The present invention relates to a film for semiconductor device production, which includes: a separator; and a plurality of adhesive layer-attached dicing tapes each including a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator, in which the separator has a cut formed along the outer periphery of the dicing tape, and the depth of the cut is at most ⅔ of the thickness of the separator.

The present invention relates to a film for a tire inner liner including a base film layer including a copolymer or a mixture of a polyamide-based resin and a polyether-based resin, and an adhesive layer including a resorcinol-formalin-latex (RFL)-based adhesive, and having low shrinkage rate when elongated at a high temperature and then cooled to room temperature, and a method for manufacturing the same.

An embodiment of the present invention provides an electrical steel sheet including: an upper adhesive layer positioned on an upper surface of an electrical steel sheet; and an lower adhesive layer positioned on a lower surface of the electrical steel sheet, wherein the upper adhesive layer has a pencil hardness of F or lower, and the lower adhesive layer has a pencil hardness of H or higher.

The electrically conductive adhesive film comprises a metal particle (Q), a resin (M), and a prescribed organophosphorus compound (A), the resin (M) comprises a thermosetting resin (M1), and the metal particle (Q) has an average particle size (d50) of 20 μm or less and comprise 10% by mass or more of a first metal particle (Q1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.

The electrically conductive adhesive agent composition comprises a metal particle (Q) and a prescribed organophosphorus compound (A), and the metal particle (Q) comprises a first metal particle (Q1) made of a single metal selected from the group of copper, nickel, aluminum and tin or an alloy comprising two or more metals selected from said group.

A process of heat shrinking an article is provided. The process includes shaping a thermoplastic vulcanizate (TPV) into an article, the TPV having: a partially vulcanized rubber dispersed in a continuous thermoplastic phase, wherein more than 5 wt % of the rubber is extractable in boiling xylene, and wherein the thermoplastic phase comprises a thermoplastic resin having a Tm>110° C. and a propylene-based elastomer (PBE) having a Tm<110° C.; and heating the article to a temperature between about 100° C. and 250° C. to shrink the article.

The electrically conductive adhesive film comprises a metal particle (Q), a resin (M), and at least one of a prescribed organic phosphine (A) and a prescribed sulfide-based compound (B), the resin (M) comprises a thermosetting resin (M1), and has a storage elastic modulus at 1 Hz measured in a state after sintering of 20 GPa or less and a thermal weight loss ratio when heated for 2 hours at 250° C. under a nitrogen atmosphere of less than 1%.

A conductive adhesive and a bonding method of circuit board are provided. The conductive adhesive includes a substrate and an insulating region formed on a surface of the substrate and a conductive region. The insulating region includes a plurality of insulating retaining walls arranged along a same direction and in intervals. The conductive region includes a plurality of conductive adhesive bodies and the conductive adhesive bodies are filled in gaps between the adjacent insulating retaining walls.

Disclosed herein are an antimicrobial reinforced floor and a method for preparing the same. In the method, a substrate and an impregnated paper impregnated with an inorganic antimicrobial agent and an organic antimicrobial agent are subjected to hot press forming to produce the antimicrobial reinforced floor.

The embodiments described herein generally relate to methods and chemical compositions of phenolic epoxy systems. In one embodiment, a composition comprising a phenolic epoxy resin system includes an epoxy resin component and an alkoxylated phenol-aldehyde novolac resin.