about 100 parts of a plasticizer, relative to the 100 parts. The plasticizer component comprises at least one plasticizer comprising an acid group.

A sealant structure and a method of fabricating a display panel are provided. The sealant structure includes a plurality of adhesive strips, and the adhesive strips overlap end to end to form a closed loop. Ends of at least one of any two adjacent adhesive strips are provided with an overlap region, and a width of the overlap region is less than or equal to one third of a width of the adhesive strip provided with the overlap region.

The present invention relates to a thermoplastic hot melt film having excellent adhesive strength in which hydrophobic nanosilica is mixed. The resin composition contains nanosilica having a particle size of 1 to 100 nm and containing hydrophobic functional groups on its surface in the range of 0.1 to 5 phr (Parts per Hundred Resin), and the nanosilica forms nanosilica aggregates with an average size of the aggregates is within 100˜1200 nm. The thickness of the thermoplastic hot melt film is 0.02˜0.3 mm. The thermoplastic hot melt film of the present invention is mixed with nanosilica containing hydrophobic functional groups, lipophilic, on the surface to improve dispersibility, strengthen water resistance, and increase tensile strength. The material cost is reduced while securing one adhesive strength and excellent durability, and multi-press molding is possible, which has the effect of increasing energy saving and productivity.