The present invention is an assembly layer for a flexible device. Within a temperature range of between about −30° C. to about 90° C., the assembly layer has a shear storage modulus at a frequency of 1 Hz that does not exceed about 2 MPa, a shear creep compliance (J) of at least about 6×10.sup.−6 1/Pa measured at 5 seconds with an applied shear stress between about 50 kPa and about 500 kPa, and a strain recovery of at least about 50% at at least one point of applied shear stress within the range of about 5 kPa to about 500 kPa within about 1 minute after removing the applied shear stress. The assembly layer includes at least one of a polyisoprene, a polybutadiene, an olefin block copolymer, a polyisobutylene, and high alkyl polyolefin.

A hydrogenated styrenic block copolymer (HSBC) is disclosed comprising, prior to hydrogenation, a polymer block A of at least one vinyl aromatic monomer, a polymer block B of at least one conjugated diene, and a copolymer block C of at least one vinyl aromatic monomer and 1,3-butadiene monomer. The HSBC has a total vinyl aromatic content of 15 to 60 wt. % and an aromatic blockiness index of 20 to 80%. The viscoelastic properties of HSBC show a value of a tan δ peak height of 0.7 to 2, a tan δ peak temperature of −40 to 25° C., and a temperature width value (in ° C.) at half the tan δ peak height of 17 to 40. The HSBC provides improved mechanical properties and can be used in preparation of adhesives and protective films applications.

A masking film includes an adhesion layer that includes a blend of hydrogenated styrene block copolymer and low density polyethylene. The adhesion layer has an outer adhesion surface configured to contact a substrate. The outer adhesion surface has an average surface roughness Ra of between 100 nm and 350 nm, and an average spacing between peaks Sm of between 20 μm and 150 μm. The masking film also includes a release layer on a side of the adhesion layer opposite the outer adhesion surface.

A masking film includes an adhesion layer that includes a blend of hydrogenated styrene block copolymer and low density polyethylene. The adhesion layer has an outer adhesion surface configured to contact a substrate. The outer adhesion surface has an average surface roughness Ra of between 100 nm and 350 nm, and an average spacing between peaks Sm of between 20 μm and 150 μm. The masking film also includes a release layer on a side of the adhesion layer opposite the outer adhesion surface.

Provided is a back grinding adhesive sheet which can adequately protect protrusions provided to a semiconductor wafer, and with which back grinding can be adequately performed. The present invention provides a back grinding adhesive sheet for a semiconductor wafer having protrusions, the back grinding adhesive sheet comprising a non-adhesive cushion layer, and an adhesive layer provided on the cushion layer. The adhesive layer has an opening with a smaller diameter than the diameter of the semiconductor wafer, and the outer edge of the semiconductor wafer is adhered to the adhesive layer such that the protrusions on the semiconductor wafer are positioned inside the opening. The protrusions are protected by the cushion layer when the semiconductor wafer is in the state of being adhered to the adhesive layer. The adhesive sheet satisfies at least one of the following conditions (1)-(2). (1) When the cushion layer is cut out using the dumbbell from JISZ1702 and is stretched 25% at a gauge length of 40 mm and a tensile speed of 300 mm/min, the tensile stress is 2-30N/10 mm. (2) The cushion layer is formed from a thermoplastic resin that has a melt flow rate (JISK7210, 125° C./10.0 kg load) of 0.2-30 g/10 min, and a melting point of 60-110° C.

1) An HMPSA composition comprising from 20% to 50% of a composition of styrene block copolymers; from 35% to 65% of tackifying resin; and from 7% to 25%, as plasticizer, of a vegetable oil is chosen from sunflower, rapeseed, linseed and soybean oil. 2) A multilayer system comprising: an adhesive layer (A) consisting of the composition 1); a support layer (B) adjacent to the adhesive layer (A); and a nonstick protective layer (C), adjacent to the adhesive layer (A). 2) The use of said system for the manufacture of self-adhesive articles.

A tackifier composition comprising at least one thermoplastic hydrocarbon resin and an antioxidant composition is provided; wherein a portion of the volatile organic compounds in the thermoplastic hydrocarbon resin has been removed; wherein the antioxidant composition comprises at least one primary antioxidant and at least one secondary antioxidant; and wherein the levels of individual volatile organic compound monitored in the tackifier composition are less than about 0.5 ppm as measured by GC/MS headspace analysis. Processes for producing the tackifier composition are also provided as well as adhesives comprising the tackifier compositions.

The present invention provides a polymer composition for fibers or non-woven fabrics, comprising a vinyl aromatic based copolymer and 0 to 30 wt % of an olefin based polymer based on the total weight of the polymer composition. The vinyl aromatic copolymer is represented by a formula A1-B-A2, wherein block A1 and block A2 are the same or different vinyl aromatic blocks, block A1 or block A2 having 3,800 to 4,800 of a peak molecular weight, and block B is a hydrogenated conjugated diene block. A vinyl structure content of a conjugated diene monomer content in the vinyl aromatic based copolymer is from 32 wt % to 50 wt %; and a melt flow index (MFI) of the vinyl aromatic based copolymer is 20 g/10 min˜60 g/10 min (230° C., 2.16 kg). The present invention also provides the fibers or the non-woven fabrics made from the polymer composition.

Hot melt adhesives comprising (i) styrene butadiene copolymer, (ii) olefin block copolymer (OBC), and (iii) water white hydrogenated hydrocarbon resin are described. The adhesives exhibit high optical clarity and are relatively clear over a wide range of temperatures. The adhesives also exhibit good adhesion at cold temperatures. Also described are laminates of the adhesive with polymeric films, such as adhesive labels that can be used in labeling containers. In addition, various goods such as containers labeled using the adhesives are described.

A double-sided pressure-sensitive adhesive strip is provided that includes a pressure-sensitive adhesive strip comprising two opposing strip surfaces configured for bonding. At least one conductive component connects the two opposing strip surfaces configured for bonding in the z-direction. Also provided is a component and/or a composite, which is bonded with the conductive pressure-sensitive adhesive strip. Further, uses are provided of the conductive pressure-sensitive adhesive strip.