Provided in the present invention is a thermosetting sheet including a thermosetting resin, a thermoplastic resin, a volatile component, and conductive particles. The thermosetting sheet has an arithmetic average roughness Ra of 0.1 μm or more and 1.2 μm or less that is measured in a state before being cured.

A laminate structure comprising a tape and a molded component is provided. The tape comprises a substrate having a first surface and an opposing second surface, wherein a first adhesive coating is disposed on the first surface of the substrate. The molded component is positioned adjacent and bonded to the first adhesive coating of the tape, wherein the molded component includes a polymer composition that contains a liquid crystalline polymer. The peel strength between the tape and the molded component is about 0.55 pounds-force per inch more as determined in accordance with ASTM D3167-10 (2017).

A curable resin composition includes: a first epoxy resin having a polyoxyalkylene chain; a second epoxy resin different from the first epoxy resin; a thermoplastic resin having a weight average molecular weight of 300,000 or less, and having a reactive functional group; at least one selected from the group consisting of a curing agent and a curing accelerator; and an inorganic filler.

The present disclosure relates to compositions derived from bioreachable molecules, such as amino acids or hydroxy acids. In particular, the composition can be a monomer, a polymer, or a copolymer derived from an amino acid dimer or a hydroxy acid dimer.

A reworkable optically clear adhesive composition, a method for adjoining a light source to a light guide plate by applying a reworkable optically clear adhesive composition to the light guide plate, and a lighting device comprising a light source, a light guide plate and a reworkable optically clear adhesive film are described. The reworkable optically clear adhesive composition has a processing temperature of between about 50° C. and about 80° C. and comprises: from about 15 wt. % to about 40 wt. % hot melt adhesive; from about 20 wt. % to about 60 wt. % optical resin; and from about 10 wt. % to about 40 wt. % UV adhesive, wherein the weight percentage of each component is based on the total weight of the reworkable optically clear adhesive composition.

A thermally reworkable adhesive includes at least one di-epoxide, at least one diamine that is reactive with the at least one di-epoxide, at least one additive that is miscible, but not reactive, with the at least one di-epoxide and/or the at least one diamine. Reaction of the at least one di-epoxide and the at least one diamine forms a crosslinked polymer network and the at least one additive offsets the stoichiometry of the crosslinked polymer network by 5-50%. The offset crosslinked polymer network forms the thermally reworkable adhesive that once cured, at a temperature in the range of 20-200° C., can be de-bonded from a device to which it is attached at a temperature in the range of 50-200° C.

An anisotropic conductive film has first and second connection layers formed on a first layer surface. The first connection layer is a photopolymerized resin layer, and the second is thermo- or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer. The first connection layer has fine projections and recesses in a surface. An anisotropic conductive film of another aspect has first, second, and third connection layers layered in sequence. The first layer formed of photo-radically polymerized resin. The second and third layers are formed of thermo-cationically or thermo-anionically polymerizable resin, photo-cationically or photo-anionically polymerizable resin, thermo-radically polymerizable resin, or photo-radically polymerizable resin. On a surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer.

The electrically conductive adhesive agent composition comprises a metal particle (Q) and a prescribed organophosphorus compound (A), and the metal particle (Q) comprises a first metal particle (Q1) made of a single metal selected from the group of copper, nickel, aluminum and tin or an alloy comprising two or more metals selected from said group.

A member includes a base material and a conductive layer. The conductive layer conducts heat or electricity. The conductive layer includes a conductive portion and a non-conductive portion. The conductive portion conducts heat or electricity. The conductive portion is disposed on at least one of an upper surface or a lower surface of the non-conductive portion and on a side surface of the non-conductive portion.

Embodiments of the present application disclose an adhesive, a die attach film and a preparation method therefor, and relate to the technical field of chip packaging. The adhesive includes epoxy resin, phenoxy resin, an indene oligomer, filler and a curing agent; and 20-60 parts of the epoxy resin, 20-30 parts of the phenoxy resin, 5-10 parts of the indene oligomer, 15-30 parts of the filler and 1-5 parts of the curing agent are provided in parts by mass. The present application further provides the die attach film and the preparation method therefor. In the adhesive provided by the present application, the epoxy resin, the phenoxy resin and the indene oligomer are used as curable substrates to improve a thermal stress obtained after the adhesive is cured, so that the die attach film prepared therefrom is not easy to warp in a temperature change process.