A continuous method of manufacturing adhesives is provided. The method includes obtaining an actinic radiation-polymerizable adhesive precursor composition disposed on a major surface of an actinic radiation-transparent substrate and irradiating a first portion of the actinic radiation-polymerizable adhesive precursor composition through the actinic radiation-transparent substrate for a first irradiation dosage. The method further includes moving the actinic radiation-transparent substrate and irradiating a second portion of the actinic radiation-polymerizable adhesive precursor composition through the actinic radiation-transparent substrate for a second irradiation dosage. Optionally, the method also includes irradiating a third portion of the actinic radiation-polymerizable adhesive precursor composition through the actinic radiation-transparent substrate prior to moving the substrate. The first irradiation dosage and the third irradiation dosage are often not the same, thereby forming an integral adhesive having a variable thickness in an axis normal to the actinic radiation-transparent substrate.

A problem is to provide a sheet having a pre-sintering layer, the thickness of which following sintering is such as to be capable of relieving stresses. Solution means relate to a sheet comprising a pre-sintering layer. Viscosity at 90° C. of the pre-sintering layer is not less than 0.27 MPa.Math.s. Thickness of the pre-sintering layer is 30 μm to 200 μm.

Provided is a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. Also provided is a method of producing the multi-layered anisotropic conductive adhesive.

Disclosed are a method of preparing an elastic pressure-sensitive adhesive tape and an elastic pressure-sensitive adhesive tape. Main components of the adhesive include a polyacrylate resin with a carbon-carbon double bond and a diluent monomer with a carbon-carbon double bond. A quasi-microcapsule powder component is adopted, wherein the shell material of the quasi-microcapsule powder selects a cellulose-based water soluble polymer, and the core material selects low boiling point alkane, wherein the preparation method combines UV curing, heating, and shell burst, to obtain an elastic adhesive layer, whereby to prepare a pressure-sensitive adhesive tape product. Compared with conventional elastic pressure-sensitive adhesive tapes, the preparing method as disclosed has a simple manufacturing process. The pressure-sensitive adhesive tape obtained from the disclosed preparing method overcomes the restrictions of conventional foam strips and provide good cushioning and compression properties without using foam as the carrier.

A method for manufacturing a semiconductor device according to an aspect of the present disclosure includes a step of preparing a dicing/die-bonding integrated film including an adhesive layer formed of a heat-curable resin composition having a melt viscosity of 3100 Pa.Math.s or higher at 120° C., a tacky adhesive layer, and a base material film; a step of sticking a surface on the adhesive layer side of the dicing/die-bonding integrated film and a semiconductor wafer together; a step of dicing the semiconductor wafer; a step of expanding the base material film and thereby obtaining adhesive-attached semiconductor elements; a step of picking up the adhesive-attached semiconductor element from the tacky adhesive layer; a step of laminating this semiconductor element to another semiconductor element, with the adhesive interposed therebetween; and a step of heat-curing the adhesive.

A composite cooling film including non-fluorinated organic polymeric layer, a metal layer disposed inwardly of the non-fluorinated organic polymeric layer, and an antisoiling, ultraviolet-absorbing hardcoat layer that is disposed outwardly of the non-fluorinated organic polymeric layer.

A touch sensor panel includes a base layer, a first adhesive layer having one side bonded to one side of the base layer and composed of a pressure-sensitive adhesive (PSA), an electrode layer having one side bonded to the other side of the first adhesive layer, a second adhesive layer having one side bonded to the other side of the electrode layer and composed of a pressure-sensitive adhesive (PSA), and a functional layer having one side bonded to the other side of the second adhesive layer.

Embodiments of the present invention are directed to a two-layer adhesive and methods of using the same to secure an electronic device to an organism. In a non-limiting embodiment of the invention, a surface of the organism is coated with a first adhesive layer (bottom layer). The first adhesive layer is cured and a surface of the cured first adhesive layer is coated with a second adhesive layer (top layer). An electronic device is positioned on the second adhesive layer prior to curing the second adhesive layer. The second adhesive layer is then cured, thereby embedding the electronic device within the second adhesive layer. The bottom layer and the top layer are selected such that the bottom layer releases upon exposure to a first solvent after a first duration and the top layer releases upon exposure to a second solvent after a second duration more than the first duration.

Embodiments provide methods of assembling an apparel product. The methods include applying a composition to a portion of a major component of the apparel product or a portion of a minor component of the apparel product. The portion of the minor component is coupled with the portion of the major component via the composition. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component with an adhesive. The composition is converted to the adhesive to form the apparel product. The adhesive includes a material having a boronate ester bond.

Peel-away tape includes a double-sided adhesive tape with a perforated design and a peel-away backing that includes liftable tabs to assist in the removal thereof. In an exemplary embodiment, the tape and peel-away backing is perforated on equidistant intervals. A small tab located at the center of each perforation extends over the perforation line which, when separated, extends outward where it can be grasped.