The an adhesive composition characterized in that the kisstack, which is defined as the force measured when a sheet coated with the adhesive composition is instantaneously peeled off after being attached, is about 6 N/inch or higher. The composition not only has excellent loop tack but also exhibits high kisstack characteristics, and thus can be widely used for various substrates.

The an adhesive composition characterized in that the kisstack, which is defined as the force measured when a sheet coated with the adhesive composition is instantaneously peeled off after being attached, is about 6 N/inch or higher. The composition not only has excellent loop tack but also exhibits high kisstack characteristics, and thus can be widely used for various substrates.

Methods of bonding together substrates that do not require use of primers, mixing, fixturing, or autoclaving. These methods can include the steps of disposing an adhesive layer on a bonding surface of either substrate, the adhesive layer comprising a curable composition that is dimensionally stable at ambient conditions; either before or after disposing the adhesive layer on the bonding surface, irradiating the adhesive layer with ultraviolet radiation to initiate curing of the curable composition; placing one substrate so as to be bonded to the other substrate by the adhesive layer; and allowing the adhesive layer to cure.

An electrically conductive adhesive composition, free of metals and metal salts, includes an adhesive polymer component selected from polyethylene-vinyl acetate, polyolefin elastomers, polyvinyl butyral, poly(acrylic acid), polyacrylates and poly(methyl methacrylate) from 5% to 40% by weight, an electrically conductive component including acetylene or carbon black nanoparticles, carbon nanotubes, and flakes or plates of graphene or graphene derivatives from 60% to 95% by weight, percentages by weight of the adhesive polymer component and electrically conductive component, the electrically conductive component consisting of acetylene or carbon black nanoparticles from 15% to 45% by weight, carbon nanotubes from 5% to 25% by weight, and flakes or plates of graphene or graphene derivatives from 35% to 70% by weight, percentages by weight of the electrically conductive component, and a solvent compatible with the adhesive polymer component from 50% to 90% by weight of the electrically conductive adhesive composition.

An adhesive resin composition contains an ethylene-vinyl acetate copolymer (A) in which a content of a structural unit derived from vinyl acetate is 3% by mass or more and 18% by mass or less, and a melt mass flow rate (MFR, JIS K 7210:1999, 190° C., 2160 g load) is 5 g/10 min or more and 40 g/10 min or less, a tackifier resin (B), and an ethylene-vinyl acetate copolymer (C) having a viscosity of 15,000 mPa.Math.s or more and 300,000 mPa.Math.s or less measured at 18° C. using a Brookfield viscometer.

An adhesive resin composition contains an ethylene-vinyl acetate copolymer (A) in which a content of a structural unit derived from vinyl acetate is 3% by mass or more and 18% by mass or less, and a melt mass flow rate (MFR, JIS K 7210:1999, 190° C., 2160 g load) is 5 g/10 min or more and 40 g/10 min or less, a tackifier resin (B), and an ethylene-vinyl acetate copolymer (C) having a viscosity of 15,000 mPa.Math.s or more and 300,000 mPa.Math.s or less measured at 18° C. using a Brookfield viscometer.

A composition is described comprising semicrystalline polylactic acid polymer; polyvinyl acetate polymer having a glass transition temperature (Tg) of at least 25° C.; plasticizer; and optionally amorphous polylactic acid polymer. In another embodiment the composition further comprises nucleating agent. Also described are films comprising the composition as well as articles, such as a tape or sheet, comprising the film described herein and a layer of pressure sensitive adhesive disposed on the film.

A composition is described comprising semicrystalline polylactic acid polymer; polyvinyl acetate polymer having a glass transition temperature (Tg) of at least 25° C.; plasticizer; and optionally amorphous polylactic acid polymer. In another embodiment the composition further comprises nucleating agent. Also described are films comprising the composition as well as articles, such as a tape or sheet, comprising the film described herein and a layer of pressure sensitive adhesive disposed on the film.

A reworkable optically clear adhesive composition, a method for adjoining a light source to a light guide plate by applying a reworkable optically clear adhesive composition to the light guide plate, and a lighting device comprising a light source, a light guide plate and a reworkable optically clear adhesive film are described. The reworkable optically clear adhesive composition has a processing temperature of between about 50° C. and about 80° C. and comprises: from about 15 wt. % to about 40 wt. % hot melt adhesive; from about 20 wt. % to about 60 wt. % optical resin; and from about 10 wt. % to about 40 wt. % UV adhesive, wherein the weight percentage of each component is based on the total weight of the reworkable optically clear adhesive composition.

A reworkable optically clear adhesive composition, a method for adjoining a light source to a light guide plate by applying a reworkable optically clear adhesive composition to the light guide plate, and a lighting device comprising a light source, a light guide plate and a reworkable optically clear adhesive film are described. The reworkable optically clear adhesive composition has a processing temperature of between about 50° C. and about 80° C. and comprises: from about 15 wt. % to about 40 wt. % hot melt adhesive; from about 20 wt. % to about 60 wt. % optical resin; and from about 10 wt. % to about 40 wt. % UV adhesive, wherein the weight percentage of each component is based on the total weight of the reworkable optically clear adhesive composition.