Curable pressure sensitive adhesive tapes comprise: a) a pressure sensitive adhesive polymer; b) particles of encapsulated first epoxy resin (microcapsules) mixed into the pressure sensitive adhesive polymer; and c) a first epoxy curative. In some embodiments, the first epoxy curative is blended into the pressure sensitive adhesive. In other embodiments, the first epoxy curative is the pressure sensitive adhesive polymer. In some embodiments, the first epoxy curative may be an adduct of a second epoxy curative and a second epoxy resin in a ratio of at least 2:1 second epoxy curative to second epoxy resin. The particles of encapsulated first epoxy resin comprise a core of first epoxy resin within a shell comprising an organic polymer, and optionally a layer of oil-in-water Pickering emulsifier particles borne on a surface of the shells. Typically, the tape may be cured to form a structural bond between adherends.

An underfill film for semiconductor packages and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film includes an adhesive layer in which a melt viscosity and an onset temperature are adjusted to a predetermined range such that production efficiency may be improved by simplifying packaging process of the semiconductor packages. Also the underfill film and the manufacturing process may improve connection reliability of the package.

The present disclosure relates to transparent flame-retardant coating compositions and labels including layers comprising the same. The coating composition comprises a high-hydroxyl value polymer, a crosslinker, and a flame-retardant additive comprising a phosphinate compound. The coating composition may be coated on a substrate such as a label. The coating composition forms a layer that advantageously has flame-retardant properties and is optically clear.

The invention relates to a curable adhesive sheet which has an adhesive layer formed from an adhesive composition containing an epoxy resin, a latent curing agent and a gelling agent and in which the latent curing agent has a reaction initiation temperature of 45° C. or higher and 120° C. or lower.

The invention relates to a curable adhesive sheet which has an adhesive layer formed from an adhesive composition containing an epoxy resin, a latent curing agent and a gelling agent and in which the latent curing agent has a reaction initiation temperature of 45° C. or higher and 120° C. or lower.

A method of bonding two shaped bodies S1 and S2 including the steps of: a) providing shaped body S1; b) arranging shaped body S2 wherein shaped body S1, forming cavity between two shaped bodies, c) introducing one-component thermosetting epoxy resin compositions into cavity, wherein one-component thermosetting epoxy resin composition is one-component thermosetting epoxy resin composition including: at least one epoxy resin A having average of more than one epoxy group per molecule; at least one curing agent B for epoxy resins activated by elevated temperature; at least one polyester polyol PP obtainable by reaction of at least one diol having structure HO—(CH.sub.2).sub.x′—OH the value of x′=2-10, and —at least one dicarboxylic acid having structure HOOC—(CH.sub.2).sub.y′—COOH and derivatives of dicarboxylic acid, value of y′=8-18, and wherein proportion of polyester polyol PP is 1.5% to 20% by weight, based on total weight of one-component thermosetting epoxy resin composition.

The present disclosure relates generally to the field of adhesives, more specifically to the field of structural adhesive tapes, in particular for use in bonding metal parts. The present disclosure also relates to a method of bonding two parts and to a composite article. The present disclosure is further directed to the use of a structural adhesive tape for industrial applications, such as construction and automotive applications, in particular for body-in-white bonding applications in the automotive industry.

Disclosed herein are curable compositions comprising an epoxide-functional polymer and a curing agent that reacts with the epoxide-functional polymer that is activatable by an external energy source. The epoxide-functional polymer may be a solid a solid epoxide-functional polyurethane comprising a di-isocyanate. Also disclosed are articles comprising one of the compositions in an at least partially cured state positioned between first and second substrates. Also disclosed are methods of forming an adhesive on a substrate.

Methods of bonding together substrates that do not require use of primers, mixing, fixturing, or autoclaving. These methods can include the steps of disposing an adhesive layer on a bonding surface of either substrate, the adhesive layer comprising a curable composition that is dimensionally stable at ambient conditions; either before or after disposing the adhesive layer on the bonding surface, irradiating the adhesive layer with ultraviolet radiation to initiate curing of the curable composition; placing one substrate so as to be bonded to the other substrate by the adhesive layer; and allowing the adhesive layer to cure.

Disclosed is a coating composition comprising a first component and a second component. The first component comprises a diluent and a carbodiimide present in an amount of no more than 50 percent by weight based on total weight of the coating composition. The second component comprises a curing agent that chemically reacts with the carbodiimide, the curing agent comprising an active hydrogen-containing compound. The coating composition may be an adhesive composition or a sealant composition. Also disclosed is a method for treating a substrate comprising contacting at least a portion of a surface of the substrate with a composition of the present invention. Also disclosed is a substrate comprising a surface at least partially coated with a layer formed from a composition of the present invention. Also disclosed is an article comprising a first substrate and a second substrate and a composition of the present invention positioned between the first and second substrates.