The present invention relates to a thermally activatable adhesive composition for use in a method for producing a stack of metal sheets from glued together sheet metal components, the use of the adhesive composition in a method for producing a stack of metal sheets from glued together sheet metal components, the method for producing a stack of metal sheets from glued together sheet metal components, a sheet metal component coated with the adhesive composition, and a stator or rotor core containing one or more of such sheet metal components.

To provide an epoxy adhesive having a high glass transition temperature and low viscosity, and having excellent adhesive properties, as well as to provide an automotive member that uses this adhesive, and a manufacturing method thereof. One embodiment provides an epoxy adhesive containing (A) epoxy, (B) a core-shell toughening agent, and (C) a latent curing agent that does not include an aniline backbone, wherein the epoxy (A) includes at least 50 mass % of a trifunctional or higher liquid epoxy. Another embodiment provides an automotive member including a first adherend, a second adherend, and a cured epoxy adhesive provided between the first adherend and the second adherend and cured to bond the first adherend and the second adherend.

A thermosetting adhesive composition and thermosetting adhesive sheet capable of obtaining stable conductivity even in high-temperature environments or high-temperature/high-humidity environments are provided. The thermosetting adhesive sheet comprises an acrylic copolymer obtained by copolymerizing 55 to 80 wt % of alkyl (meth)acrylate, 15 to 30 wt % of acrylonitrile, and 5 to 15 wt % of glycidyl methacrylate; an epoxy resin; an epoxy resin curing agent; and a dendritic conductive filler having a tap density of 1.0 to 1.8 g/cm.sup.3. Thereby, thermal expansion after curing is suppressed, and electrical contacts of the conductive filler are increased, allowing stable conductivity to be obtained even in high-temperature environments or high-temperature/high-humidity environments.

A thermosetting adhesive composition and thermosetting adhesive sheet capable of obtaining stable conductivity even in high-temperature environments or high-temperature/high-humidity environments are provided. The thermosetting adhesive sheet comprises an acrylic copolymer obtained by copolymerizing 55 to 80 wt % of alkyl (meth)acrylate, 15 to 30 wt % of acrylonitrile, and 5 to 15 wt % of glycidyl methacrylate; an epoxy resin; an epoxy resin curing agent; and a dendritic conductive filler having a tap density of 1.0 to 1.8 g/cm.sup.3. Thereby, thermal expansion after curing is suppressed, and electrical contacts of the conductive filler are increased, allowing stable conductivity to be obtained even in high-temperature environments or high-temperature/high-humidity environments.

The present invention relates to an adhesive resin composition including a styrene-ethylene-butylene-styrene copolymer with a specific chemical structure, an epoxy resin, an acid anhydride compound, and a curing catalyst, an adhesive film obtained from the resin composition, and a flexible metal laminate including the adhesive film.

The present invention relates to an adhesive resin composition including a styrene-ethylene-butylene-styrene copolymer with a specific chemical structure, an epoxy resin, an acid anhydride compound, and a curing catalyst, an adhesive film obtained from the resin composition, and a flexible metal laminate including the adhesive film.

The invention provides an anisotropic conductive adhesive film and an electronic device. The anisotropic conductive adhesive film comprises a base film and microcapsule structures, wherein the microcapsule structures are set on the base film, and each of the microcapsule structures comprises a metallic conductive particle, a normal-temperature curable macromolecular polymer coated on the outside of the metallic conductive particle and a microcapsule wall coated on the outside of the macromolecular polymer, and an adhesive glue is adhered to the external surface of the microcapsule wall. When in use, the microcapsule structure is destroyed by pressurizing, the conductive particle and the normal-temperature curable macromolecular polymer contained inside the microcapsule wall leak out, and the normal-temperature curable macromolecular polymer leaked out is cured, so that electrical conduction and connection of a microelectronic apparatus can be achieved at normal temperature via the anisotropic conductive adhesive film.

Provided is an adhesive film for a display, in which the adhesive film has a high absorption capacity in a near infrared region and maintains a high transmittance in a visible region, thereby guaranteeing visibility.

An adhesive having water vapour barrier properties, comprising an adhesive base composed of at least one reactive resin, at least one elastomer and optionally at least one tackifying resin, and optionally a solvent, is particularly suitable as a barrier adhesive when it comprises at least one multifunctional oligomeric alkoxysiloxane, said oligomeric alkoxysiloxane containing more than one polymerizable group and more than one alkoxy group.

An adhesive having water vapour barrier properties, comprising an adhesive base composed of at least one reactive resin, at least one elastomer and optionally at least one tackifying resin, and optionally a solvent, is particularly suitable as a barrier adhesive when it comprises at least one multifunctional oligomeric alkoxysiloxane, said oligomeric alkoxysiloxane containing more than one polymerizable group and more than one alkoxy group.