A method for dielectrically heating foamable composition to foam and set the composition is described. In particular, radio frequency (RF) heating is used to heat the foamable composition to provide insulation in the manufacture of an article.

Disclosed is a method of producing a fabric product, the method comprising preparing an upper; preparing a lining fabric; layering a thermoplastic hot-melt film between the upper and the lining fabric for bonding the upper and the lining fabric; bonding a lining fabric to the upper, wherein the thermoplastic hot-melt film consists of the composition selected from the group consisting of thermoplastic polyurethane, ethylene vinyl acetate, polyamide and polyester compositions, wherein the thermoplastic hot-melt film further contains nanosilica, wherein a content of the nanosilica is 0.1 to 5.0 Parts per Hundred Resin (phr) and a size of the nanosilica is less than 100 nm.

The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.

An adhesive sheet includes cyclodextrin and a derivative polymer in which an alkyl group having a carbon number of 6 to 18 is introduced into a hydrophilic polymer, and at least a part of the alkyl group is in the form of inclusion with the cyclodextrin.

An adhesive sheet includes cyclodextrin and a derivative polymer in which an alkyl group having a carbon number of 6 to 18 is introduced into a hydrophilic polymer, and at least a part of the alkyl group is in the form of inclusion with the cyclodextrin.

The paper reinforced tapes and reinforcement elements of this invention have improved repulpability, recyclability, compostability and biodegradability. Further, these reinforcement elements and paper reinforced tapes, despite being predominately paper, unexpectedly provide excellent container reinforcement properties and further can be used as opening tapes, closing tapes, tear tapes and carrying handles.

A hotmelt adhesive composition includes a polymer produced from ethylene, one or more branched vinyl ester monomers, and optionally, vinyl acetate, and a tackifier. A method for producing the hotmelt adhesive composition includes adding a polymer produced from ethylene, one or more branched vinyl ester monomers, and optionally, vinyl acetate and a tackifier into a mixer, optionally adding wax and/or antioxidant into the mixer, and mixing the polymer and the tackifier, and the optional wax and/or antioxidant at a temperature in a range from 150° C. to 200° C. to form the hot melt adhesive composition. A method for bonding a substrate to a similar or dissimilar substrate includes applying the hotmelt adhesive composition to at least one substrate; and bonding the substrate and the hotmelt adhesive composition together. A multi-layer article comprises at least one layer of the hotmelt adhesive compositions and one or more substrate layers.

Curable compositions include a urethane (meth)acrylate oligomer having a number—average molecular weight of at least 6000 g/mol; at least one mono(meth)acrylate monomer; a multifunctional crosslinking monomer chosen from acrylate monomers, methacrylate monomers, or combinations thereof; and an ethylene-vinyl acetate grafted terpolymer. The mono(meth)acrylate monomers may include a first mono(meth)acrylate with Tg between 50° C. and 175° C. and a second mono(meth)acrylate with Tg between −50° C. and 30° C. The curable compositions may be applied onto a surface of a substrate then cured to form a low-tack adhesive layer on the surface. The curable compositions may be cured by exposure to visible radiation, UV radiation, LED radiation, laser radiation, electron-beam radiation, peroxide, accelerator, or heat. Methods for bonding substrates include contacting a second substrate to a tow-tack adhesive layer on a first substrate, then heating the low-tack adhesive layer to bond the substrates and form a laminate.

The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.

Methods of bonding together substrates that do not require use of primers, mixing, fixturing, or autoclaving. These methods can include the steps of disposing an adhesive layer on a bonding surface of either substrate, the adhesive layer comprising a curable composition that is dimensionally stable at ambient conditions; either before or after disposing the adhesive layer on the bonding surface, irradiating the adhesive layer with ultraviolet radiation to initiate curing of the curable composition; placing one substrate so as to be bonded to the other substrate by the adhesive layer; and allowing the adhesive layer to cure.