An adhesive composition, which exhibits excellent adhesion to base films made from polyimide resins and the like or copper foils, as well as superior electrical properties, and a laminate having an adhesive layer, which is low in warpage when the adhesive layer is in the B stage, and which is excellent in storage stability of the laminate, are provided. The adhesive composition includes a modified polyolefin-based resin and an epoxy resin, in which the modified polyolefin-based resin is a resin resulting from graft-modification of an unmodified olefin resin with a modifying agent containing an α,β-unsaturated carboxylic acid or derivative thereof, wherein the content of the modified polyolefin-based resin is 50 parts by mass or more relative to 100 parts by mass of the solid content of the adhesive composition; the content of the epoxy resin is from 1 to 20 parts by mass relative to 100 parts by mass of the modified polyolefin-based resin; and the dielectric constant of a cured body of the adhesive is less than 2.5 as measured at a frequency of 1 GHz.

A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.

This invention provides a coating composition that contains an aromatic adhesion promoter. Containers and other articles comprising the coatings and methods of making such containers and other articles are also provided. The invention further provides compositions including the adhesion promoter, which have utility in a variety of coating end uses, including, for example, valve and pipe coatings.

A double-sided adhesive tape includes a substrate, and a thermosetting resin layer laminated on both sides of the substrate. The thermosetting resin layer contains a rubber-modified epoxy resin and a latent curing agent. The thermosetting resin layer has a flowtester viscosity at 40° C. and under a load of 20 Kg of 1000 Pa.Math.s or more and 7000 Pa.Math.s or less.

A barrier adhesive for the encapsulation of an (opto)electronic arrangement comprising an adhesive base composed of at least one reactive resin having at least one activatable group, at least one polymer, especially an elastomer, optionally at least one tackifying resin, where the adhesive base has a water vapour permeation rate after the activation of the reactive resin of less than 100 g/m.sup.2d, preferably of less than 50 g/m.sup.2d, especially less than 15 g/m.sup.2d, a transparent molecularly dispersed getter material and optionally a solvent, wherein the getter material is at least one silane having at least one alkoxy group and at least one activatable group.

A barrier adhesive for the encapsulation of an (opto)electronic arrangement comprising an adhesive base composed of at least one reactive resin having at least one activatable group, at least one polymer, especially an elastomer, optionally at least one tackifying resin, where the adhesive base has a water vapour permeation rate after the activation of the reactive resin of less than 100 g/m.sup.2d, preferably of less than 50 g/m.sup.2d, especially less than 15 g/m.sup.2d, a transparent molecularly dispersed getter material and optionally a solvent, wherein the getter material is at least one silane having at least one alkoxy group and at least one activatable group.

Composite materials and methods of producing the same are provided. In some embodiments, the composite materials can comprise a polymer substrate, an intermediary material, such as a metal or oxide, mechanically attached onto the polymer substrate, and an elastomer bonded to the polymer substrate on the side of the polymer substrate comprising the intermediary materials. The elastomer can be bonded to the polymer substrate irreversibly, where the elastomer and the polymer substrate cannot be separated at their interface without breaking either the elastomer or the polymer substrate. In some embodiments, a primer and/or an epoxy can also be used. Uses of material sputtering or sputtered materials are also provided to bond a parylene substrate and silicone elastomer, or to enhance the relative strength of the bonding between the two. In addition, composite materials, and the use thereof, involving a parylene substrate, an elastomer receptacle, and liquid silicone are provided.

The aim is to provide an adhesive tape that effectively protects an electronic construction from permeants, especially water, and that at the same time has good gap-filling qualities. To solve this problem an adhesive tape is proposed that has in the following order:—a carrier layer without barrier effect at least towards water and with a WVTR of at least 1 g/(m.sup.2*d) (38° C., 90% relative humidity, 50 μm layer thickness); —a layer comprising at least one getter material capable of sorbing at least water; —a water barrier ply; and—a layer of pressure-sensitive adhesive, where the carrier layer bears an outward-facing release layer and/or the layer of pressure-sensitive adhesive is lined with a release liner which has a release layer lying on the layer of pressure-sensitive adhesive.

Provided are an adhesive resin laminate having an excellent adhesive force to two adherends, a laminate in which this adhesive resin laminate is laminated with two adherends, and a method of producing them. An adhesive resin laminate having at least a first adhesive layer and a second adhesive layer, in which the first adhesive layer includes a base resin and a crosslinking agent, the base resin is a modified polyolefin resin, the crosslinking agent is an epoxy-based compound, the second adhesive layer includes a polyolefin-based resin, and when an adhesion initiation temperature of the first adhesive layer is set to T1, and an adhesion initiation temperature of the second adhesive layer is set to T2, T2 is higher than T1 by 30° C. or more.

Provided are an adhesive resin laminate having an excellent adhesive force to two adherends, a laminate in which this adhesive resin laminate is laminated with two adherends, and a method of producing them. An adhesive resin laminate having at least a first adhesive layer and a second adhesive layer, in which the first adhesive layer includes a base resin and a crosslinking agent, the base resin is a modified polyolefin resin, the crosslinking agent is an epoxy-based compound, the second adhesive layer includes a polyolefin-based resin, and when an adhesion initiation temperature of the first adhesive layer is set to T1, and an adhesion initiation temperature of the second adhesive layer is set to T2, T2 is higher than T1 by 30° C. or more.