A hot-melt adhesive resin composition includes a modified polyolefin in which a functional group is introduced into a polyolefin, a solid phenol resin, and a crosslinking agent, wherein the content of the modified polyolefin is 10 parts by mass or more and 40 parts by mass or less, based on 100 parts by mass of the total of the modified polyolefin and the solid phenol resin, and the modified polyolefin and the crosslinking agent are mixed so that a functional group possessed by the crosslinking agent is more than 1.0 equivalent and 5.0 equivalents or less, based on 1.0 equivalent of a functional group possessed by the modified polyolefin.

An embodiment of the present invention provides an electrical steel sheet including: an upper adhesive layer positioned on an upper surface of an electrical steel sheet; and an lower adhesive layer positioned on a lower surface of the electrical steel sheet, wherein the upper adhesive layer has a pencil hardness of F or lower, and the lower adhesive layer has a pencil hardness of H or higher.

Provided is an inkjet adhesive which is applied using an inkjet device, wherein the adhesive can suppress generation of voids in the adhesive layer and, after bonding, can reduce an outgas at the time of being exposed to high temperatures, and can enhance moisture-resistant reliability. An inkjet adhesive according to the present invention comprises a first photocurable compound having one (meth)acrylol group, a second photocurable compound having two or more (meth)acrylol groups, a photo-radical initiator, a thermosetting compound having one or more cyclic ether groups or cyclic thioether groups, and a compound capable of reacting with the thermosetting compound, and the first photocurable compound contains alkyl (meth)acrylate having 8 to 21 carbon atoms.

The present invention relates to an adhesive film for a semiconductor that can more easily bury unevenness such as through wires of a semiconductor substrate or a wire attached to a semiconductor chip and the like, and yet can be applied to various cutting methods without specific limitations to realize excellent cuttability, thus improving reliability and efficiency of a semiconductor packaging process.

The present invention relates to an adhesive composition for a semiconductor including: a thermoplastic resin having a glass transition temperature of 10 C. to 20 C.; a curing agent containing a phenol resin having a softening point of 70 C. or more; a solid epoxy resin; and a liquid epoxy resin, wherein a weight ratio of the total contents of the solid epoxy resin and the liquid epoxy resin to the thermoplastic resin is 1.6 to 2.6, an adhesive film for a semiconductor including the adhesive composition for a semiconductor, a dicing die bonding film including an adhesive layer including the adhesive composition for a semiconductor, and a method for dicing a semiconductor wafer using the dicing die bonding film.

The present invention relates to a pneumatic tire having a non-spliced film innerliner comprised of a plurality of film layers where said film layers are of varied film moduli physical properties.

The invention relates to a textile bonding composition comprising a salt of lignosulfonate, an aldehyde hardener thereof, and an elastomer latex. The lignosulfonate salt may be sodium, potassium, magnesium, ammonium, or calcium lignosulfonate. The invention also relates to the use of such a composition for imparting adhesion properties to a reinforcement textile, with regard to a rubber, a reinforcement textile, in particular yarn, cord or textile structure, at least partially coated and/or impregnated with this composition, and a part made of rubber or comprising a rubber, in which the rubber comprises at least one reinforcement textile, on the surface and/or integrated inside the rubber.

The present invention is intended to provide a manufacturing method of a protective cover having a sensor holder part that has high adhesion strength between a metallic component and a plastic component and maintains high reliability over a long period of time.

The manufacturing method includes: a step of applying a thermoset resin adhesive to a surface of a metallic component 1A including a joining surface relative to a plastic component; a drying and solidification step of evaporating a solvent contained in the adhesive under a temperature condition at a temperature lower than a temperature at which the adhesive starts cross-linking reaction; and an injection molding step of placing the metallic component 1A as an insert in dies 18 and 19 and injecting a molten plastic material from a gate 20 into cavities.

An adhesive composition is described, which includes an acrylic polymer, an epoxy thermosetting resin having an unsaturated hydrocarbon group, and a thermosetting agent. The adhesive composition achieves high reliability in a package in which a semiconductor chip of reduced thickness is mounted even when exposed to severe reflow conditions. An adhesive sheet having an adhesive layer that includes the above adhesive composition is also described.

A die-bonding layer formation film to be used for fixing a processed product to an adherend, includes an adhesive layer, wherein, the storage elastic modulus has a local minimum value at a temperature within a range of 80 C. to 150 C., wherein the adhesive layer has a shear strength to a peeling strength test substrate of 20 N/2 mm.sup. or more and 50 N/2 mm.sup. or less, wherein the shear strength is measured after the processed product is placed above the peeling strength test substrate via the die-bonding layer formation film and the die-bonding layer formation film on the peeling strength test substrate is heated at 175 C. for 1 hour and then further maintained under an environment of 250 C. for 30 seconds. Bubbles (voids) are unlikely to grow at the boundary between the adhesive layer and an adherend even when subjected to thermal history.