A thermosetting sheet according to the present invention includes: a thermosetting resin; a thermoplastic resin; and conductive particles. The conductive particles includes silver particles having an average particle size D.sub.50 of 0.01 μm or more and 10 μm or less, and having a circularity in cross section of 0.7 or more. The thermosetting sheet has a viscosity at 100° C. of 20 kPa.Math.s or more and 3000 kPa.Math.s or less.

A thermosetting sheet according to the present invention includes: a thermosetting resin; a thermoplastic resin; and conductive particles. The conductive particles includes silver particles having an average particle size D.sub.50 of 0.01 μm or more and 10 μm or less, and having a circularity in cross section of 0.7 or more. The thermosetting sheet has a viscosity at 100° C. of 20 kPa.Math.s or more and 3000 kPa.Math.s or less.

The present application relates to a curable composition. The curable composition of the present application exhibits excellent adhesion ability and liquid crystal orientation ability simultaneously before or after curing, so that it can be effectively applied to various optical uses.

A temporary protective film for temporarily protecting a surface of a semiconductor substrate that is opposite to a surface on which a semiconductor element is mounted. The temporary protective film includes an adhesive layer containing acrylic rubber. When the temporary protective film is attached to a copper alloy plate at 25° C. so that the adhesive layer is in contact with the copper alloy plate, and the obtained laminate is sequentially heated at 180° C. for 60 minutes and at 200° C. for 60 minutes, a 90-degree peeling strength of the temporary protective film against the copper alloy plate is 5 N/m or more at 25° C. before heating the laminate and 150 N/m or less at 50° C. after heating the laminate.

The present disclosure is directed to a base film having a chemically converted polyimide, a particulate polyimide matting agent and a low conductivity carbon black. The particulate polyimide matting agent is present in an amount from 1.6 to 9 weight percent of the base film.

A vehicular camera includes an imager printed circuit board and a lens having a plurality of optical elements. The lens is held in optical alignment with an imager at the imager printed circuit board via a dual cure one-part, filled adhesive that in its uncured state has an epoxy resin. The adhesive is both UV-curable and thermal-curable. A flexible electrical ribbon cable electrically connects circuitry of the imager printed circuit board with additional circuitry of the vehicular camera. Image data captured by the imager is provided to the additional circuitry of the vehicular camera via the flexible electrical ribbon cable. The additional circuitry includes at least a processor for processing image data captured by the imager and provided to the additional circuitry via the flexible electrical ribbon cable. The vehicular camera, when installed and used in a vehicle, captures image data for use by a vision system of the vehicle.

The present disclosure relates to a non-conductive film comprising an adhesive layer containing a low molecular weight epoxy resin; and a tacky layer containing a predetermined composition, and a method for manufacturing a semiconductor laminate using the non-conductive film.

The present disclosure provides a method for bonding parts, comprising the following steps (a) Providing a two-component adhesive composition precursor, comprising a first part (A) comprising at least one epoxy curing agent and preferably at least one first dye; a second part (B) comprising at least one second dye different from the at least one first dye and at least one epoxy resin; (b) Mixing part (A) and part (B) of the two-component adhesive composition precursor so as to obtain an adhesive composition; (c) Applying the adhesive composition onto a first part; (d) Applying a second part onto the adhesive composition applied to the first part; and then performing a first curing step at a first temperature, wherein the adhesive composition undergoes a first colour change; or (e) Performing a first curing step at a first temperature, wherein the adhesive composition undergoes a first colour change, and then applying a second part onto the adhesive composition applied to the first part; (f) Perform a second curing step at a second temperature higher than the first temperature, thereby fully curing the adhesive composition so as to obtain a structural adhesive bond between the first and second parts, wherein the adhesive composition undergoes a second colour change.

The teachings herein are directed at solid polymeric adhesive compositions for adhering metal components, methods for compounding the polymeric adhesive compositions, articles including a component having the polymeric adhesive composition, methods for producing articles including curing a solid adhesive, and articles including the cured adhesive. Preferred solid polymeric adhesive compositions include a plurality of one or more epoxy resins and one or more polysulfones. In one preferred aspect, the teachings are directed at a stator ring (e.g., for a hybrid motor) including the polymeric adhesive composition for adhering components to a ring.

The electrically conductive adhesive film comprises a metal particle (Q), a resin (M), and a prescribed organophosphorus compound (A), the resin (M) comprises a thermosetting resin (M1), and the metal particle (Q) has an average particle size (d50) of 20 μm or less and comprise 10% by mass or more of a first metal particle (Q1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.