The present invention relates to a method for manufacturing a wet glued wood article, as well as a wet glued article obtainable by said method and also uses of a wet glued article, wherein the method comprises the following steps: a) providing two actively never-dried or slightly dried wood pieces comprising at least one surface each which has a superficial layer having a thickness of least 2-3 wood cells; b) drying said surfaces of said wood pieces so that the moisture content of said superficial layer is below the fibre saturation point, providing a dried surface on each of the said wood pieces; c) applying a gluing agent on said dried surface of one of the wood pieces, thus providing a glue surface; d) bringing the dried surfaces together so that said glue surface touches the dried surface on the other wood piece, thus providing a wet glued wood article.

The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.

An aqueous adhesive composition comprises a thermosetting resin based on: at least one aromatic compound bearing at least two functions, one of these functions being a hydroxymethyl function and the other being an aldehyde function or a hydroxymethyl function, the aromatic compound comprising at least one aromatic ring; and at least aromatic polyphenol comprising at least one aromatic ring bearing at least two hydroxyl functions in the meta position relative to one another, the two positions ortho to at least one of the hydroxyl functions being unsubstituted. Such an adhesive composition may especially be used to join elements made of wood; it constitutes an advantageous alternative to the use of a formaldehyde-based phenolic resin adhesive.

This invention provides a PSA sheet comprising a PSA layer. The PSA layer has a storage modulus at 25 C., G(25 C.), of 0.15 MPa or greater and a storage modulus at 85 C., G(85 C.), of 0.02 MPa or greater. The PSA sheet satisfies at least one of the following features: having a 180 peel strength of 8 N/20 mm or greater when determined within one minute after press-bonded at 23 C. at a press-bonding load of 0.1 kg or a 180 peel strength of 8 N/20 mm or greater when determined within one minute after press-bonded at 40 C. at 0.05 MPa for 3 seconds.

Provided is an inkjet adhesive which is applied using an inkjet device, wherein the adhesive can suppress generation of voids in the adhesive layer and, after bonding, can enhance adhesiveness, moisture-resistant adhesion reliability, and cooling/heating cycle reliability. An inkjet adhesive according to the present invention comprises a photocurable compound, a photo-radical initiator, a thermosetting compound having one or more cyclic ether groups or cyclic thioether groups, and a compound capable of reacting with the thermosetting compound, and the compound capable of reacting with the thermosetting compound contains aromatic amine.

A low formaldehyde-emission urea-formaldehyde adhesive with superior mechanical properties and high durability, useful for manufacturing wood boards or panels comprising: (a) Urea (U) and Formaldehyde (F) in molar ratio F/U from 0.9 to 1.2; (b) 1.3-1.7% w/w of cellulose nanofibrils (NFC) with a width between 45-60 nm; and (c) 0.4-0.6% w/w copper nanoparticles having a size between 30 to 100 nm, and its method of preparation.

The present disclosure generally relates to adhesive compositions, adhesive articles including the adhesive compositions, methods of making the adhesive compositions and articles, and methods of using the adhesive compositions and articles. The adhesive compositions of the present disclosure include a thermoplastic phenolic resin made from the reaction of (1) alkyl phenol (e.g., butyl- or octyl- or -nonyl) and formaldehyde; or (2) alkyl phenol (e.g., butyl- or octyl-) and acetaldehyde; or (3) alkyl phenol (e.g., butyl- or octyl-) and acetylene. The present disclosure also generally relates to adhesive articles including these adhesive compositions. The inventors of the present disclosure found that such adhesive articles exhibit excellent adhesion to architectural coatings with including low or no VOCs, deep base formulations, and/or formulations including primer in various conditions, including, for example, high humidity.

The present disclosure generally relates to adhesive compositions, adhesive articles including the adhesive compositions, methods of making the adhesive compositions and articles, and methods of using the adhesive compositions and articles. The adhesive compositions of the present disclosure include a thermoplastic phenolic resin made from the reaction of (1) alkyl phenol (e.g., butyl- or octyl- or -nonyl) and formaldehyde; or (2) alkyl phenol (e.g., butyl- or octyl-) and acetaldehyde; or (3) alkyl phenol (e.g., butyl- or octyl-) and acetylene. The present disclosure also generally relates to adhesive articles including these adhesive compositions. The inventors of the present disclosure found that such adhesive articles exhibit excellent adhesion to architectural coatings with including low or no VOCs, deep base formulations, and/or formulations including primer in various conditions, including, for example, high humidity.

Provided is an inkjet adhesive which is applied using an inkjet device, wherein the adhesive can suppress generation of voids in the adhesive layer and, after bonding, can enhance adhesiveness, moisture-resistant adhesion reliability, and cooling/heating cycle reliability. An inkjet adhesive according to the present invention comprises a photocurable compound, a photo-radical initiator, a thermosetting compound having one or more cyclic ether groups or cyclic thioether groups, and a compound capable of reacting with the thermosetting compound, and the compound capable of reacting with the thermosetting compound contains aromatic amine.

Provided is a masking tape for a shot peening process, including: a substrate having a first surface and a second surface; and a pressure-sensitive adhesive layer disposed on the first surface of the substrate. The masking tape has a breaking strength of 55 N/15 mm or more and exhibits an impact absorption rate of 20% or more in a falling ball impact test. Further, the masking tape has a displacement distance of 2 mm or less after 1 h from an initial position in a holding power test at 40 C. which is performed by applying a load of 500 g.