A wafer laminate has an adhesive layer (2) sandwiched between a support (1) and a wafer (3), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer (2) includes a light-shielding resin layer (2a), an epoxy-containing siloxane skeleton resin layer (2b), and a non-silicone thermoplastic resin layer (2c).

This disclosure relates to a film for a tire inner liner film that may exhibit uniform excellent physical properties over all directions when applied to a tire, and may secure excellent durability and fatigue resistance in a tire manufacturing process or in an automobile running process, a method for manufacturing the film for a tire inner liner, a pneumatic tire using the tire inner liner film, and a method for manufacturing the pneumatic tire using the tire inner liner film.

Provided is an inkjet adhesive which is applied using an inkjet device, wherein the adhesive can suppress generation of voids in the adhesive layer and, after bonding, can reduce an outgas at the time of being exposed to high temperatures, and can enhance moisture-resistant reliability. An inkjet adhesive according to the present invention comprises a first photocurable compound having one (meth)acrylol group, a second photocurable compound having two or more (meth)acrylol groups, a photo-radical initiator, a thermosetting compound having one or more cyclic ether groups or cyclic thioether groups, and a compound capable of reacting with the thermosetting compound, and the first photocurable compound contains alkyl (meth)acrylate having 8 to 21 carbon atoms.

The present invention relates to an inflation film and a method for manufacturing the inflation film, wherein the inflation film includes a base film, including: a polyamide-based resin; a copolymer containing polyamide-based segments and poly-ether-based segments; and an olefin-based polymer compound, and has a small variation in physical properties between a machine direction (MD) and a transverse direction (TD) of the film.

A curable adhesive that is modified to allow spray application and polymerization seamlessly during the process of epoxy resin vacuum infusion.

A hot-melt adhesive resin composition includes a modified polyolefin in which a functional group is introduced into a polyolefin, a solid phenol resin, and a crosslinking agent, wherein the content of the modified polyolefin is 10 parts by mass or more and 40 parts by mass or less, based on 100 parts by mass of the total of the modified polyolefin and the solid phenol resin, and the modified polyolefin and the crosslinking agent are mixed so that a functional group possessed by the crosslinking agent is more than 1.0 equivalent and 5.0 equivalents or less, based on 1.0 equivalent of a functional group possessed by the modified polyolefin.

A hot-melt adhesive resin composition includes a modified polyolefin in which a functional group is introduced into a polyolefin, a solid phenol resin, and a crosslinking agent, wherein the content of the modified polyolefin is 10 parts by mass or more and 40 parts by mass or less, based on 100 parts by mass of the total of the modified polyolefin and the solid phenol resin, and the modified polyolefin and the crosslinking agent are mixed so that a functional group possessed by the crosslinking agent is more than 1.0 equivalent and 5.0 equivalents or less, based on 1.0 equivalent of a functional group possessed by the modified polyolefin.

Provided is a film adhesive which is preferably used as a NCF, void-free, has excellent electrical connectivity and its high reliability, does not develop cracks easily, and has high surface flatness. Also provided is a semiconductor device in which the film adhesive according to the present invention is used as an NCF during the manufacture of the semiconductor device. The film adhesive according to the present invention contains (A) an epoxy resin; (B) a bisphenol F type phenoxy resin; (C) a phenol resin-based curing agent; (D) a modified imidazole compound; (E) a silica filler; (F) oxyquinoline; and (G) a butadiene-acrylonitrile-methacrylic acid copolymer. The content of component (A) is 19.3 to 33.8 parts by mass. The content of component (B) is 7.5 to 9.1 parts by mass. The content of component (D) is 1.915 to 5 parts by mass. The content of component (E) is 30 to 60 parts by mass. The content of component (F) is 2.5 to 10 parts by mass. The liquid epoxy resin of component (A) contains a phenol novolac type epoxy resin and a liquid epoxy resin. The ratio of phenol novolac type epoxy resin to the epoxy resin of component (A) is not less than 46%. The equivalent ratio of component (C) relative to component (A) is 0.25 to 0.75.

Provided is a film adhesive which is preferably used as a NCF, void-free, has excellent electrical connectivity and its high reliability, does not develop cracks easily, and has high surface flatness. Also provided is a semiconductor device in which the film adhesive according to the present invention is used as an NCF during the manufacture of the semiconductor device. The film adhesive according to the present invention contains (A) an epoxy resin; (B) a bisphenol F type phenoxy resin; (C) a phenol resin-based curing agent; (D) a modified imidazole compound; (E) a silica filler; (F) oxyquinoline; and (G) a butadiene-acrylonitrile-methacrylic acid copolymer. The content of component (A) is 19.3 to 33.8 parts by mass. The content of component (B) is 7.5 to 9.1 parts by mass. The content of component (D) is 1.915 to 5 parts by mass. The content of component (E) is 30 to 60 parts by mass. The content of component (F) is 2.5 to 10 parts by mass. The liquid epoxy resin of component (A) contains a phenol novolac type epoxy resin and a liquid epoxy resin. The ratio of phenol novolac type epoxy resin to the epoxy resin of component (A) is not less than 46%. The equivalent ratio of component (C) relative to component (A) is 0.25 to 0.75.

The present invention relates to a method for producing a binder composition, wherein the method comprises the following steps: (i) forming an aqueous composition comprising reactant components including lignin molecules of 11-60 lignin units, lignin molecules of 1-10 lignin units, polymerizable substance and crosslinking agent in the presence of a catalyst; and (ii) cooking the composition at a temperature of 60-95 C. for polymerizing the reactant components until a binder composition with a predetermined viscosity value is formed.