An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.

An encapsulant sheet suitable for encapsulating a light-emitting element in a self-luminous display, etc. A resin sheet having a polyolefin as a base resin, wherein the resin sheet is created as an encapsulant sheet for a self-luminous display or for a direct backlight, the melt viscosity of the encapsulant sheet, at a shear velocity of 2.43×10 sec-1 and measured at a temperature of 120° C., being 5.0×103 poise to 1.0×105 poise inclusive.

This adhesive film for a metal terminal is interposed between a metal terminal electrically connected to an electrode of a battery element and a wrapping material sealing the battery element and is provided with at least one resin layer having a polyolefin backbone. When the adhesive film for the metal terminal is measured with a differential scanning calorimeter, a melting peak is observed within the range of 120° C. to 156° C.

The present invention relates to an adhesive composition containing a base polymer and a water-absorbing material, wherein Young's modulus when an adhesive layer is formed is 450 kPa or more, an adhesive layer comprising the adhesive composition, and an adhesive sheet including the adhesive layer.

The present invention relates to an adhesive composition containing a base polymer and a water-absorbing material, wherein Young's modulus when an adhesive layer is formed is 450 kPa or more, an adhesive layer comprising the adhesive composition, and an adhesive sheet including the adhesive layer.

The present disclosure provides a resin composition, and a protective sheet of a display device that includes the resin composition. The resin composition includes alkyl acrylate, polyethylene glycol alkyl ether methacrylate, hydroxyalkyl acrylate, perfluorinated alkyl (meth)acrylate, and silicone (meth)acrylate.

A pressure sensitive adhesive particle includes a pressure sensitive adhesive base particle that contains a styrene resin containing styrene and a vinyl monomer other than styrene as polymerization components, and a (meth)acrylate resin containing at least two (meth)acrylates as polymerization components, in which a mass ratio of the (meth)acrylates relative to a total of polymerization components of the (meth)acrylate resin is 90 mass % or more; and an external additive. The pressure sensitive adhesive particle has a surface having an arithmetic average roughness Ra within a range of 0.005 μm to 0.100 μm. The pressure sensitive adhesive particle has at least two glass transition temperatures, and the difference between the lowest glass transition temperature and the highest glass transition temperature among the glass transition temperatures of the pressure sensitive adhesive particle is 30° C. or more.

The present invention relates to a hot-melt adhesive resin film which does not cause peeling between respective layers, has an excellent adhesive force, and has strong adherability even in severe durability evaluation, to various planar or film-like adherends such as metal, glass, and plastic, and a production method thereof. More particularly, the present invention relates to a hot-melt adhesive resin film including a first adhesive layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second adhesive layer, which are laminated in this order, in which the first adhesive layer and the second adhesive layer comprise an acid-modified polyolefin resin, and a production method thereof.

The present invention relates to a hot-melt adhesive resin film which does not cause peeling between respective layers, has an excellent adhesive force, and has strong adherability even in severe durability evaluation, to various planar or film-like adherends such as metal, glass, and plastic, and a production method thereof. More particularly, the present invention relates to a hot-melt adhesive resin film including a first adhesive layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second adhesive layer, which are laminated in this order, in which the first adhesive layer and the second adhesive layer comprise an acid-modified polyolefin resin, and a production method thereof.

A dielectric welding film capable of tightly welding adherends of a polyolefin resin or the like within a relatively short time through dielectric heating, and a bonding method using the dielectric welding film are provided. The dielectric welding film is configured to bond a plurality of adherends of the same material or different materials through dielectric heating, the dielectric welding film containing (A) a polyolefin resin and (B) a dielectric filler whose mean particle size measured in accordance with JIS Z 8819-2 (2001) is in a range from 1 to 30 μm, a thickness of the dielectric welding film ranging from 10 to 2,000 μm. The method uses the dielectric welding film.