Patent classifications
C09J2463/00
Segmented film adhesive, method of making the adhesive and method of applying the adhesive to a non-planar surface
A method of applying an adhesive to a non-planar surface. The method includes providing a segmented film adhesive. The segmented film adhesive comprises: (i) a liner; and (ii) an adhesive layer on the liner, the adhesive layer comprising a plurality of contiguous, discrete adhesive segments. The segmented film adhesive is positioned on a non-planar surface of a first adherend so that a first portion of the discrete adhesive segments are in contact with the non-planar surface and a second portion of the discrete adhesive segments are not in contact with the non-planar surface. The liner is removed from the non-planar surface, wherein only the first portion of the discrete adhesive segments remain on the non-planar surface of the first adherend.
Electrical steel sheet adhesive coating composition, electrical steel sheet product, and manufacturing method therefor
An electrical steel sheet adhesive coating composition according to an exemplary embodiment of the present invention includes, based on 100 wt % of the total solids: a resin at 20 to 40 wt % and having an average particle diameter of 10 to 300 nm; an inorganic nanoparticle at 10 to 35 wt % bonded with the resin; a metal phosphoric acid salt at 10 to 30 wt %; and phosphoric acid at 10 to 40 wt %. An electrical steel sheet product according to an exemplary embodiment of the present invention includes a plurality of electrical steel sheets; and an adhesive layer disposed between the plurality of electrical steel sheets, wherein the adhesive layer includes a metal of one or more kinds among Al, Mg, Ca, Co, Zn, Zr, and Fe at 0.5 to 30 wt %, N at 0.1 to 10 wt %, C at 0.1 to 5 wt %, P at 1 to 30 wt %, a metal of one or more kinds among Si and Ti at 10 to 30 wt %, and a balance of O.
EPOXY COMPOSITION CONTAINING COPOLYAMIDE AND BLOCK COPOLYMER WITH POLYAMIDE AND POLYETHER BLOCKS
A composition that toughens and impact modifies epoxy resin based compositions comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks. The disclosure also relates to epoxy resin compositions containing the composition comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks and films, adhesives, foamable compositions and foamed compositions containing such a composition.
Vehicle centric logistics management
The instant disclosure describes vehicle centric logistics management systems and methods that leverage the unique positions of shipping vehicles to improve supply chain performance. In some example, vehicles are equipped with improved wireless sensing technologies that facilitate the ability to manage inventories in realtime. In addition, the pervasive presence of shipping vehicles across supply chains enables vehicle centric collection and analysis of local data to improve realtime decision-making.
REACTIVE ADHESIVE FILM WITH GOOD HEAT-AND-HUMIDITY RESISTANCE, IN PARTICULAR FOR BONDING POLYAMIDE
Reactive adhesive film for bonding various materials, including plastic to metal, the adhesive film comprising (a) a polymeric film-forming matrix, (b) at least one epoxide-functionalized (meth)acrylate or vinyl monomer and (c) a reagent selected from an initiator, in particular a free-radical initiator, or an activator. Further disclosed are reactive adhesive film systems comprising two reactive adhesive films. Methods for producing reactive adhesive films, and methods are also disclosed.
UV CURABLE ADHESIVE COMPOSITION AND ADHESIVE FILM, ADHESIVE TAPE, AND BONDING COMPONENT COMPRISING THEREOF
Disclosed are a UV curable adhesive composition, an adhesive tape comprising the UV curable adhesive composition, an adhesive film formed by UV curing of the adhesive composition, and a corresponding bonding member. The UV curable adhesive composition and the adhesive tape comprising the UV curable adhesive composition have a hybrid system of reactive polyacrylate/epoxy resin/core-shell rubber particles/hydroxy-containing compound, wherein a cationic photoinitiator is used to initiate curing of the epoxy a resin.
Adhesive sheet
In an embodiment, an adhesive sheet has an expandable adhesive layer 2 on one side or both sides of a base 1, wherein the expandable adhesive layer 2 contains an epoxy resin including a polyfunctional epoxy resin, a phenol resin as a curing agent, an imidazole-based compound as a curing catalyst, and a temperature-sensitive foaming agent. The adhesive sheet has properties in good balance, such as fast curability, heat resistance, and adhesiveness, and also excellent properties such as thermal conductivity attributed to a good filling property.
Adhesive sheet
In an embodiment, an adhesive sheet has an expandable adhesive layer 2 on one side or both sides of a base 1, wherein the expandable adhesive layer 2 contains an epoxy resin including a polyfunctional epoxy resin, a phenol resin as a curing agent, an imidazole-based compound as a curing catalyst, and a temperature-sensitive foaming agent. The adhesive sheet has properties in good balance, such as fast curability, heat resistance, and adhesiveness, and also excellent properties such as thermal conductivity attributed to a good filling property.
METHOD FOR PREPARING AN ADHESIVE TAPE OR MOLDING MASS
A polymerizable composition which may be used as an adhesive mass in a method for preparing an adhesive tape or as molding mass in a method for preparing molded articles is provided. The polymerizable composition contains: A) a thermal cationic initiator, or B) a combination of a cationic photoinitiator and a thermal free-radical initiator for inducing the polymerization of the cationically polymerizable monomers in such an amount that the heat energy released during polymerization is sufficient for cleaving the thermal initiator. The adhesive mass is curable via a local impulse a) of thermal energy orb) of thermal energy and/or radiation energy through frontal polymerization; or the molding mass is initially prepared by mixing all components and then molded into the desired shape, whereafter its frontal polymerization is induced by a local impulse a) of thermal energy and/or b) of radiation energy in order to prepare a cured molded article.
Adhesive strain sensing pods with improved protection
An adhesive strain sensing pod includes at least one strain sensor, electronics for electrically sensing at least one strain signal from the at least one strain sensor, and a sensor adhesive for adhering the strain sensor to a surface of a structural element. The pod may have a protective case for protecting the strain sensor and the electronics and for transferring at least part of a force, pressing the pod against the surface, to press the strain sensor against the surface. The sensor adhesive may be a liquid adhesive contained in a fragile pouch that ruptures when the pod is forced against the surface, or may be a thermally activated adhesive film that is activated to bond the strain sensor to the surface. A protective film may protect the sensor adhesive prior to installation of the pod and is removed prior to installation of the pod on the surface.